Table 2.6 Bmp Specification - Samsung OfficeServ 7070 System Description

Option board
The BMP (MAIN part) has three (3) slots where option boards can be mounted.
A trunk board (PRM) or subscriber connection board (4DLM, 4SL2) is mounted into LOC1
(slot 1) and LOC2 (slot 2). A Modem board is mounted into LOC3 (slot 3).
Specification
The specification of BMP board is as follows:
Categories
CPU
SDRAM (For Program and Data)
NAND (For Program, Db/Voice, Backup)
Flash ROM (For Booting)
Time Switch
RTC
EEPROM (Save IP/MAC Address)
LAN
UART
Etc.
Subscriber Port
Option
© SAMSUNG Electronics Co., Ltd.
OfficeServ 7070 System Description/Ed.02OfficeServ 7070 System Description/Ed.02

Table 2.6 BMP Specification

Processor
System Clock
Package
Capacity
Width of Data Bus
Capacity
Width of Data Bus
Capacity
Width of Data Bus
Device
Basic Switch
Width of Data Bus
Device
Back UP Time
Interface
Capacity
Interface
Physical Layer
Speed
Port
Type
Speed
External MOH Port
External Broadcast
Dry Contact
DLI
LOC1
LOC2
LOC3
Names
M82511 (Dual Core)
375 MHz
484 Ball FPBGA
128 MB (32 MB × 4 EA)
32 Bit
1 GB (K9G8G08U0A)
8 bit
0.5 MB (SST39VF040)
8 bit
STC9604
256 × 256 Channel
8 Bit
RTC8564
10 Days
I2C
2 Kbit (AT24C02N)
I2C
IEEE802.3
100Mbps Only
1 EA
Async, 8Bit + 1Start + 1Stop
38.4Kbps
1 EA
1 EA
2 EA
4 Port
PRM, 4DLM, 4SL2
4DLM, 4SL2
-
Standards
2-7