Freescale Semiconductor
Application Note
Qorivva MPC57xx e200zx Core
Differences
c55 process migration
by: Randy Dees
1 Introduction
Freescale's Qorivva MPC57xx devices are the latest
generation of Automotive microcontrollers (MCU) based on
the Power Architecture™ core. This generation is
manufactured in a 55 nm wafer processing flow (c55).
Previous generations of devices were manufactured in larger
geometry technologies.
In addition to being manufactured in a smaller technology, the
e200zx cores used in the c55 devices have been updated for
higher speeds, lower power, and better die size utilization
(equating to lower cost for the core itself). Many features of
the cores are selectable by the definition requirements of the
individual devices that use these cores. This document outlines
major differences in the e200zx cores based on the options
selected for devices in the MPC57xx family. While it lists the
differences and gives a basic summary of the feature, this
document does not fully explain the feature in detail. The core
reference manuals should be consulted for additional
information.
The table below shows the different technologies, as well as
the different types of cores that are used by the different
families of devices, starting with the first fully integrated
Power Architecture core with embedded nonvolatile flash
memory and peripherals (MPC555). There was an earlier
Automotive Power Architecture, the MPC505/MPC509,
however, it did not have integrated flash or peripherals.
© 2013 Freescale Semiconductor, Inc.
Document Number:AN4802
Contents
1
Introduction................................................................1
1.1
2
cores...........................................................................3
2.1
2.2
options........................................... ................ 5
2.3
A
Rev 0, 10/2013
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