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Philips BGY2016 Datasheet

Philips uhf amplifier module datasheet

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DATA SHEET
handbook, halfpage
BGY2016
UHF amplifier module
Product specification
Supersedes data of 2000 Jan 04
DISCRETE SEMICONDUCTORS
M3D167
2000 Oct 17

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Summary of Contents for Philips BGY2016

  • Page 1 DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage BGY2016 UHF amplifier module Product specification Supersedes data of 2000 Jan 04 M3D167 2000 Oct 17...
  • Page 2 Base station transmitting equipment operating in the 1805 to 1990 MHz frequency band. DESCRIPTION The BGY2016 is a three-stage UHF amplifier module in a SOT365A package with a plastic cap. It consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic AlN substrate.
  • Page 3 Philips Semiconductors UHF amplifier module CHARACTERISTICS = 25 C; V = 5 V; V = 26 V; P SYMBOL PARAMETER frequency supply current supply current load power power gain in band gain variation gain expansion efficiency second harmonic third harmonic...
  • Page 4: Application Information

    Philips Semiconductors UHF amplifier module APPLICATION INFORMATION handbook, full pagewidth List of components (See Figs 2 and 3) COMPONENT C1, C2 electrolytic capacitor C3, C4 multilayer ceramic chip capacitor C5, C6 multilayer ceramic chip capacitor C7, C8 multilayer ceramic chip capacitor...
  • Page 5 Philips Semiconductors UHF amplifier module handbook, full pagewidth Dimensions in mm. 2000 Oct 17 output V S1 V S2 input Fig.3 Printed-circuit board component layout. Product specification BGY2016 MGM862...
  • Page 6: Mounting Recommendations

    Philips Semiconductors UHF amplifier module MOUNTING RECOMMENDATIONS To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and loose particles.
  • Page 7: Package Outline

    Philips Semiconductors UHF amplifier module PACKAGE OUTLINE Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads DIMENSIONS (mm are the original dimensions) UNIT 0.56 30.1 18.6 0.46 29.9 18.4 OUTLINE VERSION SOT365A 2000 Oct 17 scale 3.25...
  • Page 8 This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
  • Page 9 Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES 2000 Oct 17...
  • Page 10 Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES 2000 Oct 17...
  • Page 11 Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES 2000 Oct 17...
  • Page 12 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM.