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Philips BGY1916 Datasheet
Philips BGY1916 Datasheet

Philips BGY1916 Datasheet

Philips uhf amplifier module datasheet

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DATA SHEET
handbook, halfpage
BGY1916
UHF amplifier module
Product specification
Supersedes data of 1998 May 27
DISCRETE SEMICONDUCTORS
M3D167
2000 Oct 17

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Summary of Contents for Philips BGY1916

  • Page 1 DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage BGY1916 UHF amplifier module Product specification Supersedes data of 1998 May 27 M3D167 2000 Oct 17...
  • Page 2 Base station transmitting equipment operating in the 1930 to 1990 MHz frequency band. DESCRIPTION The BGY1916 is a three-stage UHF amplifier module in a SOT365A package with a plastic cap. It consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic AlN substrate.
  • Page 3 Philips Semiconductors UHF amplifier module CHARACTERISTICS = 25 C; V = 5 V; V = 26 V; P SYMBOL PARAMETER frequency supply current supply current load power power gain efficiency second harmonic third harmonic VSWR input VSWR stability reverse intermodulation...
  • Page 4: Application Information

    Philips Semiconductors UHF amplifier module APPLICATION INFORMATION handbook, full pagewidth List of components (see Figs 4 and 5) COMPONENT DESCRIPTION C1, C2 electrolytic capacitor C3, C4 multilayer ceramic chip capacitor C5, C6 multilayer ceramic chip capacitor C7, C8 multilayer ceramic chip capacitor...
  • Page 5 Philips Semiconductors UHF amplifier module handbook, full pagewidth Dimensions in mm. 2000 Oct 17 output V S1 V S2 input Fig.5 Printed-circuit board component layout. Product specification BGY1916 MGM862...
  • Page 6: Mounting Recommendations

    Philips Semiconductors UHF amplifier module MOUNTING RECOMMENDATIONS To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and loose particles.
  • Page 7: Package Outline

    Philips Semiconductors UHF amplifier module PACKAGE OUTLINE Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads DIMENSIONS (mm are the original dimensions) UNIT 0.56 30.1 18.6 0.46 29.9 18.4 OUTLINE VERSION SOT365A 2000 Oct 17 scale 3.25...
  • Page 8 This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
  • Page 9 Philips Semiconductors Product specification UHF amplifier module BGY1916 NOTES 2000 Oct 17...
  • Page 10 Philips Semiconductors Product specification UHF amplifier module BGY1916 NOTES 2000 Oct 17...
  • Page 11 Philips Semiconductors Product specification UHF amplifier module BGY1916 NOTES 2000 Oct 17...
  • Page 12 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM.