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Abstract This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
DIMMs ..............................43 Processor air baffle ..........................44 Heatsink ..............................45 Processor ............................... 47 System board ............................51 Re-entering the server serial number and product ID ................57 Personality board ............................ 58 HP Trusted Platform Module ........................59 Contents 3...
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Troubleshooting resources ........................60 Diagnostic tools .......................... 61 HP product QuickSpecs ..........................61 HP Insight Diagnostics ..........................61 HP Insight Diagnostics survey functionality ..................61 HP Insight Remote Support software ......................61 HP ROM-Based Setup Utility ........................62 Integrated Management Log ........................62 USB support and functionality ........................
HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
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HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
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La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
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Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
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HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 11...
Illustrated parts catalog Server components Item Description Spare part Customer self number repair (on page 5) Level 2 power boards with brackets a) Right node 669753-001 Mandatory b) Left node* 669752-001 Mandatory Personality boards — a) Right node 669755-001 Mandatory Illustrated parts catalog 15...
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GPU interposer board 739872-001 Mandatory Drive backplane board 671914-001 Optional FlexibleLOM x24 riser board 700573-001 Mandatory HP SFF, 2.5 inch, hot-plug drive — — SATA solid state drives — — a) 32 GB, 1.5G, ETY solid state drive 461332-001 Mandatory...
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Item Description Spare part Customer self number repair (on page 5) f) 200 GB, MLC solid state drive 657281-001 Mandatory g) 400 GB, SLC solid state drive 653962-001 Mandatory h) 400 GB, SLC solid state drive 657279-001 Mandatory i) 400 GB, MLC solid state drive 653963-001 Mandatory j) 400 GB, MLC solid state drive...
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Item Description Spare part Customer self number repair (on page 5) a) 2 GB DIMM, PC3L-10600E, 256 M x8 664694-001 Mandatory b) 4 GB DIMM, PC3L-10600R, 256 M x8 664695-001 Mandatory c) 4 GB DIMM, PC3L-10600R, 512 M x4 664688-001 Mandatory d) 4 GB DIMM, PC3L-12800R, 512 M x4 664689-001...
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627801-001 Mandatory e) 1 TB, 6G, MDL hard drive 632143-001 Mandatory * Not shown **All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption. Illustrated parts catalog 19...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 61) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.
• Remove the server from the chassis (on page 24). If the rack environment, cabling configuration, or the server location in the rack creates unstable conditions, then remove the server from the chassis. • Remove the SFF hot-plug drive cage (on page 25). •...
Use the tray handle to pull the server out of the chassis. Place the server on a flat, level work surface. Remove the SFF hot-plug drive cage Back up all server data on the drive. Power down the server (on page 24). Disconnect all peripheral cables from the server.
Remove the front GPU cage Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the front GPU cage. Remove the interposer board assembly Power down the server (on page 24). Disconnect all peripheral cables from the server.
Remove the front GPU bracket Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the front GPU cage (on page 26). Remove the interposer board assembly (on page 26). Remove the front GPU bracket.
Lift the cage to remove it from the tray. Remove the FlexibleLOM riser cage Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the SFF hot-plug drive cage (on page 25). Remove the front GPU cage (on page 26).
Remove the rear GPU cage Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the rear GPU cage. Drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
To remove the component: Back up all server data on the drive. Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page 71). Remove the drive. To replace the component, reverse the removal procedure. Hot-plug drive cage backplane To remove the component: Back up all server data on the drive.
To replace the component, reverse the removal procedure. SFF quick-release drive To remove the component: Back up all server data on the drive. Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). If removing a drive from the front GPU cage, remove the front GPU cage (on page 26).
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Remove the front GPU bracket (on page 27). Remove all drives from the drive cage. Disconnect the drive cage cable assembly: Disconnect the quick-release cage Mini-SAS cable from the system board. Disconnect the quick-release drive power cables from the personality board. —...
• Front GPU • Rear GPU To replace the component, reverse the removal procedure. Level 2 power board To remove the component: Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). If removing from the left node, remove the interposer board ("Remove the interposer board assembly"...
Remove the level 2 power board. To replace the component, reverse the removal procedure. Rear GPU riser board To remove the component: Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the interposer board assembly (on page 26).
Remove the rear GPU riser board. To replace the component, reverse the removal procedure. x32 riser board To remove the component: Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the interposer board assembly (on page 26).
System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. Flash-backed write cache procedures The following types of procedures are provided for the FBWC option: • Removal and replacement of failed components: Removing the cache module ("FBWC module"...
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Disconnect the capacitor pack cable from the cache module. Remove the cache module: Cache module on system board Cache module on storage controller To replace the component, reverse the removal procedure. Removal and replacement procedures 38...
FBWC capacitor pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. To remove the component: Power down the server (on page 24).
To replace the component, reverse the removal procedure. FBWC capacitor pack holder CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.
To replace the component, reverse the removal procedure. Front GPU/PCI riser board To remove the component: CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. Power down the server (on page 24).
Remove the interposer board from the metal bracket. To replace the component, reverse the removal procedure. FlexibleLOM riser board To remove the component: Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the SFF hot-plug drive cage (on page 25).
Remove the FlexibleLOM riser cage. Remove the FlexibleLOM riser board. To replace the component, reverse the removal procedure. DIMMs To remove the component: Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the front GPU cage (on page 26).
Remove the DIMM. To replace the component, reverse the removal procedure. Processor air baffle To remove the component: Power down the server (on page 24). Disconnect all peripheral cables from the server. Remove the server from the chassis (on page 24). Remove the front GPU cage (on page 26).
To replace the component, reverse the removal procedure. Heatsink To remove the component: CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. Power down the server (on page 24). Disconnect all peripheral cables from the server.
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Remove the thermal interface protective cover from the heatsink. CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of overtightening the screws.
Install the server into the chassis. Connect the peripheral cables. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
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Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.
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To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
Finish the installation by completely tightening the screws in the same sequence. Install the processor air baffle. Install the front GPU bracket. Install the interposer board assembly. Install the front GPU cage. Install the server into the chassis. Connect the peripheral cables. Press the Power On/Standby button.
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Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
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Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. Disconnect all cables from the system board. Remove the failed system board. Removal and replacement procedures 53...
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To replace the system board: Install the system board. Connect all cables disconnected from the failed system board. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 54...
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Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket.
CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of overtightening the screws.
After you replace the system board, you must re-enter the server serial number and the product ID. During the server startup sequence, press the F9 key to access RBSU. Select the Advanced Options menu. Select Service Options. Select Serial Number. The following warning appears: Warning: The serial number should ONLY be modified by qualified service personnel.
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.
• Simplified Chinese (http://www.hp.com/support/ProLiant_TSG_v1_sc) The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: •...
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement. HP Insight Remote Support supplements your monitoring continuously to...
Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu). Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer.
Front panel LEDs and buttons Item Description Status Power On/Standby button Solid green = System on and system power LED Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present* Health LED Solid green = Normal Flashing amber = System degraded...
* Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the power button cable is disconnected. ** To identify components in a degraded or critical state, see the iLO/BIOS logs and the server troubleshooting guide. Rear panel components Item Description...
Rear panel LEDs and buttons Item Description Status System fan LEDs Off = Normal 1-2, 4-7, Amber = Fan has failed 12-13 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated Power supply LEDs Solid green = Normal 8-11...
The arrow points to the front of the server. System maintenance switch Position Default Function Off = iLO 4 security is enabled. On = iLO 4 security is disabled. Off = System configuration can be changed. On = System configuration is locked. Reserved Reserved Off = Power-on password is enabled.
To force the system to invoke the NMI handler and generate a crash dump log, do one of the following: • Use the iLO Virtual NMI feature. • Short the NMI header ("System board components" on page 67). For more information, see the HP website (http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf). Drive numbering • Front hot-plug drive bay numbers (box 1) Component identification 70...
• Rear SFF drive bay numbers (box 0) Hot-plug drive LED definitions Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity...
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Item Status Definition The drive is not configured by a RAID controller. Component identification 72...
For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• Right node Item Description Front GPU riser board to L2 power board Front GPU to front GPU riser board Rear GPU Item Description Rear GPU riser board to L2 power board Rear GPU to rear GPU riser board Cabling 77...
22.08 cm (8.69 in) Width 12.25 kg (27.00 lb) Weight (maximum: two processors, eight hard drives) Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, see the HP website (http://www.hp.com/go/hppoweradvisor). Specifications 82...
Advanced Memory Protection Automatic Server Recovery Customer Self Repair DDR3 double data rate-3 dual port (drive connection) enterprise (HP Enterprise drive family) entry (HP Entry drive family) FBWC flash-backed write cache HP SIM HP Systems Insight Manager Integrated Lights-Out...
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LAN on Motherboard midline (HP Midline drive family) multilevel cell (NAND memory type used in SSDs) nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module...
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Systems Insight Manager SLAPM SL Advanced Power Manager single level cell (NAND memory type used in SSDs) HP Service Pack for ProLiant serial, USB, video Trusted Platform Module UDIMM unregistered dual in-line memory module unit identification universal serial bus Acronyms and abbreviations 85...
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