Huawei MediaPad 10 fhd Maintenance Manual
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Huawei MediaPad 10 fhd Maintenance Manual

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MediaPad10 FHD Maintenance Manual
MediaPad 10 FHD Maintenance Manual
Prepared by
Reviewed by
Approved by
2012-10-09
For internal use only
Yang Yongxiang
Zhang Dewen
Zhen Haitao
Huawei Technologies Co., Ltd.
All right reserved
Huawei Confidential
V1.0
Date
Date
Date
INTERNAL
2012-7-14
Page 1 of 78

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Summary of Contents for Huawei MediaPad 10 fhd

  • Page 1 MediaPad10 FHD Maintenance Manual INTERNAL MediaPad 10 FHD Maintenance Manual V1.0 For internal use only Prepared by Date Yang Yongxiang 2012-7-14 Reviewed by Date Zhang Dewen Approved by Date Zhen Haitao Huawei Technologies Co., Ltd. All right reserved 2012-10-09 Huawei Confidential...
  • Page 2 MediaPad10 FHD Maintenance Manual INTERNAL Change History Date Revision Version Change Reason Changed Chapter Change Description Author 2012-7-14 V1.0 2012-10-09 Huawei Confidential Page 2 of 78...

  • Page 3: Table Of Contents

    3.1 Layout of Components on the S10 PCBA ....................32 3.2 Components on the S10 PCBA ......................... 32 4 Principles and Failure Analysis ................... 37 4.1 Working Principles of the MediaPad 10 FHD .................... 37 4.2 Power-On and Power Tree ........................39 4.2.1 Hardware Startup Process ........................ 39 4.2.2 Power Tree ............................
  • Page 4 6.2 Disassembly Preparation........................... 75 6.3 Disassembly Procedure ..........................75 6.4 Other Precautions ............................. 75 7 Appendix ..........................77 7.1 PCBA Layout ............................77 7.2 Test Spot List ............................78 7.3 Acronyms and Abbreviations ........................78 2012-10-09 Huawei Confidential Page 4 of 78...
  • Page 5 Figures Figure 1-1 Appearance of the MediaPad 10 FHD ..................... 9 Figure 1-2 Hardware principles of the MediaPad 10 FHD ................10 Figure 1-3 Exploded view of the host ......................13 Figure 2-1 Functional blocks of the Hi3620 ....................14 Figure 2-2 Functional blocks of the POP LPDDR2 chip .................
  • Page 6 Figure 4-21 Working principles of the sensor circuits ..................64 Figure 4-22 Circuits of the modem unit ......................66 Figure 7-1 PCBA layout at the top layer ......................77 Figure 7-2 PCBA layout at the bottom layer ....................77 2012-10-09 Huawei Confidential Page 6 of 78...
  • Page 7 Tables Table 1-1 External hardware interfaces ......................11 Table 1-2 Hardware specifications of the MediaPad 10 FHD ................11 Table 3-1 Description of components on the S10 PCBA ................. 32 Table 4-1 Voltage signals of the AP power circuit ................... 45 Table 4-2 Possible faults of the AP power circuit ....................

  • Page 8: Product Overview

    MediaPad 10 FHD is a 10-inch tablet of Huawei MediaPad series based on the Android 4.0 (Ice Cream Sandwich) operating system. Its hardware integrates an access point (AP) and a modem (K3+BalongV7).

  • Page 9: Figure 1-1 Appearance Of The Mediapad 10 Fhd

    Modem: Hi6920+Hi6451+Hi6360, MCP (NAND+DDR), standard 2 Gbit + 1 Gbit (compatible with 1 Gbit + 512 Mbit) The MediaPad 10 FHD supports the 3.5 mm headset jack and 30-pin dock interface. The dock interface supports multiple functions, such as charging, power supply, USB host or device installation, and the display port.

  • Page 10: Figure 1-2 Hardware Principles Of The Mediapad 10 Fhd

    Provides a WLAN or Bluetooth module. The interface board provides the following functions: Provides dock interfaces. Provides USB and charging interfaces. Table 1-1 lists the hardware interfaces provided by the MediaPad 10 FHD. 2012-10-09 Huawei Confidential Page 10 of 78...

  • Page 11: Hardware Specifications

    This JTAG interface is used for program interface encapsulation loading. 1.2 Hardware Specifications Table 1-2 lists the hardware specifications of the MediaPad 10 FHD. Table 1-2 Hardware specifications of the MediaPad 10 FHD Technical Parameter Specification Dimensions (H x W x D) 8.9 mm x 267.2 mm x 169.8 mm...

  • Page 12: Software Specifications

    MP3, AAC, AAC+ Network service Others Wi-Fi b/g/n, Bluetooth v3.0 +HS, DLNA, 30-pin dock connector, 1080p video 1.3 Software Specifications 1.4 Exploded View of the Host Figure 1-3 shows the exploded view of the host. 2012-10-09 Huawei Confidential Page 12 of 78...

  • Page 13: Figure 1-3 Exploded View Of The Host

    MediaPad10 FHD Maintenance Manual INTERNAL Figure 1-3 Exploded view of the host 2012-10-09 Huawei Confidential Page 13 of 78...

  • Page 14: Functional Chips

    The processor supports 1.2 GHz processing. Figure 2-1 shows the functional blocks of the Hi3620. Figure 2-1 Functional blocks of the Hi3620 2.1.1 Chip Specifications Encapsulation: 11.90 mm x 11.90 mm, 576-pin BGA/CSP encapsulation, Hi3620 (IC). 2012-10-09 Huawei Confidential Page 14 of 78...

  • Page 15: Pin Assignment

    UART Interface The Hi3620 provides five UART interfaces, all of which support four-wire hardware flow control and provide the maximum baud rate of 3.25 Mbit/s. These interfaces are used to connect to peripherals. 2012-10-09 Huawei Confidential Page 15 of 78...
  • Page 16 I2S interface: This interface is a stereo audio interface between the Hi3620 and the codec inside the Hi6421. M_PCM interface: This interface provides a voice channel between the modem and the codec inside the Hi6421. 2012-10-09 Huawei Confidential Page 16 of 78...

  • Page 17: Pop Lpddr2

    South Bridge or SATA disk. 2.2 POP LPDDR2 The DDR2 chip uses the POP encapsulation technology. Currently, two vendors ELPIDA and Samsung supply this chip to Huawei. Figure 2-2 shows the functional blocks of the POP LPDDR2 chip. 2012-10-09 Huawei Confidential...

  • Page 18: Figure 2-2 Functional Blocks Of The Pop Lpddr2 Chip

    Figure 2-3 shows the model of the POP LPDDR2 chip provided by ELPIDA. Figure 2-3 Model of the POP LPDDR2 chip provided by ELPIDA Figure 2-4 shows the model of the POP LPDDR2 chip provided by Samsung. 2012-10-09 Huawei Confidential Page 18 of 78...

  • Page 19: Figure 2-4 Model Of The Pop Lpddr2 Chip Provided By Samsung

    MediaPad10 FHD Maintenance Manual INTERNAL Figure 2-4 Model of the POP LPDDR2 chip provided by Samsung Figure 2-5 shows the pin assignment of the POP LPDDR2 chip. 2012-10-09 Huawei Confidential Page 19 of 78...

  • Page 20: Pmu Hi6421

    BUCK01_EN. The output voltage is adjusted through SPI interfaces to meet the system AVS policy, so that the power consumption of the system is minimized on the precondition of guaranteed system performance. 2012-10-09 Huawei Confidential Page 20 of 78...
  • Page 21 PMU digital circuit. The charge pump supplies power to the HDMI, and provides the backup battery charging function. Audio Unit The audio unit integrates a sigma-delta audio codec, which makes possible flexible resource configuration and provides abundant audio applications to meet audio processing 2012-10-09 Huawei Confidential Page 21 of 78...
  • Page 22 Provides one 26 MHz clock oscillator and two output drives. Provides one 32.768 kHz clock oscillator and three output drives. Provides one interface circuit for detecting the thermistor of the main battery. Figure 2-6 shows the functional blocks of the power supply. 2012-10-09 Huawei Confidential Page 22 of 78...

  • Page 23: Figure 2-6 Functional Blocks Of The Power Supply

    The Hi6421V200 chip has the following features: Five high-efficiency buck-type switch power convertors BUCK0: 1.1 V 2000 mA for the A9 Core, supporting AVS adjustment. BUCK1: 1.1 V 2000 mA for the A9 Core, supporting AVS adjustment. 2012-10-09 Huawei Confidential Page 23 of 78...
  • Page 24 The RTC serves as the reference time and date benchmark of the system. The RTC supports the alarm clock function and scheduled power-on. The RTC supports power supply through a backup coin battery. 2012-10-09 Huawei Confidential Page 24 of 78...

  • Page 25: Wi-Fi And Bluetooth Modules

    The Wi-Fi and Bluetooth modules of the S10 are designed based on the integrated chip BCM4330 according to Huawei principle of normalization for Wi-Fi design. The BCM4330 chip integrates the IEEE 802.11b/g/n 2.4 GHz or 5.1 GHz solution (RF transceiving and baseband demodulation) and a transceiver for the Bluetooth and FM modules.

  • Page 26: Figure 2-7 Rf Solution For The Wi-Fi And Bluetooth Modules Of The S10

    AP side. Figure 2-7 shows the RF solution for the Wi-Fi and Bluetooth modules of the S10. Figure 2-7 RF solution for the Wi-Fi and Bluetooth modules of the S10 2012-10-09 Huawei Confidential Page 26 of 78...
  • Page 27 MediaPad10 FHD Maintenance Manual INTERNAL Figure 2-8 shows the components encapsulated in the WI-FI or Bluetooth module. 2012-10-09 Huawei Confidential Page 27 of 78...

  • Page 28: Gps Bcm47511

    2.5 GPS BCM47511 The S10 needs to include a GPS module to implement the GNSS function. It must also be compatible with the global navigation satellite system (GLONASS). Therefore, Huawei selected the GPS chip BCM47511. The BCM47511 chip provides external GPS LNA interfaces to improve the receiving performance of the GPS module.

  • Page 29: Figure 2-9 Rf Solution For The Gps Module Of The S10

    The Bluetooth kernel of the BCM47511 chip is optimized to attain low power consumption. This kernel also maintains high receiver sensitivity and complies with the Bluetooth 4.0 specification. Figure 2-10 shows the functional blocks of the BCM47511 chip. 2012-10-09 Huawei Confidential Page 29 of 78...

  • Page 30: Figure 2-10 Functional Blocks Of The Bcm47511 Chip

    Figure 2-10 Functional blocks of the BCM47511 chip Figure 2-11 shows the available models of the BCM47511. Figure 2-11 Models of the BCM47511 Figure 2-12 shows the components encapsulated in the BCM47511 chip. 2012-10-09 Huawei Confidential Page 30 of 78...

  • Page 31: Figure 2-12 Components Encapsulated In The Bcm47511 Chip

    MediaPad10 FHD Maintenance Manual INTERNAL Figure 2-12 Components encapsulated in the BCM47511 chip 2012-10-09 Huawei Confidential Page 31 of 78...

  • Page 32: Layout Of Major Components

    3.2 Components on the S10 PCBA Table 3-1 lists the components on the S10 PCBA. Table 3-1 Description of components on the S10 PCBA BOM Number Description Remarks BTB Connector,Fmale,24Pin,0.4mm,SMT,Mating Height 1.0 14240181 J2105 mm,Terminal Dedicated 2012-10-09 Huawei Confidential Page 32 of 78...
  • Page 33 Control,QFN,SMT,Terminal Dedicated NAND Flash, 16GB EMMC V4.4, 52MHz, 1024KB, 3.3V, 40060318 U1100 FBGA169(Pb-Free),Terminal Dedicated MCP, 2Gb(256M*8bit) NAND,23MHz,128KB,1.8V,VFBGA1 40060344 U2601 30(Pb-free),1G (32M*32bit) Mobile LPDDR SDRAM,Balong Dedicated,Terminal Dedicated DKBA80359313,S7-931U-POWER-FRAME 51623731 J2502 DKBA80359309,RGB-FRAME,S7-931U 51623727 J2503 2012-10-09 Huawei Confidential Page 33 of 78...
  • Page 34 U1600 Terminal Dedicated Operation Amplifier,Audio Power Amplifier,2.5V~5.5V,Diffe 39080127 U1700 rencial,Micro SMD 9pin(BGA Pb-Free),Terminal Dedicated Power Driver,2A Boost DCDC,QFN10,Terminal Dedicated 39110709 U1702 Vibrator,Cylindrical,3.0V,0.11A,11000rpm,10.5mm*4.5mm*4. 32050033 U1703 85mm,SMT, SANYO, 28.5ohm,Terminal Dedicated -0.3~2.75V,Battery Gauge,SON,Terminal Dedicated 39070073 U1800 2012-10-09 Huawei Confidential Page 34 of 78...
  • Page 35 LVCMOS-Unbuffer Single Inverter U6003 Gate-SC-70-9ns-4mA-CMOS-CMOS Switching Regulators,1~4V,1.5A,SMT,Terminal Dedicated 39110566 U9000, U9001, U9002, U9003 36020382 CMOS-Power on reset-MLP-8 2 x 2 x 0.8mm,0.5mm U9004 Pitch-300ns-0.5mA-COMS-COMS-3ns Crystal,37.4MHz,10pF/8.3pF/9pF,+/-10ppm,80ohm,2016,Term 12020216 X2100 inal Dedicated Crystal,0.032768MHz,12.5pF+/-30ppm,60/80kohm,3.2*1.5 S 12020125 X6000 MD,Terminal Dedicate,ELOM,TS16949 2012-10-09 Huawei Confidential Page 35 of 78...
  • Page 36 MediaPad10 FHD Maintenance Manual INTERNAL BOM Number Description Remarks Crystal Oscillator,27MHz,12pF,20 ppm,50ohm,3225 12020171 X6001 Crystal,24.000MHz,12pf,+/-v30ppm,50ohm,HCX-3SB,Termin 12020151 X6002 al Dedicated 2012-10-09 Huawei Confidential Page 36 of 78...

  • Page 37: Principles And Failure Analysis

    4.1 Working Principles of the MediaPad 10 FHD The MediaPad 10 FHD consists of a PCBA, a small I/O board, and a small headset board. The PCBA is designed based on a combination of the AP (Hisilicon K3V200) and the Balong V7 modem.

  • Page 38: Figure 4-1 Functional Blocks Of The Pcba

    The Wi-Fi data link is established on a 4-bit SDIO interface. The GPS and Bluetooth modules involve a small data volume, using the high-rate serial port UART as the data transmission channel. 2012-10-09 Huawei Confidential Page 38 of 78...

  • Page 39: Power-On And Power Tree

    I2C interfaces. Figure 4-3 Physical architecture of the PCBA 4.2 Power-On and Power Tree 4.2.1 Hardware Startup Process Figure 4-4 shows a power-on and power-off sequencing diagram. 2012-10-09 Huawei Confidential Page 39 of 78...

  • Page 40: Figure 4-4 Power-On And Power-Off Sequencing

    MediaPad10 FHD Maintenance Manual INTERNAL Figure 4-4 Power-on and power-off sequencing Figure 4-5 shows the power-on procedure. 2012-10-09 Huawei Confidential Page 40 of 78...

  • Page 41: Power Tree

    The MDM_PMU sends a reset signal to reset the MCP and MDM, and sends a notification to the AP, indicating that the MDM is ready following the reset. 4.2.2 Power Tree MediaPad 10 FHD Maintenance Manual V1.0-816.xls 2012-10-09 Huawei Confidential...

  • Page 42: Circuit Analysis And Troubleshooting For Functional Units

    The Hi3620 also provides one parallel camera interface which is known as the DVP interface. CSI0: This interface is used for camera image capturing. DSI0: This interface is used for LCD display. 2012-10-09 Huawei Confidential Page 42 of 78...
  • Page 43 CMMB. Its signal level is 1.8 V. SPI1: This interface is the communication and control interface of the modem. Its signal level is 1.8 V or 2.5 V. 2012-10-09 Huawei Confidential Page 43 of 78...

  • Page 44: Usb Interface

    The Hi3620 provides two USB2.0 interfaces, both of which support the highest speed 480 Mbit/s. USB_NANO interface: This interface statically supports USB 2.0 hosts and devices. USB_PICO interface: This interface supports USB2.0 devices and BC1.1 (in compliance with a charging specification supplementary to the USB2.0 specification). 2012-10-09 Huawei Confidential Page 44 of 78...

  • Page 45: Detailed Analysis Of Working Principles Of The Ap Subsystem

    Default Name Voltage Current Status BUCK0/1 1.1 V 0.7–1.60, 128 steps, best efficiency point = 400 mA 2.0 A BUCK2 1.1 V 0.7–1.60, 128 steps, best efficiency point = 400 mA 1.4 A 2012-10-09 Huawei Confidential Page 45 of 78...
  • Page 46 LDO18 2.85 V 1.5/1.8/2.4/2.5/2.6/2.7/2.85/3.0 300 mA LDO19 2.85 V 1.5/1.8/2.4/2.5/2.6/2.7/2.85/3.0 300 mA LDO20 2.85 V 1.5/1.8/2.4/2.5/2.6/2.7/2.85/3.0 300 mA Fault analysis and location Table 4-2 lists the possible faults of the AP power circuit. 2012-10-09 Huawei Confidential Page 46 of 78...

  • Page 47: Figure 4-8 Possible Faults Of The Ap Power Circuit

    The FPC and spring leaf are not in position. The PMU is poorly soldered. The charging chip is defective. Figure 4-8 shows the possible faults of the AP power circuit. Figure 4-8 Possible faults of the AP power circuit 2012-10-09 Huawei Confidential Page 47 of 78...
  • Page 48 MediaPad10 FHD Maintenance Manual INTERNAL Working Principles of the AP Charging Circuit Working principles Figure 4-9 shows the working principles of the AP charging circuit. 2012-10-09 Huawei Confidential Page 48 of 78...

  • Page 49: Figure 4-9 Working Principles Of The Ap Charging Circuit

    Battery fault. The NTC resistance is abnormal. The resistor mapping to the charging current of the IDC pin is abnormal. Circuit signals Table 4-3 lists the signals of the AP charging circuit. 2012-10-09 Huawei Confidential Page 49 of 78...

  • Page 50: Figure 4-10 Working Principles Of The Coulometer Circuit

    Only the port is detected. Working Principles of the Coulometer Circuit Working principles Figure 4-10 shows the working principles of the coulometer circuit. Figure 4-10 Working principles of the coulometer circuit Circuit analysis 2012-10-09 Huawei Confidential Page 50 of 78...

  • Page 51: Table 4-4 Definitions Of Signals Of The Coulometer Circuit

    Power voltage range: 0–4.2 V I2C0_SCL IIC interface 1.8 V I2C0_SDA IIC interface 1.8 V Working Principles of the eMMC Circuit Working principles Figure 4-11 shows the working principles of the eMMC circuit. 2012-10-09 Huawei Confidential Page 51 of 78...

  • Page 52: Figure 4-11 Working Principles Of The Emmc Circuit

    Clock signal of the eMMC EMMC_CMD Command signal of the eMMC VREG_EMMC_1V8 I/O power of the eMMC VOUT0_2V85 Internal working power supply of the eMMC Working Principles of the MIC Circuit Working principles 2012-10-09 Huawei Confidential Page 52 of 78...

  • Page 53: Figure 4-12 Working Principles Of The Mic Circuit

    Test Reference Value or Oscillogram MICBIAS1 MIC bias voltage MIC1P MIC differential signal MIC1N MIC differential signal Working Principles of the Headset Circuit Working principles Figure 4-13 shows the working principles of the headset circuit. 2012-10-09 Huawei Confidential Page 53 of 78...

  • Page 54: Figure 4-13 Working Principles Of The Headset Circuit

    The signals output by the U1501 are sent to a BTB jack and then reach a small headset board through the FPC jack. Finally, the signals are output to the headset. Fault analysis and location 2012-10-09 Huawei Confidential Page 54 of 78...

  • Page 55: Figure 4-14 Working Principles Of The Lcd Circuit

    EAR_DET Headset detection Working Principles of the LCD Circuit Working principles Figure 4-14 shows the working principles of the LCD circuit. Figure 4-14 Working principles of the LCD circuit 2012-10-09 Huawei Confidential Page 55 of 78...
  • Page 56 (Ensure that cables are properly plugged and unplugged). − The LCD is flashing or garbled. Check whether the PWM is working properly and whether the materials of the LCD are normal. Circuit signals 2012-10-09 Huawei Confidential Page 56 of 78...

  • Page 57: Figure 4-15 Working Principles Of The Tp Circuit

    LED_VCCS Power supply of the backlight LED Working Principles of the TP Circuit Working principles Figure 4-15 shows the working principles of the TP circuit. Figure 4-15 Working principles of the TP circuit 2012-10-09 Huawei Confidential Page 57 of 78...

  • Page 58: Table 4-9 Definitions Of Signals Of The Tp Circuit

    Table 4-9 Definitions of signals of the TP circuit Signal Name Function Test Reference Value or Oscillogram GPIO61_TP1V8_EN 1.8 V power switch of the TP TP_SCL IIC of the TP TP_SDA IIC of the TP 2012-10-09 Huawei Confidential Page 58 of 78...

  • Page 59: Figure 4-16 Working Principles Of The Rear Camera

    MIPI buses (one pair of data buses and one pair of clock buses) for the front camera. The signal level of the data transmission interfaces is 1.8 V. Fault analysis and location Symptom: The camera does not display any information. 2012-10-09 Huawei Confidential Page 59 of 78...

  • Page 60: Figure 4-18 Working Principles Of The Bc1.1 Circuit

    USB peripheral. Another function of the BC1.1 chip is to identify a USB peripheral by detecting the ID pin of the USB peripheral, so that the charging current of the charging chip can be properly controlled to 500 mA, 1.5 A, or 2 A. 2012-10-09 Huawei Confidential Page 60 of 78...

  • Page 61: Table 4-11 Definitions Of Signals Of The Bc1.1 Circuit

    Terminal signal reported by the BC1.1 chip to the AP DOCK_USB_DP/N Output USB bus DOCK_USB_ID USB ID signal Working Principles of the Charging Circuit Working principles Figure 4-19 shows the working principles of the charging circuit. 2012-10-09 Huawei Confidential Page 61 of 78...

  • Page 62: Figure 4-19 Working Principles Of The Charging Circuit

    USB peripheral and an AC adapter. When external power supply is connected, the Smart Power Selector circuit allows the system to operate without any battery or operate with a battery in deep discharge mode. The Smart Power Selector circuit can automatically 2012-10-09 Huawei Confidential Page 62 of 78...

  • Page 63: Table 4-12 Definitions Of Signals Of The Charging Circuit

    GPIO24_CHARGER_FLT Charging status indication GPIO5_VCHG_INT Charging interruption indication VBATT Battery power GPIO22_ISET_CTRL0/1 Charging current control Working Principles of the Sensor Circuits Working principles Figure 4-21 shows the working principles of the sensor circuits. 2012-10-09 Huawei Confidential Page 63 of 78...

  • Page 64: Figure 4-21 Working Principles Of The Sensor Circuits

    MediaPad10 FHD Maintenance Manual INTERNAL Figure 4-21 Working principles of the sensor circuits 2012-10-09 Huawei Confidential Page 64 of 78...

  • Page 65: Circuit Analysis And Troubleshooting For The Modem Unit

    Signal Name Function Test Reference Value or Oscillogram IIC0_SDA/SCL IIC bus SENSOR_2V6 Working power of sensors 4.4 Circuit Analysis and Troubleshooting for the Modem Unit Figure 4-22 shows the circuits of the modem unit. 2012-10-09 Huawei Confidential Page 65 of 78...

  • Page 66: Figure 4-22 Circuits Of The Modem Unit

    MediaPad10 FHD Maintenance Manual INTERNAL Figure 4-22 Circuits of the modem unit 2012-10-09 Huawei Confidential Page 66 of 78...
  • Page 67 MediaPad10 FHD Maintenance Manual INTERNAL 2012-10-09 Huawei Confidential Page 67 of 78...
  • Page 68 MediaPad10 FHD Maintenance Manual INTERNAL 2012-10-09 Huawei Confidential Page 68 of 78...
  • Page 69 MediaPad10 FHD Maintenance Manual INTERNAL 2012-10-09 Huawei Confidential Page 69 of 78...
  • Page 70 TQC for quality inspection. If materials need to be replaced for a board, apply the rework process to avoid procedural errors. Common Faults of the CT Module AFC calibration failure 2012-10-09 Huawei Confidential Page 70 of 78...
  • Page 71 Check whether SMT defects exist on transmit links. − Check whether SMT defects exist on the Wi-Fi chip. Check whether the Wi-Fi chip is faulty. − Software version access failure or port enabling failure 2012-10-09 Huawei Confidential Page 71 of 78...
  • Page 72 Check whether SMT defects exist on the GPS chip. Check whether the GPS chip is defective. Check whether ports cannot be enabled. If yes, send the module to software or hardware engineers for processing. 2012-10-09 Huawei Confidential Page 72 of 78...

  • Page 73: Software Upgrade

    Copying the Upgrade Package Check the current upgrade environment. Ensure that the microSD card is intact and can be read and written. Obtain the upgrade package. Copy the dload directory to the microSD card. 2012-10-09 Huawei Confidential Page 73 of 78...
  • Page 74 Error 2 If a failure occurs at the very beginning of the upgrade process, check whether the upgrade version is correct and whether the tablet or microSD card is damaged. 2012-10-09 Huawei Confidential Page 74 of 78...

  • Page 75: Disassembly Procedure

    Before Disassembly Wear an ESD wrist strap and antistatic clothing, and prepare tools. During Disassembly Disassemble the product carefully by using dedicated removers. Avoid any damage to the housing, PCBA components, or solder wires. 2012-10-09 Huawei Confidential Page 75 of 78...
  • Page 76 MediaPad10 FHD Maintenance Manual INTERNAL During Assembly Assemble the product strictly in accordance with installation steps. Check whether operations have been correctly performed in the previous step after performing each step. 2012-10-09 Huawei Confidential Page 76 of 78...

  • Page 77: Appendix

    Figure 7-1 shows the PCBA layout at the top layer. Figure 7-1 PCBA layout at the top layer PCBA Layout at the Bottom Layer Figure 7-2 shows the PCBA layout at the bottom layer. Figure 7-2 PCBA layout at the bottom layer 2012-10-09 Huawei Confidential Page 77 of 78...

  • Page 78: Test Spot List

    Liquid Crystal Display Light Emitting Diode Low Noise Amplifier Power Management FSTN Film Super Twisted Nematic TCXO Temperature-compensated crystal oscillator Analog-to-Digital Converter Band Pass Filter UVLO Under-Voltage Lockout Voltage Controlled Oscillator Serial Bus Interface 2012-10-09 Huawei Confidential Page 78 of 78...

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