HP HPE ProLiant DL120 Gen9 Maintenance And Service Manual
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HP HPE ProLiant DL120 Gen9 Maintenance And Service Manual

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HPE ProLiant DL120 Gen9 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware
components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes you are qualified in the
servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 781877-003
April 2016
Edition: 3

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  • Page 1 HPE ProLiant DL120 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
  • Page 2 © Copyright 2014, 2016 Hewlett Packard Enterprise Development LP The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty.

  • Page 3: Table Of Contents

    Contents Customer self repair..........................6 Parts only warranty service ............................6 Illustrated parts catalog ........................... 16 Mechanical components ............................16 System components ............................... 18 Removal and replacement procedures ....................27 Required tools ................................ 27 Safety considerations ............................. 27 Preventing electrostatic discharge....................... 27 Symbols on equipment ..........................
  • Page 4 Redundant power supply components ........................79 Power input module and RPS backplane characteristics ................79 Hot-plug power input module........................79 Redundant power supply backplane ......................80 HP Trusted Platform Module ..........................81 Troubleshooting ............................82 Troubleshooting resources ............................. 82 Diagnostic tools ............................83 Product QuickSpecs ...............................
  • Page 5 Documentation feedback ........................117 Index ..............................118 Contents 5...

  • Page 6: Customer Self Repair

    Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
  • Page 7 • Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
  • Page 8 NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
  • Page 9 Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
  • Page 10 deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución.
  • Page 11 Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise.
  • Page 12 Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair). Serviço de garantia apenas para peças A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças.
  • Page 13 Customer self repair 13...
  • Page 14 Customer self repair 14...
  • Page 15 Customer self repair 15...

  • Page 16: Illustrated Parts Catalog

    Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part Customer self number repair (on page Access panel 790493-001 Mandatory Optical drive blank...
  • Page 17 Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations. Si vous demandez à Hewlett Packard Enterprise de procéder au remplacement de ces pièces, les frais de transport et de main d’œuvre pour ce service vous seront facturés. Facultatif—Pièces pour lesquelles une réparation par le client est facultative. Ces pièces sont également conçues pour que le client puisse procéder lui-même aux réparations.

  • Page 18: System Components

    System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Illustrated parts catalog 18...
  • Page 19 Item Description Spare part Customer self number repair (on page System board assembly (includes alcohol pad and thermal — — compound) a) System board for Intel Xeon E5-2600 v3 processors 790549-001 Optional b) System board for Intel Xeon E5-2600 v3 and v4 847394-001 Optional processors*...
  • Page 20 Item Description Spare part Customer self number repair (on page n) 2.8 GHz Intel Xeon E5-1603v3, 4C, 140 W* 799505-001 Optional o) 3.1 GHz Intel Xeon E5-1607v3, 4C, 140 W* 801579-001 Optional p) 3.5 GHz Intel Xeon E5-1620v3, 4C, 140 W* 799506-001 Optional q) 3.5 GHz Intel Xeon E5-1650v3, 6C, 140 W*...
  • Page 21 Item Description Spare part Customer self number repair (on page f) 32 GB, dual-rank x4 PC4-2400T-L* 819414-001 Mandatory Fan module 790514-001 Mandatory Front I/O module for SFF configuration 790553-001 Optional Front I/O module for LFF configuration 790496-001 Mandatory Right quick-release latch rack ear assembly 790522-001 Mandatory Left quick-release latch rack ear assembly...
  • Page 22 Item Description Spare part Customer self number repair (on page h) 800GB hot-plug SATA, SSD, SFF, 6G* 692167-001 Mandatory i) 120GB hot-plug SATA, SSD, SFF, 6G* 718136-001 Mandatory j) 120GB hot-plug SATA, SSD, LFF, 6G* 718300-001 Mandatory k) 80GB hot-plug SATA, SSD, SFF, 6G* 734562-001 Mandatory l) 80GB hot-plug SATA, SSD, LFF, 6G*...
  • Page 23 Item Description Spare part Customer self number repair (on page aq) 6TB hot-plug SATA, LFF, 7,200 RPM, 6G* 761496-001 Mandatory ar) 1.6TB SATA, SSD, SFF, 6G* 757381-001 Mandatory as) 1.6TB SATA, SSD, LFF, 6G* 757382-001 Mandatory — — a) 800GB hot-plug SSD, SAS, SFF, 12G* 762749-001 Mandatory b) 1.6TB hot-plug SSD, SAS, SFF, 12G*...
  • Page 24 Item Description Spare part Customer self number repair (on page ae) 4TB hot-plug SAS, LFF, 7,200 RPM, 6G* 695842-001 Mandatory af) 6TB hot-plug SAS, LFF, 7,200 RPM, 6G* 761497-001 Mandatory Network adapters — — a) Ethernet 10GB, 2P, 530SFP+ adapter* 656244-001 Mandatory b) FlexFabric 10Gb 2P 534FLR-SFP+ adapter*...
  • Page 25 Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations. Si vous demandez à Hewlett Packard Enterprise de procéder au remplacement de ces pièces, les frais de transport et de main d’œuvre pour ce service vous seront facturés. Facultatif—Pièces pour lesquelles une réparation par le client est facultative. Ces pièces sont également conçues pour que le client puisse procéder lui-même aux réparations.
  • Page 26 Illustrated parts catalog 26...

  • Page 27: Removal And Replacement Procedures

    Removal and replacement procedures Required tools You need the following items for some procedures: • T-25 Torx screwdriver (for screws located inside the front panel quick-release levers) • T-10/T-15 Torx screwdriver • Flathead screwdriver (for replacing the system battery) • HPE Insight Diagnostics (on page 86) Safety considerations Before performing service procedures, review all the safety information.

  • Page 28: Server Warnings And Cautions

    This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

  • Page 29: Preparation Procedures

    For more information about Telco rack solutions, see the RackSolutions website (http://www.racksolutions.com/hp). • Access the product rear panel (on page 33).

  • Page 30: Power Down The Server

    To access the front panel components, unlock and then remove the security bezel. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server.
  • Page 31 WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack. WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack.
  • Page 32 Slide the server out of the enclosure. iii. After performing the installation or maintenance procedure, slide the server back into the enclosure, and then press the server firmly into the enclosure to secure it in place. Do one of the following: In a server that uses thumbscrew rack ears, tighten the captive thumbscrews.

  • Page 33: Access The Product Rear Panel

    Access the product rear panel Opening the cable management arm To access the server rear panel: Release the cable management arm. Open the cable management arm. The cable management arm can be right-mounted or left-mounted. Remove the server from the rack Removal and replacement procedures 33...

  • Page 34: Remove The Air Baffle

    WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling. • Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails.

  • Page 35: Remove The Pci Riser Cage

    Remove the PCI riser cage WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to the server or expansion boards, power down the server, and disconnect all power cords before removing or installing the PCI riser cage.
  • Page 36 Secondary PCI riser cage PCI blank Removal and replacement procedures 36...

  • Page 37: Non-Hot-Plug Drive Carrier

    Remove any expansion boards installed in the primary riser cage. Remove the primary PCI riser cage. Non-hot-plug drive carrier CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Power down the server (on page 30).

  • Page 38: Non-Hot-Plug Drive

    Remove the drive carrier. To replace the component, slide the component into the bay until it clicks. Non-hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data.

  • Page 39: Hot-Plug Drive Blanks

    Remove the drive from the carrier. To replace the component, reverse the removal procedure. Hot-plug drive blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: If installed, remove the security bezel ("Remove the security bezel...

  • Page 40: Hot-Plug Drive

    Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data. If installed, remove the security bezel ("Remove the security bezel (optional)"...

  • Page 41: Four-Bay Lff Non-Hot-Plug Drive Backplane

    If the access panel latch is locked, use a T-15 Torx screwdriver to unlock the latch. To replace the component, reverse the removal procedure. Four-bay LFF non-hot-plug drive backplane To remove the component: If installed, remove the security bezel ("Remove the security bezel (optional)"...

  • Page 42: Four-Bay Lff Hot-Plug Drive Backplane

    Remove the non-hot-plug drive backplane. To replace the component, reverse the removal procedure. Four-bay LFF hot-plug drive backplane To remove the component: If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29). Power down the server (on page 30). Remove all power: Disconnect each power cord from the power source.

  • Page 43: Smart Storage Battery

    Remove the hot-plug drive backplane. To replace the component, reverse the removal procedure. Smart Storage Battery For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.

  • Page 44: Fbwc Module

    Remove the Smart Storage Battery. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.

  • Page 45: M.2 Ssd Enablement Kit

    Disconnect the cache module backup power cable from the cache module. Remove the cache module. To replace the component, reverse the removal procedure. M.2 SSD enablement kit M.2 SSD enablement board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them.

  • Page 46: M.2 Ssd Module

    Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 30). Remove the server from the rack (on page 33). Remove the access panel ("Access panel"...

  • Page 47: Optical Drive Blank

    WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation. Improper grounding can cause electrostatic discharge.

  • Page 48: Optical Drive

    Remove the access panel ("Access panel" on page 40). Remove the optical drive blank Four-bay LFF drive model Eight-bay SFF drive model To replace the component, reverse the removal procedure. Optical drive CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank.
  • Page 49 Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 30). Remove the server from the rack (on page 33). Remove the access panel ("Access panel"...

  • Page 50: Fan And Fan Blank

    Eight-bay SFF drive model To replace the component, reverse the removal procedure. Fan and fan blank Fan population guidelines Configuration Fan bay Fan bay Fan bay Fan bay Fan bay Blank Blank Non-redundant (with processors rated 105 W or less) Redundant* Blank Non-redundant...

  • Page 51: Fan Blank

    * Fan redundancy is not supported for processors exceeding 105 W. • In the redundant fan mode: If one fan rotor fails, the system continues to operate without redundancy. This condition is indicated by a flashing amber Health LED. If two fan rotors fail, the operating system shuts down. Fan blank WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 52: Hot-Swap Fan

    CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the removal procedure. Hot-swap fan WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 53: Dimms

    DIMMs Memory-processor information For the latest memory configuration information, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). DIMM type • Intel Xeon E5-2600 v3 processors are optimized for: Single-rank and dual-rank PC4-2133 (DDR4-2133) RDIMMs operating at up to 2133 MT/s Dual-rank and quad-rank PC4-2133 (DDR4-2133) LRDIMMs operating at up to 2133 MT/s •...

  • Page 54: Removing A Dimm

    Populated DIMM speed with Intel Xeon E5-2600 v4 processor installed Type Rank 1 DIMM per channel 2 DIMMs per (MT/s) channel (MT/s) Single 2400 2133 RDIMM Dual 2400 2133 RDIMM Dual 2400 2400 LRDIMM Maximum memory capacity Maximum memory capacity is a function of DIMM capacity, number of installed DIMMs, memory type, and number of installed processors.

  • Page 55: Heatsink

    Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. WARNING: A warning contains information essential to physical safety. The text should point out physical hazards, calling attention to procedures and practices that must be followed to prevent serious injury or death.
  • Page 56 Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.

  • Page 57: Processor

    Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
  • Page 58 Remove the access panel ("Access panel" on page 40). Remove the air baffle (on page 34). Remove the heatsink: Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate.
  • Page 59 Remove the processor from the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. To replace the component: Install the processor.
  • Page 60 CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

  • Page 61: Expansion Board

    Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.

  • Page 62: Primary Pcie Riser Board

    Slot 1 Slot 2 Slot 3 To replace the component, reverse the removal procedure. Primary PCIe riser board Removal and replacement procedures 62...
  • Page 63 CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. To remove the component: Power down the server (on page 30). Remove all power: Disconnect each power cord from the power source.

  • Page 64: Full-Height Half-Length Pcie Riser Board And Cage

    Full-height half-length PCIe riser board and cage To remove the component: Power down the server (on page 30). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 30).

  • Page 65: Flexiblelom Riser Assembly

    Remove the riser board from the cage. To replace the component, reverse the removal procedure. FlexibleLOM riser assembly To remove the component: Power down the server (on page 30). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.

  • Page 66: Gpu

    Remove the FlexibleLOM riser cage. Remove the FlexibleLOM adapter from the riser cage. To replace the component, reverse the removal procedure. To remove the component: Power down the server (on page 30). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.

  • Page 67: System Battery

    Disconnect all cables connected to the existing GPU. Remove the GPU riser cage. Remove the GPU from the riser cage. To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock.
  • Page 68 To remove the component: Power down the server (on page 30). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 30). Remove the server from the rack (on page 33).

  • Page 69: Front I/O Module

    Do one of the following: Slide the server into the rack. Install the server into the rack. Power up the server. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. Front I/O module To remove the component: If installed, remove the security bezel ("Remove the security bezel...

  • Page 70: Thumbscrew Rack Ear Assembly

    — Eight-bay SFF drive model Remove the screw and the front I/O module from the panel. To replace the component, reverse the removal procedure. Thumbscrew rack ear assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 71: Quick-Release Latch Rack Ear Assembly

    Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 30). Remove the server from the rack (on page 33). Remove the thumbscrew rack ear assembly. To replace the component, reverse the removal procedure.

  • Page 72: System Board

    Remove the quick-release latch rack ear assembly. To replace the component, reverse the removal procedure. System board CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags.
  • Page 73 Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 74 Remove the processor from the processor retaining bracket. CAUTION: When returning a damaged system board to Hewlett Packard Enterprise, always install all processor socket covers to prevent damage to the processor sockets and system board. Remove the system board: Remove the system board screws. Lift the system board out of the chassis.
  • Page 75 To replace the system board assembly: Install the system board assembly. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 75...
  • Page 76 Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 77 Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Install the processor socket cover on the failed system board. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.

  • Page 78: Re-Entering Server Serial Number/Product Id

    Finish the installation by completely tightening the screws in the same sequence. Install the fans. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board. Install the PCI riser cages. Install the air baffle. Install the access panel.

  • Page 79: Redundant Power Supply Components

    Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. Enter the product ID and press the Enter key. Press the F10 key to confirm exiting System Utilities. The server automatically reboots. Redundant power supply components Power input module and RPS backplane characteristics •...

  • Page 80: Redundant Power Supply Backplane

    Redundant power supply backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

  • Page 81: Hp Trusted Platform Module

    Release the RPS backplane cables from the cable clips. Remove the RPS backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.

  • Page 82: Troubleshooting

    Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...

  • Page 83: Diagnostic Tools

    Diagnostic tools Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). HPE iLO The Dedicated iLO management subsystem is a standard component of ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration.

  • Page 84: Hpe Proliant Pre-Boot Health Summary

    • Always on, continuous monitoring for increased stability and shorter downtimes • Rich configuration history • Health and service alerts • Easy export and upload to Service and Support The Active Health System monitors and records changes in the server hardware and system configuration.

  • Page 85: Integrated Management Log

    Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity. You can view recorded events in the IML in several ways, including the following: • From within HPE SIM •...

  • Page 86: Embedded Diagnostics Option

    • Upon the first system power-up • After defaults have been restored Default configuration settings are sufficient for typical server operations; however, you can modify configuration settings as needed. The system prompts you for access to the UEFI System Utilities each time the system is powered up.

  • Page 87: Hpe Insight Diagnostics Survey Functionality

    HPE Insight Diagnostics survey functionality HPE Insight Diagnostics (on page 86) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/supportos).

  • Page 88: External Usb Functionality

    • Enabled—If Enabled, USB 3.0 capable devices operate at USB 3.0 speeds at all times (including the pre-boot environment) when in UEFI Boot Mode. This mode should not be used with operating systems that do not support USB 3.0. If operating in Legacy Boot BIOS Mode, the USB 3.0 ports cannot function in the pre-boot environment and are not bootable.

  • Page 89: Component Identification

    Component identification Front panel components • Four LFF drive model Item Description Optical drive (optional) Serial label pull tab* USB 2.0 connector LFF drives *The serial number/iLO information pull tab is double-sided. The top side shows the server serial number and the customer asset tag label.

  • Page 90: Front Panel Leds And Buttons

    Front panel LEDs and buttons • Four LFF drive model Item Description Status UID button/LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated •...
  • Page 91 When all four LEDs described in this table flash simultaneously, a power fault has occurred. For more information, see "Power fault LEDs ("Front panel LED power fault codes" on page 92)." • Eight SFF drive model Item Description Status Power On/Standby button Solid green = System on and system power LED Flashing green (1 flash per second) = Performing power on...

  • Page 92: Front Panel Led Power Fault Codes

    Front panel LED power fault codes The following table provides a list of power fault codes, and the subsystems that are affected. Not all power faults are used by all servers. Subsystem Front panel LED behavior 1 flash System board 2 flashes Processor 3 flashes...

  • Page 93: Rear Panel Leds

    Rear panel LEDs Item Description Status UID LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated • 8 flashes per second = iLO manual reboot sequence in progress Off = Deactivated NIC link LED...

  • Page 94: System Board Components

    System board components Item Description Primary PCIe riser board connector* TPM connector System battery SATA connector Storage backup power connector for PCIe slots 1-2* Secondary PCIe riser slot* MicroSD slot Storage backup power connector for PCIe slot 3* System maintenance switch NMI header Front I/O connector Fan connector 5...

  • Page 95: Dimm Slot Locations

    DIMM slot locations DIMM slots are numbered sequentially (1 through 8). The supported AMP modes use the letter assignments for population guidelines. The arrow points to the front of the server. System maintenance switch Position Default Function Off = Dedicated iLO management security is enabled.

  • Page 96: Nmi Functionality

    CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. Before using the S7 switch to change the boot mode to Legacy BIOS Mode, you must first disable the Dynamic Smart Array B140i Controller. To disable the Dynamic Smart Array B140i Controller: Reboot the server.

  • Page 97: Hot-Plug Drive Led Definitions

    • Eight-bay SFF drive model Hot-plug drive LED definitions Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity No drive activity Do not remove...

  • Page 98: Fan Locations

    Item Status Definition The drive is not configured by a RAID controller. IMPORTANT: The Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode.

  • Page 99: Cabling

    Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the Hewlett Packard Enterprise website (http://www.hpe.com/info/servers). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.

  • Page 100: Four-Bay Lff Hot-Plug Drive Cabling

    • Four-bay LFF non-hot-plug drive backplane connected to the H240 host-bus adapter Item Description Drive power cable Mini-SAS cable Four-bay LFF hot-plug drive cabling • Four-bay LFF drive backplane connected to the system board Item Description Drive power cable Mini-SAS cable Cabling 100...
  • Page 101 • Four-bay LFF drive backplane connected to a P440 controller in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable • Four-bay LFF drive backplane connected to an H240 adapter in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Cabling 101...

  • Page 102: Eight-Bay Sff Hot-Plug Drive Cabling

    Eight-bay SFF hot-plug drive cabling • Eight-bay SFF drive backplane connected to the system board Item Description Drive power cable Mini-SAS cable • Eight-bay SFF drive backplane connected to a P440 controller in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Cabling 102...

  • Page 103: Fbwc Cabling

    • Eight-bay SFF drive backplane connected to an H240 adapter in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable FBWC cabling Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section. •...
  • Page 104 • FBWC module cabling for storage controller installed in PCIe slot 2 • FBWC module cabling for storage controller installed in PCIe slot 3 Cabling 104...

  • Page 105: M.2 Ssd Cabling

    M.2 SSD cabling • Slot 2 cable routing (2 ports supported when slot 1 is unoccupied) • Slot 2 cable routing (1 port supported when slot 1 is occupied) Cabling 105...
  • Page 106 • Slot 3 cable routing (2 ports supported when slot 1 is unoccupied) • Slot 3 cable routing (1 port supported when slot 1 is occupied) Cabling 106...
  • Page 107 • Slot 2 cable routing with FlexibleLOM riser (2 ports supported when slot 1 is unoccupied) • Slot 2 cable routing with FlexibleLOM riser (1 port supported when slot 1 is occupied) Cabling 107...

  • Page 108: Smart Storage Battery Cabling

    Smart Storage Battery cabling HPE Power supply cabling • HPE 550 W Power Supply cabling Item Description 16-pin power supply sideband signal cable 24-pin power supply cable Cabling 108...

  • Page 109: Optical Drive Cabling

    • RPS backplane cabling Item Description 16-pin power supply sideband signal cable 24-pin power supply cable 10-pin RPS cable for GPU Optical drive cabling • Four-bay LFF configuration Item Description Drive power cable Optical drive cable Cabling 109...

  • Page 110: Front I/O Cabling

    • Eight-bay SFF configuration Item Description Drive power cable Optical drive cable Front I/O cabling • Four-bay LFF configuration Item Description Front I/O cable USB 2.0 connector cable Ambient temperature sensor cable Cabling 110...

  • Page 111: Gpu Cabling

    • Eight-bay SFF configuration Item Description Front I/O cable USB 2.0 connector cable Ambient temperature sensor cable GPU cabling Cabling 111...

  • Page 112: Specifications

    Specifications Environmental specifications Specification Value — Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Nonoperating — Relative humidity (noncondensing) Minimum to be the higher (more moisture) of Operating -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity...

  • Page 113: Hot-Plug Power Supply Calculations

    • HPE 800 W/900 W Gold AC Power Input Module (PN 744689-B21) • HPE 900 W AC/240 V DC Gold Power Input Module (PN 775595-B21) For more information about the compatibility between the power input module and RPS backplane types, see "Power input module and RPS backplane characteristics (on page 79)."...

  • Page 114: Acronyms And Abbreviations

    Acronyms and abbreviations ABEND abnormal end alternating current Advanced Memory Protection application program interface ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers Customer Self Repair FBWC flash-backed write cache graphics processing unit host bus adapter HPE SIM HPE Systems Insight Manager hertz Integrated Lights-Out Integrated Management Log...
  • Page 115 large form factor nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test power supply unit RBSU ROM-Based Setup Utility redundant power supply serial attached SCSI SATA serial ATA Secure Digital Systems Insight Manager Service Pack for ProLiant Trusted Platform Module UEFI Unified Extensible Firmware Interface...
  • Page 116 unit identification universal serial bus Acronyms and abbreviations 116...

  • Page 117: Documentation Feedback

    Documentation feedback Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hpe.com). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.
  • Page 118 113 diagnosing problems 82 hot-swap fan 52 diagnostic tools 83, 85, 86, 88 HP Trusted Platform Module 81 dimensions and weight 112 HPE Insight Diagnostics 86, 87 DIMM slot locations 95 HPE Insight Diagnostics survey functionality 86, 87...
  • Page 119 re-entering the server serial number 86 remote support and analysis tools 87 LEDs, power fault 92 removal and replacement procedures 27 legacy USB support 87 remove server from rack 33 required tools 27 requirements, airflow 28 requirements, environmental 112 M.2 SSD cabling 105 ROM-Based Setup Utility (RBSU) 85 M.2 SSD enablement board 45 management tools 83...

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