Verifying Component Failure - HP P6000 Replacement Instructions

Verifying component failure

Analyze any failure messages received in the system logs.
Review HP fault monitoring software for provided recommended failure
information and recommended actions.
• Check the enclosure status LED (if VRM has failed it will be amber)
• Check the enclosure status LED.
• Green = Normal operation.
• Amber = Fault condition
• Off = Fan unseated from connector or failed.
Removing the VRM
1. Schedule a maintenance window.
2.
Stop all I/O to the enclosure.
3. Power down the enclosure by pressing and holding the On/Standby
button on the rear of disk enclosure, until the system power LED
changes from green to amber.
4. Remove all cabling from the rear of the enclosure. Ensure all cabling
is marked to facilitate re-cabling later.
WARNING!
A disk enclosure fully populated is heavy. Prior to
removing the enclosure from the rack, remove each
disk and label it with its bay number. Place each disk
on a clean surface. If this is not possible, two people
are required to remove the enclosure from the rack to
prevent injury.
5. Remove hard drives from the enclosure.
WARNING!
When removing drives keep them in order. They will
need to be returned to the same slots they were
removed from at the time of replacement.
Press the release button on the drive lever (1), and rotate the lever
to the left (2). Then, pull out and remove the disk drive from the
drive bays (3).
6. Loosen the thumbscrews that secure the enclosure to the front of the
rack, and remove the enclosure from the rack.
7. Remove the top access cover.
a.
Lift the access panel latch (1). The access panel will slightly
disengage from the enclosure.
b. Slide the access panel to the rear (2) and lift away from the
chassis.
NOTE:
A Torx tool with T-10 and T-15 ends is provided inside
the enclosure chassis, on top of the I/O module
housing.
8. Disengage the two power supplies from the internal connections to
the VRM by pressing the power supply mounting latch towards the
power supply and pulling the module slightly out of the enclosure
(2).
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