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1-4. Modifying Board
1-4-2. Modifying VA-158 Board
Parts Required
Description
Modification board (with jumper wires)
Sony bond SC608LVZ
Res, metal chip 20 kZ
Res, metal chip 51 kZ
Modification Procedures
1. Remove the VA-158 board.
2. Solder the jumper wires from the modification board to the positions specified by the figure.
3. Stick the modification board on the VA-158 board with Sony bond as shown in the figure.
(Shaded
portions)
4. Desolder the following five resistors.
R102, R104, CR106, R108, R109
5. Solder 20 kZ metal film resistors at the traces of R102, R104, and R106.
6. Solder 51 kZ metal film resistors at the traces of R108 and R109.
The HDC-700 with the following serial number needs the additional modification as follows.
HDC-700 (UCJ): Serial No.10001 to 10043
Description
Res, metal chip 100 kZ
Res, metal chip 150 kZ
7. Desolder the following four resistors.
R110, R300, R500, R700
8. Solder an 100 kZ metal film resistor at the trace of R110.
9. Solder 150 kZ metal film resistors at the traces of R300, R500, and R700.
H
L
K
J
G
R700
R500
1-6 (E)
Q'ty
Remarks
1
Supplied with HKC-7080
_
Sony Part No. 7-432-912-52
3
Sony Part No. 1-218-723-91
2
Sony Part No. 1-218-733-11
Q'ty
Remarks
1
Sony Part No. 1-218-740-11
3
Sony Part No. 1-218-744-11
C2
R8
E
D
C
F
R9 R5
R300
R108
VA-158 (B SIDE)
B
A
1
2
3
4
R104
5
R106
R102
6
R110
7
R109
HKC-7080
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