HP ProLiant DL560 Technology Brief page 4

For hyper-dense servers, form factor dictates the memory footprint and I/O slot count. The GC-LE
chipset offers an integrated memory controller that reduces board space and cost while offering
excellent performance for memory capacities up to 12 gigabytes (GB). In the ProLiant DL560 server,
use of direct-attach memory (Figure 3) eliminates the need for and cost of memory buffers like those
used in the ProLiant DL580 Generation 2 server (Figure 4).
Figure 2. ServerWorks Grand Champion LE chipset architecture
Pentium 4 Xeon Processors
8B
DDR 200
GC LE
CMIC-
8B
DDR 200
Legacy I/O
Figure 3. Block diagram of the ProLiant DL560 system architecture
Xeon with Xeon with
2MB L3
cache
200MHz
Dual interleaved
133MHz
PCI-X PCI-X
PCI-X PCI-X 100MHz
PCI-X
CIOB-X
L
IMBus
E
CIOB-X
CSB5
32-bit PCI
Xeon with
2MB L3 2MB L3
FSB
cache cache
CMIC-LE
Thin
IMB
IMB 2 IMB 1
CIOB-X2
CIOB-X2
100MHz 100MHz
NC7781
Smart
Array
NC7781
5i Plus
BMC5701
BMC5701
Xeon with
2MB L3
cache
USB (2)
IDE
ROM
CSB5
PC87413
Super I/O
PCI
Keyboard
Mouse
Rage XL
Serial
Diskette
iLO
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