Sony NW-S603 Service Manual page 15

• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• All board are multi-layer printed board.
However, the patterns of intermediate-layers have not been
included in diagrams.
* Replacement of IC201, IC2701, IC3005 and IC3007 on
the MAIN board used in this set requires a special tool.
• Lead Layouts
Lead layout of conventional IC CSP (chip size package)
NW-S603/S605/S703F/S705F/S706F
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 3.7 V and fed with regulated dc power
supply from CN601 pin 1 and pin 2 on the MAIN board.
• Voltages are dc with respect to ground under no-signal
conditions.
no mark : PLAY BACK
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
F : AUDIO
* Replacement of IC201, IC2701, IC3005 and IC3007 on
surface
the MAIN board used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
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NW-S603/S605/S703F/S705F/S706F