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Philips Semiconductors
Smart card interface
PACKAGE OUTLINES
DIP28: plastic dual in-line package; 28 leads (600 mil)
handbook, full pagewidth
L
Z
28
pin 1 index
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
1
UNIT
max.
min.
mm
5.1
0.51
inches
0.20
0.020
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT117-1
1996 Dec 12
D
e
A
2
b
b
1
max.
1.7
0.53
4.0
1.3
0.38
0.066
0.020
0.16
0.051
0.014
REFERENCES
IEC
JEDEC
051G05
MO-015AH
b
1
b
15
14
0
5
10 mm
scale
(1)
(1)
c
D
E
0.32
36.0
14.1
2.54
0.23
35.0
13.7
0.013
1.41
0.56
0.10
0.009
1.34
0.54
EIAJ
20
A
2
A
A
1
c
w
M
E
e
e
L
M
1
E
3.9
15.80
15.24
3.4
15.24
0.15
0.62
0.60
0.13
0.60
EUROPEAN
PROJECTION
Product specification
TDA8001
SOT117-1
M
E
(e )
1
M
H
(1)
Z
M
w
H
max.
17.15
0.25
1.7
15.90
0.68
0.01
0.067
0.63
ISSUE DATE
92-11-17
95-01-14
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