Advertisement
Philips Semiconductors
Smart card interface
4
handbook, halfpage
P tot
(W)
3
2
1
0
50
0
Fig.10 Power derating curve (DIP28).
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 , 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.
THERMAL CHARACTERISTICS
SYMBOL
R
thermal resistance from junction to ambient in free air
th j-a
SOT117-1
SOT136-1
1996 Dec 12
MBE256
50
100
150
o
T
( C)
amb
PARAMETER
3
handbook, halfpage
P tot
(W)
2
1
0
50
0
Fig.11 Power derating curve (SO28).
13
Product specification
TDA8001
MBE255
50
100
150
o
T
( C)
amb
VALUE
UNIT
30
K/W
70
K/W
Advertisement
