1. Manuals
  2. Brands
  3. Sony Manuals
  4. Cordless Telephone
  5. SPP-S9101 - Cordless Telephone
  6. Service manual

Sony SPP-S9101 Service Manual

Hide thumbs Also See for SPP-S9101:
Table of Contents

Advertisement

Quick Links

Download this manual See also: Service Schematics
SPP-S9101
SERVICE MANUAL
US Model
Canadian Model
SPECIFICATIONS
CORDLESS TELEPHONE
MICROFILM
1

Advertisement

Table of Contents
loading

Related Manuals for Sony SPP-S9101

Summary of Contents for Sony SPP-S9101

  • Page 1 SPP-S9101 SERVICE MANUAL US Model Canadian Model SPECIFICATIONS CORDLESS TELEPHONE MICROFILM...

  • Page 2: Table Of Contents

    FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS 6-1. IC Block Diagrams ............. 25 QUE PAR DES PIÈCES SONY DONT LES NUMÉROS 6-2. Printed Wiring Boards – Base Unit/LED Section – .... 26 6-3. Schematic Diagram – Base Unit (1/2) Section – ....28 SONT DONNÉS DANS CE MANUEL OU DANS LES...

  • Page 3: General

    SECTION 1 This section is extracted from instruction manual. GENERAL...

  • Page 12: Disassembly

    SECTION 2 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given. 2-1. BATTERY CASE LID (HANDSET) 2-2. CABINET (REAR)(HANDSET) Cabinet (rear) Nickel cadmium battery Two screws (BTP 2.6x8) Battery case lid 2-4. CABINET AND BOARDS (BASE UNIT) 2-3. HAND MAIN BOARD (HANDSET) 4 Three connectors Screw (BTP 2.6x12) 6 Antenna terminal...

  • Page 13: Mhz System Operation

    SECTION 3 900 MHz SYSTEM OPERATION 3-1. ACCESS METHOD 3-2. PROTOCOL 1. Transfer Format & Rate 1. General The transfer format & rate of our system is as follows; This system realizes the TX/RX superframe by TDD system. The relation of master/slave dose not decide identification regarding Table 3-1.
  • Page 14 4. Stand-by Mode Operation (1) HANDSET When the HANDSET is the stand-by mode (sleep mode), the HANDSET do the intermittent operation for power save, be- cause the HANDSET is the battery operation. This process of stand-by mode operation is as follows. 10 sec 10 sec Heart-Beat...
  • Page 15 5. Link Establishment Master Slave According to the following Fig. 3-1, the requested side for link establishment is the master. The system have to exchange the A-Frame for link establishment, and each system ID should be the same ID, and then the system A-Frame link is established.

  • Page 16: Test Mode

    SECTION 4 TEST MODE 4-1. BASE UNIT TEST MODE A 4-1-1. BASE UNIT Test Mode A-1 1. In test mode idling A and the P (PULSE)/ T (TONE) switch set to the P (PULSE) state, pressing the HANDSET LOCATOR Manual System Test Mode key changes the mode as shown below.

  • Page 17: Base Unit Test Mode B

    4-2-1. BASE UNIT Test Mode B-1 4-2. BASE UNIT TEST MODE B 1. In test mode idling B with the P (PULSE)/T (TONE) switch set to the T (TONE) state, pressing the HANDSET LOCATOR key Manual System Test Mode changes the mode as shown below. 2.

  • Page 18: Handset Test Mode

    4-3. HANDSET TEST MODE [Handset AUDIO Input/Output Level Measurement [CODEC Forward Loopback (L1); 2-4-#]] [Start-Up] 1. Press the TALK , 0 , and 1 keys simultaneously to start. Setting: 2. The normal ringer is rung at a high level for 500 msec after start- ing, and the TALK LED and BATT LOW LED blink together.

  • Page 19: Rf Testing

    4-4. RF TESTING E) MMI Test This test is for checking the RF system without disassembling the Mode/Operation Command set in servicing. Perform measurement using the spectrum analyzer 5-1-# Key matrix test and jig antenna. JOG shuttle test 5-2-# 4-4-1. RF Testing method LCD test 5-3-# Please follow the below instruction to perform RF test.
  • Page 20 • Transmission Wave: –16.00 dBm ATTEN 10 dB 0 dBm 10 dB/ 903.392 MHz –5 –6 –1 –4 –7 903.392 MHz 18dB –3 –16.00 dBm –2 –8 –9 CENTER 904.2 MHz SPAN 5.000 MHz Fig. 4 50.0 msec 30 KHz 30 kHz Fig.
  • Page 21 • Measurement: Measure peak level by Spectrum analyzer. 903.587 MHz .0 dBm AT 10 dB –3.67 dBm PEAK PLOTTER ADRS WA SB SC FC CORR CENTER 903.600 MHz SPAN 5.000 MHz RES BW 1.0 MHz VBW 100 kHz SWP 20.0 msec •...

  • Page 22: Electrical Adjustments

    SECTION 5 ELECTRICAL ADJUSTMENTS 5-1. BASE UNIT SECTION 3. Checking TX Output Setting: • Make the set in Test mode (see page 16) peak power meter 1. Checking RX I&Q Output Level Setting: ANTENNA TERMINAL – oscilloscope level meter TP558: RXIP Procedure: TP557: RXIN 1.

  • Page 23: Handset Section

    5-2. HANDSET SECTION 3. Checking TX Output Setting: • Make the set in Test mode (see page 16) peak power meter 1. Checking RX I&Q Output Level Setting: ANTENNA TERMINAL (TP812) – oscilloscope level meter TP804: RXIP Procedure: TP803: RXIN 1.
  • Page 24 ADJUSTMENT LOCATION: [BASE MAIN BOARD] (Conductor Side) TP555 : RXQN TP556 : RXQP TP557 : RXIN TP558 : RXIP level meter Chcking RX I & Q Output Level short : TP515 ˜ TP567 (GND) Checking TX Center Frequency ANTENNA TERMINAL : Checking RX I &...

  • Page 25: Diagrams

    SPP-S9101 SECTION 6 DIAGRAMS 6-1. IC BLOCK DIAGRAMS WAVEFORMS THIS NOTE IS COMMON FOR PRINTED WIRING – BASE UNIT SECTION – BOARDS AND SCHEMATIC DIAGRAMS. • BASE MAIN Board • HAND MAIN Board (In addition to this, the necessary note is printed IC502 S-24C01AFJA-TB-01 IC402 AT24C32N-10SI-1.8-TR...

  • Page 26: Printed Wiring Boards - Base Unit/Led Section

    SPP-S9101 6-2. PRINTED WIRING BOARDS – BASE UNIT/LED SECTION – • Semiconductor Location Ref. No. Location D323 D326 D327 IC501 IC901 Q902 Q903 Q904 Q905 Q907 Q908 • Semiconductor Location Ref. No. Location D571 D572 D573 D574 Q571 Q572 (Page 27)
  • Page 27 SPP-S9101 • Semiconductor Location Ref. No. Location D101 D102 D103 D104 D105 D106 D107 D108 D301 D303 E-10 D304 D305 D306 D309 D310 D321 D322 D324 D325 D502 D503 D901 D921 D922 D923 D924 IC301 IC302 IC502 IC902 Q101 Q102...

  • Page 28: Schematic Diagram - Base Unit (1/2) Section

    SPP-S9101 6-3. SCHEMATIC DIAGRAM – BASE UNIT (1/2) SECTION – • See page 25 for Waveforms. • See page 25 for IC Block Diagram. • See page 26, 27 for Printed Wiring Board. • See page 32 for IC Pin Functions.

  • Page 29: Schematic Diagrams - Base Unit (2/2)/Led Section

    SPP-S9101 6-4. SCHEMATIC DIAGRAMS – BASE UNIT (2/2)/LED SECTION – • See page 26, 27 for Printed Wiring Board. C315 0.1p R320 R321 330k 220k C966 TP583 0.1p JC904 C967 0.001 PS2501L-1-E3 IC903 CMX673P1 IC903 STTVTER-TONE (Page 28) JC905 JC511...

  • Page 30: Printed Wiring Board - Handset Section

    SPP-S9101 6-5. PRINTED WIRING BOARD – HANDSET SECTION – • Semiconductor Location Ref. No. Location D201 D-12 D202 D-10 D203 D-11 D205 D-10 D206 D207 C-11 D208 D-12 D209 C-11 D401 D410 D413 D414 D415 D422 D601 B-13 D801 IC201...

  • Page 31: Schematic Diagram - Handset Section

    SPP-S9101 6-6. SCHEMATIC DIAGRAM – HANDSET SECTION – • See page 25 for Waveforms. • See page 33 for IC Pin Functions. Q404 B+ SWITCH LCD401 LIQUID CRYSTAL DISPLAY UNIT L204 22nH (ILLUMINATION) QUAD EXCLUSIVE OR GATE...

  • Page 32: Ic Pin Functions

    SPP-S9101 6-7. IC PIN FUNCTIONS • BASE MAIN BOARD IC501 R6797-71 (HUMMINGBIRD ASIC) Pin No. Pin Name Function Pin No. Pin Name Function VSSC – VSS supply to core CDCICLK – Bit clock input/output for digital serial interface Not used (open) VDDP –...
  • Page 33 • HAND MAIN BOARD IC401 R6797-71 (HUMMINGBIRD ASIC) Pin No. Pin Name Function VSSC – VSS supply to core VDDP – VDD supply to pad ring VSSP – VSS supply to pad ring OSCO 9.6 MHz crystal oscillator output OSCI 9.6 MHz crystal oscillator input RING ON/OFF Detection signal input of the ringer coming...
  • Page 34 Pin No. Pin Name Function Bit clock input/output for digital serial interface Not used (open) CDCICLK – Codec reset RESETOP Keypad bidirectional control/LCD data KEYPADC0 – Keypad bidirectional control/LCD data KEYPADC1 – Keypad bidirectional control/LCD data KEYPADC2 – Keypad bidirectional control/LCD data KEYPADC3 –...

  • Page 35: Exploded Views

    SECTION 7 EXPLODED VIEWS NOTE: • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. •...

  • Page 36: Base Unit Section

    A-3622-341-A BASE(MAIN) BOARD, COMPLETE 3-034-830-01 HOLDER (HAND SET) 3-037-080-01 CAP(ANTENNA) 3-034-832-01 LENS(C-ID) 3-034-834-01 TERMINAL (B BATTERY), CHARGE 3-034-831-01 BUTTON (H.L.) 4-946-905-11 ENBLEM (NO.4.5), SONY 3-034-829-01 LID(BASE), BATTERY CASE * 56 1-674-890-11 LED BOARD 3-034-835-01 PANEL(C-ID) 3-034-833-01 TERMINAL (BASE), CHARGE X-3377-755-1 CABINET (LOWER) ASSY...

  • Page 37: Electrical Parts List

    SECTION 8 BASE (MAIN) ELECTRICAL PARTS LIST Note: • Due to standardization, replacements in the parts list • SEMICONDUCTORS The components identified by In each case, u: µ , for example: may be different from the parts specified in the mark ! or dotted line with mark uA...: µ...
  • Page 38 BASE (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C947 1-163-243-11 CERAMIC CHIP 47PF < FUSE > C948 1-163-243-11 CERAMIC CHIP 47PF ! F101 1-533-542-11 FUSE (250V/500mA) C950 1-163-243-11 CERAMIC CHIP 47PF C951 1-164-004-11 CERAMIC CHIP 0.1uF <...
  • Page 39 BASE (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark ! PH102 8-749-016-30 PHOTP COUPLER PS2533L-1-E3 R508 1-216-097-00 RES,CHIP 100K 1/10W ! PH901 8-749-016-34 PHOTO COUPLER PS2502L-1-K-E3 R509 1-216-073-00 METAL CHIP 1/10W R511 1-216-041-00 METAL CHIP 1/10W <...
  • Page 40 BASE (MAIN) HAND (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R925 1-216-105-00 RES,CHIP 220K 1/10W A-3622-339-A HAND (MAIN) BOARD, COMPLETE R926 1-216-085-00 METAL CHIP 1/10W ************************** R927 1-216-295-00 SHORT R928 1-216-097-00 RES,CHIP 100K 1/10W 3-034-819-01 TERMINAL (H BATTERY), CHARGE R929 1-216-667-11 METAL CHIP...
  • Page 41 HAND (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C622 1-163-239-11 CERAMIC CHIP 33PF < COIL > C624 1-163-169-00 CERAMIC CHIP 33PF C625 1-117-370-11 CERAMIC CHIP 10uF L201 1-412-945-11 INDUCTOR 3.3uH L202 1-216-296-00 SHORT C627 1-117-370-11 CERAMIC CHIP 10uF L203...
  • Page 42 HAND (MAIN) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R414 1-216-073-00 METAL CHIP 1/10W R807 1-216-039-00 METAL CHIP 1/10W R415 1-216-817-11 METAL CHIP 1/16W R416 1-216-817-11 METAL CHIP 1/16W < MODULATOR > R417 1-216-097-00 RES,CHIP 100K 1/10W RFU801 1-418-269-11 RF UNIT...
  • Page 43 Ref. No. Part No. Description Remark ACCESSORIES & PACKING MATERIALS ******************************* 1-475-780-31 ADAPTOR, AC (AC-T123) 1-528-976-11 BATTERY, NI-CD (BP-T31) 1-696-453-21 CORD (WITH MODULAR PLUG)(LINE)(22 cm) 1-696-454-11 CORD (WITH MODULAR PLUG)(LINE)(2m 15 cm) 3-012-379-31 WALL BRACKET 3-866-975-11 MANUAL,INSTRUCTION (US)(ENGLISH, SPANISH) 3-866-975-21 MANUAL,INSTRUCTION (CND)(ENGLISH, FRENCH) 3-866-976-11 GUIDE, QUICK START (US)(ENGLISH, SPANISH) 3-866-976-21 GUIDE, QUICK START (CND)(ENGLISH, FRENCH)
  • Page 44 SPP-S9101 Sony Corporation 99H090216-1 9-926-599-11 Printed in Japan © 1999. 8 Digital Telecommunication Company Published by Mobile Electronics Company Quality Assurance Dept.

Table of Contents