Sec 1: 8-20
II.
Gently separate the Control Top Assembly (J) from the Main Chassis Assembly (K).
NOTE: Place the Control Top Assembly (J) and the remaining Main Chassis Assembly (K)
8.8
Serviceable Components of the Main Sub-Assemblies
8.8.1
Servicing Main Chassis Assembly (K)
Thermal Pad (8)
Universal Connector
Boss Cap (34)
Figure 8-28. Serviceable Components – Main Chassis Assembly
8.8.1.1 Servicing Chassis Pads:
1. Complete steps from
Disassembly" on page
2. Carefully peel off the pad(s) that need replacing (i.e. VOCON Pad (8),
Expansion Board Pad (8) and/or Coin Cell Pad (7) from the chassis.
3. Use the Black Stick to help remove any difficult sections of the pad(s).
4. Clean the area once the pad(s) are removed to ensure it is free of adhesive and debris.
5. Peel the liner off the new pad(s) and place in the respective location.
6. Apply slight pressure to set the adhesive.
8.8.1.2 Servicing Chassis Screw Boss Cap:
1. Complete steps from
Disassembly" on page
2. Carefully pry off the Universal Connector Boss Cap (34) with the Black Stick from the
Main Chassis Assembly (3) as shown in
3. Press the new Cap down onto the boss until it is fully seated.
NOTE: There should be no gap between the chassis boss top face and the corresponding
Disassembly/Reassembly Procedures: Serviceable Components of the Main Sub-Assemblies
on an ESD safe surface free from debris.
O-Ring (5)
Section 8.7.1.
1:8-12.
Section 8.7.1.
1:8-12.
interior surface of the cap.
Thermal Pad (8)
Chassis Ground Contact (6)
through
Section 8.7.9.
through
Section 8.7.4.
Figure 8-28.
Microphone Seal (4)
Coin Cell Pad (7)
of
Section "8.7 Radio
of
Section "8.7 Radio