Motorola ET1 Integrator Manual page 120

A - 2 ET1 Enterprise Tablet Integrator Guide
ET1 Technical Specifications (Continued)
Table A-1
Item
Performance Characteristics
CPU
Operating System
Memory
Interface/Communications
Output Power
User Environment
Operating Temperature
Storage Temperature
Charging Temperature
Humidity
Drop Specification
Tumble
Electrostatic Discharge (ESD)
Sealing
Wireless LAN Data and Voice Communications
Wireless Local Area Network
(WLAN) radio
Data Rates Supported
Operating Channels
Security
Spreading Technique
Wireless PAN Data and Voice Communications
Bluetooth
Texas Instruments OMAP 4430 @ 1 GHz
Android 2.3
1 GB RAM/4 GB Flash plus 4 GB microSD card. User accessible microSD
card slot supports up to 32 GB.
USB 1.1 Full-speed
USB (Docking Connector): 5 VDC @ 500 mA max.
USB (Expansion Module): 5 VDC @ 500 mA max.
0°C to 50°C (32°F to 122°F)
-40°C to 70°C (-40°F to 158°F)
0° C to 40° C (32°F to 104°F)
10% to 95% RH non-condensing
Multiple 1.2 m (4 ft.) drops per MIL-STD 810G specifications.
1000 0.5 m (1.6 ft.) tumbles (2000 drops) per IEC tumble specifications
+/-15kVdc air discharge, +/-8kVdc direct discharge, +/-8kVdc indirect
discharge
IP54
®
IEEE 802.11a/b/g/n with internal antenna
1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, and 54 Mbps
Note that 802.11n data rates may be higher.
Chan 36-165 (5180 – 5825 MHz), Chan 1-13 (2412-2472 MHz); actual
operating channels/frequencies depend on regulatory rules and
certification agency
Security Modes: Legacy, WPA and WPA2
Encryption: WEP (40 and 128 bit), TKIP and AES
Authentication: TLS, TTLS (MS-CHAP), TTLS (MS-CHAP v2), TTLS
(CHAP), TTLS (PAP), PEAP-TLS, PEAP (MS-CHAP v2), EAP -FAST-TLS,
EAP-FAST (MS-CHAP v2).
Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency
Division Multiplexing (OFDM)
Class II, v 2.1 with EDR; integrated antenna.
Description