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4)
Metal Mask Design
Since this connector is designed with an ultra low-profile, pay attention to the
following precautions for reflow soldering.
(1)In addition to the amount of applied solder, the reflow-soldering environment and
temperature profile affect the finish quality after reflow soldering. Make sure to
adjust the amount of solder applied after checking the finish quality in a test run.
(2)Compared with natural air reflow soldering, N2 reflow soldering can reduce
oxidization of the melted solder surface. This significantly improves the solder
wettability. Therefore, make sure to apply an appropriate amount of solder.
(3)Do not apply an excessive amount of solder,
near the contact section and reduce contact reliability or cause interference during
mating. Pay careful attention.
(4)It is recommended that solder with a grain diameter of 40
as to print a constant amount of solder.
Panasonic Corporation
industrial.panasonic.com/ac/e/
Operation manual for Narrow-pitch connectors A35UH
otherwise, solder or flux may creep
©
- 12 -
Panasonic Corporation 2017
μ
m or smaller is used so
ACCTF32E 201704
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