Table of Contents
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Bosch Sensortec | HSMI BME280
Index of Contents
1.
Package outline dimensions ........................................................................................................ 5
1.1.
Top view .............................................................................................................................. 5
2.
Device marking .............................................................................................................................. 6
2.1.
Mass production devices ..................................................................................................... 6
2.2.
Engineering samples ........................................................................................................... 6
3.
Moisture sensitivity level and soldering .................................................................................... 7
3.1.
MSL and device storage ...................................................................................................... 7
3.2.
Multiple reflow soldering cycles ........................................................................................... 7
3.3.
Reconditioning Procedure ................................................................................................... 8
3.4.
Classification reflow profile .................................................................................................. 8
4.
Environmental safety .................................................................................................................. 10
4.1.
RoHS compliancy .............................................................................................................. 10
4.2.
Halogen content ................................................................................................................ 10
4.3.
Internal package structure ................................................................................................. 10
5.
Mounting recommendations ...................................................................................................... 10
5.1.
Recommendation details for the humidity measurement.................................................... 11
5.2.
Thermal coupling of the sensor element ............................................................................ 14
5.3.
Additional recommendation details .................................................................................... 15
5.4.
Push-button contacts ......................................................................................................... 17
5.5.
Hot-spots on the PCB ........................................................................................................ 18
5.6.
PCB anchor points ............................................................................................................. 18
5.7.
Resin coatings ................................................................................................................... 19
5.8.
Minimum distance between Sensor and PCB .................................................................... 19
5.9.
Underfill and cleaning materials ......................................................................................... 20
Document number BST-BME280-HS006-00 | May 2018
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
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