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Philips Semiconductors
17. Package outline
SO28: plastic small outline package; 28 leads; body width 7.5 mm
y
Z
28
pin 1 index
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
A
A
1
max.
0.30
2.45
mm
2.65
0.10
2.25
0.012
0.096
inches
0.10
0.004
0.089
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT136-1
Fig 23. SO28 package outline.
9397 750 09238
Product data
D
e
0
(1)
A
b
c
D
2
3
p
0.49
0.32
18.1
0.25
0.36
0.23
17.7
0.019
0.013
0.71
0.01
0.014
0.009
0.69
REFERENCES
IEC
JEDEC
075E06
MS-013
Rev. 08 — 20 December 2001
USB interface device with parallel bus
c
15
A
2
A
1
14
w
M
b
p
5
10 mm
scale
(1)
E
e
H
L
L
E
7.6
10.65
1.1
1.27
1.4
7.4
10.00
0.4
0.30
0.419
0.043
0.050
0.055
0.29
0.394
0.016
EIAJ
PDIUSBD12
E
A
H
E
Q
(A )
3
θ
L
p
L
detail X
Q
v
w
y
p
1.1
0.25
0.25
0.1
1.0
0.043
0.01
0.01
0.004
0.039
EUROPEAN
ISSUE DATE
PROJECTION
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
SOT136-1
X
v
A
M
A
(1)
θ
Z
0.9
0.4
o
8
o
0
0.035
0.016
97-05-22
99-12-27
29 of 35
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