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Huawei MU609 Getting To Know Manual page 6

Hspa lga module
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Requirements on PCB Layout
The thickness of PCB is more than 1.0 mm (1.2 mm recommended) to reduce the
deformation caused by high temperature welding.
The minimum distance between the LGA module and the PCB edge is 1.5 mm. Other
devices must be located more than 1 mm away from the LGA module (more than 3 mm
recommended if rework is considered).
When the PCB layout is double sided, it is recommended that the LGA module be
placed on the second side for assembly.
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