Huawei MU609 Getting To Know Manual page 5
Hspa lga module
Hide thumbs
Also See for MU609:
- Application manual (146 pages) ,
- Hardware manual (81 pages) ,
- Development kit manual (20 pages)
Advertisement
PCB Design
PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows: the sizes of the solder pads on customers'
PCBs are the same as those of the module's solder pads for the high production
efficiency and high reliability of solder joints. For details, see the following figure:
2
Advertisement
