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DATA SHEET CGY2014TT GSM/DCS/PCS power amplifier Product specification Supersedes data of 2000 Apr 11 File under Integrated Circuits, IC17 INTEGRATED CIRCUITS 2000 Oct 16...
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CGY2014TT HTSSOP20 2000 Oct 16 GENERAL DESCRIPTION The CGY2014TT is a dual-band GSM/DCS/PCS GaAs Monolithic Microwave Integrated Circuit (MMIC) power amplifier. The circuit is specifically designed to operate at 3.6 V battery supply voltage. The power amplifier requires only a 30 dB harmonic low-pass filter to comply with the transmit spurious specification.
DCS/PCS power amplifier output and third stage supply voltage not connected not connected ground FUNCTIONAL DESCRIPTION Operating conditions The CGY2014TT is designed to meet the European n.c. Telecommunications Standards Institute (ETSI) GSM n.c. documents, the “ETS 300 577 specification” , which are defined as follows:...
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Philips Semiconductors GSM/DCS/PCS power amplifier LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER positive supply voltage maximum operating junction temperature j(max) storage temperature total power dissipation GSM input power i(LB) DCS/PCS input power i(HB) Note 1.
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Philips Semiconductors GSM/DCS/PCS power amplifier AC CHARACTERISTICS = 3.5 V; T = 25 C; measured on the Philips demoboard (see Fig.8). SYMBOL PARAMETER Low band: GSM power amplifier input power i(LB) RF frequency range RF(LB) maximum output power o(LB)(max) efficiency...
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Philips Semiconductors GSM/DCS/PCS power amplifier Performance characteristics in GSM band handbook, halfpage efficiency (dBm) output power = 3 V. (1) T DD1(LB) = 3.5 V. (2) T DD2(LB) DD3(LB) = 0 dBm. (3) T i(LB) Fig.3 Output power and efficiency as a function of the frequency.
Philips Semiconductors GSM/DCS/PCS power amplifier APPLICATION INFORMATION V d23DCS handbook, full pagewidth 10 nF RF in DCS 3.9 nH TRL1 V d1DCS 1 nF V d1GSM 3.3 nH 1 nF RF in GSM V d23GSM (1) Pin 16 is internally connected to ground and should not be connected to the board.
Philips Semiconductors GSM/DCS/PCS power amplifier PACKAGE OUTLINE HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm heathsink side pin 1 index DIMENSIONS (mm are the original dimensions) UNIT max. 0.15 0.95 1.10 0.25 0.05 0.80 Notes 1.
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Philips Semiconductors GSM/DCS/PCS power amplifier SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages”...
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Philips Semiconductors GSM/DCS/PCS power amplifier Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1.
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This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
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Philips Semiconductors Product specification GSM/DCS/PCS power amplifier CGY2014TT NOTES 2000 Oct 16...
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Philips Semiconductors Product specification GSM/DCS/PCS power amplifier CGY2014TT NOTES 2000 Oct 16...