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SPP-68
SERVICE MANUAL
E Model
SPECIFICATIONS
CORDLESS TELEPHONE
MICROFILM

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Summary of Contents for Sony SPP-68

  • Page 1 SPP-68 SERVICE MANUAL E Model SPECIFICATIONS CORDLESS TELEPHONE MICROFILM...
  • Page 2: Table Of Contents

    AND IN THE PARTS LIST ARE CRITICAL TO SAFE ELECTRICAL ADJUSTMENTS OPERATION. REPLACE THESE COMPONENTS WITH 5-1. Base Unit Section ............13 SONY PARTS WHOSE PART NUMBERS APPEAR AS 5-2. Handset Section ............... 14 SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.
  • Page 3: Servicing Notes

    SECTION 1 SERVICING NOTES PREVENT ELECTROSTATIC DESTRUCTION • To prevent electrostatic destruction in replacing the main board, etc., fasten the CN602 cable as shown below. CN602 C502 SUB board JW10 C303 BASE MAIN board D101 JW12 cabinet lower – 3 –...
  • Page 4: General

    SECTION 2 This section is extracted from instruction manual. GENERAL – 4 –...
  • Page 5 – 5 –...
  • Page 6: Disassembly

    SECTION 3 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given. • HANDSET REAR CABINET 3 two claws 4 Removal the rear cabinet to direction of the arrow A . 2 two screws (BTP2.6 × 8) 1 battery case lid 3 two claws HAND MAIN BOARD 1 screw...
  • Page 7 • BASESET BASESET (UPPER) ASS’Y 2 baseset (upper) ass’y 1 two screws (P3 × 10) 3 connector (CN301) 1 screw (P3 × 10) 1 screw (P3 × 10) BASE MAIN BOARD 1 three screws (BTP2.6 × 8) 4 SUB board 2 screw (BTP2.6 ×...
  • Page 8: Test Mode

    SECTION 4 TEST MODE 4-1. BASE UNIT SECTION <Enter the Test Mode> Manual Test Mode Machine Test Mode [DIAL MODE] 1. Set the switch to “P” (pulse). 1. With one of the CH setting terminals in “H” input state, cause [PAGE] 2.
  • Page 9 Channel Setting During startup in machine test mode, make the following channel settings by loading the terminal input data. @£ @¢ @∞ @§ Pin No. TX Frequency RX Frequency Channel M1 (TP61) M2 (TP62) M3 (TP63) M4 (TP64) (MHz) (MHz) 43.720 48.760 43.740...
  • Page 10: Handset Section

    4-2. HANDSET SECTION <Enter the Test Mode> Manual Test Mode Machine Test Mode 1. Enter the test mode by pressing key while pressing the 1. When power on reset is applied while a H (high) is input to the [TALK] TEST SW (TP43) terminal (IC501 pin $º), the RING (Level key and when in idle condition.
  • Page 11 Channel Setting During startup in machine test mode, make the following channel settings by loading the terminal input data. #¢ #£ #™ #¡ @ª Pin No. RX Frequency TX Frequency Channel ROW 5 (TP13) ROW 4 (TP14) ROW 3 (TP15) ROW 2 (TP16) ROW 1 (TP17) (MHz) (MHz) 43.720...
  • Page 12 Key processing (Setting the manual test mode) 1. (Upper position) (Lower Position) Set with #. 2. 3X# can be substituted with X . Upper position Lower position QUIT 10ch 20ch Batt Alarm KEY TEST 11ch 21ch CHARG DET 12ch 22ch 13ch 23ch 14ch...
  • Page 13: Electrical Adjustments

    SECTION 5 ELECTRICAL ADJUSTMENTS 5-1. BASE UNIT SECTION RX Section Adjustment • Apply 9 V dc from regulated DC power supply. 1. RX Level Adjustment • Set to base unit machine test mode. (See page 8) • Switch position: • Perform the adjustment at T3CH (28CH: 49.910 MHz) as a rule. SW302 (DIAL MODE): P (pulse) Setting : FM RF SSG...
  • Page 14: Handset Section

    3. RSSI (H) Sensitivity Adjustment 5-2. HANDSET SECTION • Perform the adjustment at T3CH (28CH: 49.910 MHz) as a rule. • Apply 4 V dc from regulated DC power supply. Setting : • Set to handset machine test mode. (See page 10) AF ocillator FM RF SSG TX Section Adjustment...
  • Page 15 3. RSSI (H) Sensitivity Adjustment RX Section Adjustment • Perform the adjustment at T1CH (26CH: 43.780 MHz) as a rule. 1. RX Level Adjustment Setting : • Perform the adjustment at T1CH (26CH: 43.780 MHz) as a rule. Setting : AF ocillator FM RF SSG FM RF SSG...
  • Page 16 Adjustment Location : [BASE MAIN Board] (Component Side) RV101 RSSI (H) Sensitivity Adjustment FL101 RX Level Adjustment L101 RX VT Adjustment L52 TX VT Adjustment [BASE MAIN Board] (Conductor Side) TP3 (RF GND) (RX VT) TP6 (TX VT) CF101 IC101 TP19 (GND) TP9 (SIG OUT) IC501...
  • Page 17 Adjustment Location : L52 TX VT Adjustment [HAND MAIN Board] (Component Side) L102 RX VT Adjustment RV101 RSSI (H) Sensitivity Adjustment FL101 RX Level Adjustment [HAND MAIN Board] (Conductor Side) TP27 (SP) TP26 (SP) TP3 (RX GND) L102 IC501 IC101 (RX VT) (SIGIN) TP6 (TX VT)
  • Page 18: Diagrams

    SPP-68 SECTION 6 DIAGRAMS 6-1. BLOCK DIAGRAM – BASE UNIT Section – • SIGNAL PATH FL101 : RX (DET) MIX, IF AMP, LIMITER AMP, : TX RX LEVEL PLL, EXPANDER/COMPRESSOR : BELL IC101 IC101 (1/2) IC101 (2/2) RX FREQUENCY: 49.67 – 49.99MHz...
  • Page 19: Block Diagram - Handset Section

    SPP-68 6-2. BLOCK DIAGRAM – HANDSET Section – • SIGNAL PATH FL101 : RX (DET) MIX, IF AMP, LIMITER AMP, : TX RX LEVEL PLL, EXPANDER/COMPRESSOR : BELL IC101 IC101 (1/2) IC101 (2/2) RX FREQUENCY: 46.61 – 46.97MHz MIX1 CF102...
  • Page 20: Notes For Printed Wiring Board And Schematic Diagram

    6-3. NOTES FOR PRINTED WIRING BOARD AND SCHEMATIC DIAGRAM • Waveforms – BASE MAIN Board – Note on Schematic Diagram: Note on Printed Wiring Boards: 1 IC101 3 (Test Mode) • X : parts extracted from the component side. • All capacitors are in µF unless otherwise noted. pF: µµF •...
  • Page 21: Printed Wiring Boards - Base Unit Section

    SPP-68 6-4. PRINTED WIRING BOARDS – BASE UNIT Section – • Semiconductor Location Ref. No. Location D101 D201 D203 D204 D205 D301 D401 D501 D602 IC101 IC301 IC501 PH201 PH202 Q201 Q202 Q203 Q301 Q302 Q401 Q402 Q403 – 25 –...
  • Page 22: Schematic Diagram – Base Unit Section

    SPP-68 6-5. SCHEMATIC DIAGRAM – BASE UNIT Section – • See page 24 for Waveforms. – 27 – – 28 –...
  • Page 23: Printed Wiring Board - Handset Section

    SPP-68 6-6. PRINTED WIRING BOARD – HANDSET Section – • Semiconductor Location (Conductor Side) Ref. No. Location Ref. No. Location D101 D202 B-13 D301 A-13 D501 D502 A-10 Q201 Q202 C-13 D504 A-11 Q301 A-13 IC101 Q501 Q502 IC201 D-13...
  • Page 24: Schematic Diagram – Handset Section

    SPP-68 6-7. SCHEMATIC DIAGRAM – HANDSET Section – • See page 24 for Waveforms. – 31 – – 32 –...
  • Page 25: Ic Pin Function Description

    • HAND MAIN BOARD IC501 SH66358C-4J91 (SYSTEM CONTROLLER) 6-8. IC PIN FUNCTION DESCRIPTION • BASE MAIN BOARD IC501 SB662106A-4J90-TLM (SYSTEM CONTROLLER) Pin No. Pin Name Function Pin No. Pin Name Function TEST CH Test mode channel control output terminal “H” active PLL serial data latch pulse signal output to the TB31223F (IC101) KEY LED LED drive signal output of the key illumination LED “L”: LED on Not used (open)
  • Page 26: Exploded Views

    SECTION 7 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they • Items marked “*” are not stocked since they • The mechanical parts with no reference num- may have some difference from the original are seldom required for routine service. Some ber in the exploded views are not supplied.
  • Page 27 (2) BASESET SECTION ANT1 (including sub board) Sub board (included in supplied Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 3-936-691-01 CABINET (LOWER) * 56 A-3672-611-A BASE MAIN BOARD, COMPLETE 3-936-695-01 TERMINAL (CHARGE) 3-936-696-21 FOOT, RUBBER 3-027-558-21 CABINET (UPPER) 3-007-173-01 LABEL (TERMINAL CAUTION) (/S) 3-936-692-01 BUTTON (PAGE)
  • Page 28: Electrical Parts List

    SECTION 8 BASE MAIN ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • Items marked “*” are not stocked since they The components identified by mark ! or dotted line with mark are seldom required for routine service. parts list may be different from the parts speci- ! are critical for safety.
  • Page 29 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < COIL > < FILTER > 1-414-108-11 INDUCTOR 0.68uH CF101 1-760-418-11 FILTER, CERAMIC (460kHz) 1-408-958-21 INDUCTOR CF102 1-767-129-81 FILTER, CERAMIC (10.68MHz) 1-411-884-11 COIL, OSC L101 1-409-798-11 COIL, OSC <...
  • Page 30 BASE MAIN HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R115 1-216-089-00 RES, CHIP 1/10W < VARIABLE RESISTOR > R116 1-216-091-00 METAL CHIP 1/10W RV101 1-223-387-21 RES, ADJ, CARBON 330K R118 1-216-073-00 METAL CHIP 1/10W R119 1-216-246-00 RES, CHIP...
  • Page 31 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C107 1-165-319-11 CERAMIC CHIP 0.1uF < DIODE > C108 1-126-964-11 ELECT 10uF C109 1-163-021-11 CERAMIC CHIP 0.01uF 8-719-055-14 DIODE KV1832CTR3 C110 1-163-037-11 CERAMIC CHIP 0.022uF D101 8-719-055-14 DIODE KV1832CTR3 D202 8-719-938-75 DIODE SB05-05CP...
  • Page 32 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < TRANSISTOR > R203 1-216-097-00 RES, CHIP 100K 1/10W R204 1-216-097-00 RES, CHIP 100K 1/10W 8-729-031-86 TRANSISTOR 2SC3142-J3J4-TB R205 1-216-073-00 METAL CHIP 1/10W 8-729-031-85 TRANSISTOR 2SC4365-34-TB R301 1-216-057-00 METAL CHIP 2.2K...
  • Page 33 SPP-68 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MISCELLANEOUS ************** 1-762-664-11 SWITCH, RUBBER KEY ANT1 1-501-511-11 ANTENNA, TELESCOPIC (BASESET) ANT2 1-501-839-11 ANTENNA (HANDSET) 1-505-333-11 SPEAKER (2.1cm) ************************************************************ ************** HARDWARE LIST ************** 7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S 7-685-136-19 SCREW +BTP 2.6X12 TYPE2 N-S...

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