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ONTRAK Synergy Integra Manuals
Manuals and User Guides for ONTRAK Synergy Integra. We have
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ONTRAK Synergy Integra manual available for free PDF download: Operation Manual
ONTRAK Synergy Integra Operation Manual (350 pages)
Brand:
ONTRAK
| Category:
Industrial Equipment
| Size: 3.57 MB
Table of Contents
Copyright
2
Preface
3
Reorder & Revision History
5
Table of Contents
9
Introduction
21
Integra System Integration
21
Manual Set Organization
22
Manual Contents
22
Safety
25
Introduction
25
Safety Notations
26
Safety Precautions
27
Personal Protective Equipment (Ppe) Kit
27
General Safety Provisions
28
Safety Precautions
30
Electrical Safety
30
Safety Shields
30
Component Maintenance
30
High Voltage
30
Electrical Lockout/Tagout
30
Electrical Hazard Rating
31
Integra Type 3 and Type 4 Task Hazards
32
Safety Interlocks
32
Station Cover Lids /Doors
32
Electrical Enclosure
33
Emergency Machine off
34
Maintenance Issues
35
Chemical Exposure
35
Purge Procedure
35
N2 Purge for Long Term Storage
35
Pneumatics System
36
ULPA Filter
36
General Operational Safety
36
Removing Wafer Fragments
36
Heavy Loads
36
Purge Procedure
36
Spin Motor Protection
36
UV/IR Radiation
36
RF Radiation
36
Ergonomic Issues
37
7/26/00 INTEGRA Operations Revision a IX
38
System Configuration
39
Introduction
39
System Options
39
Flat Rotate Enable
39
Maintenance Alarms
39
Enable/Disable Brush Motor Alarms
39
First Wafer Clean
39
Light Tower Options
40
Input Station
41
Input Station Door
41
Wafer Conveyor
41
Entrance Rinse
41
Input Station Lid
41
Afer Onveyor
41
Sensors
41
Sensor Definitions
42
Brush Station Common Components
44
Double Containment Station Lid
44
Double Containment Station Shell
44
Chemical Dispense Drawers
44
NH4OH Dispense Drawer
44
HF Dispense Drawer
45
Brush Station #1
46
Entrance Spray
46
Brushes
46
Rollers and Edge Clean ( Option )
46
Process Solution Injection : Hf (Optional Configuration )
47
Exit Spray (Rinse )
47
Sensors
48
Sensor Definitions
48
Brush Station #2
54
General Description
54
Process Solution Drip : Nh4Oh (Optional Configuration )
54
Process Solution Injection : Hf (Primary System Configuration )
54
Exit Spray
54
Edge Clean ( Option )
54
Flat Finder ( Option )
55
Sensors
55
Spin Station
62
Retractable Carriage (Conveyor Platform )
62
Wafer Transfer and Positioning
62
Spin Assembly
63
Catch Cup
63
Spindle
63
Spindle Fingers
63
Spin Motor
64
Finger Close Safety Spring
64
Z_Lock
64
Spindle Lock
64
Megasonic Assembly ( Option )
65
Megasonic Arm
65
DI Water, Megasonic Flow Sensor
65
Megasonic Generator
65
Megasonic Sweep Timing
66
Tower Wafer (Robot Present ) Sensor
66
Drying Lamp
66
Spin Station Ulpa Filter ( Option )
66
Sensors
67
Sensor Definitions
68
Electrical Enclosure
78
Electrical Enclosure Interlock Override
78
High Voltage
78
Process Description
79
Introduction
79
Wafer/Input Robot (Arm)
79
Gem Interface
79
Input Robot
79
Nput Tation Oor Assette Ensor
79
Input Station
79
Placing Wafer I N Input Station
79
Spray Rinse
80
Afer Ransfer
80
Input Station Ready Signal
80
Brush Station #1
81
Wafer Transport in
81
Wafer Centering
81
Wafer Cleaning
81
Introduction
81
29% NH4OH TTB Processing (Option)
81
Edge Clean ( Option )
83
Lean Ycle Iming
83
Wafer Transfer out
83
Process Idle Time
84
First Wafer Effect
85
Brush Station #2
86
Wafer Transfer in
86
Wafer Centering
86
7/26/00 INTEGRA Operations Revision a XI
86
Wafer Cleaning
86
Introduction
86
Edge Clean ( Option )
88
Clean Cycle Timing
88
Flat Finder Option
88
Wafer Transfer out ( with Flat Finder )
88
Wafer Transfer out (N O Flat Finder )
89
Spin Station
90
Wafer Transfer in
90
Wafer T O Spindle Transfer
91
Spin Process
91
Megasonic Sweep
91
Halogen (Heat ) Lamp
91
Process Timing
92
Wafer/Output Robot (Arm)
93
Gem Interface
93
Output Robot (Arm )
93
Output Robot & Spin Station Exit Tunnel
93
Electrical Enclosure
94
Igh Oltage
94
Signal Light Tower
95
Normal Operation
103
Introduction
103
Pre Start-Up Checklist
103
Start-Up Procedure
105
Tart up Rocedure or Hf2 Configuration
106
Initialization Sequence
108
Post Start-Up Checklist
110
Clearing Procedure
113
System Idle Signal
114
System Halt Signal
114
Shutdown Procedure
115
Temporary Processing Halt
115
Less than an Hour
115
Several Hours
116
System Shutdown
116
Start-Up after Emo & Wafer Recovery
119
Introduction
119
Emergency Stop
119
Pre Processing Checklist
120
Start-Up Procedure after Emo
121
Start-Up after Opening Brush Box Lid
122
Wafer Recovery
123
7/26/00 INTEGRA Operations Revision a XII
123
Chemical Dispense During Wafer Recovery
123
Lost Wafer
123
Recovery Procedure for Process Failure
124
Equence of Vents Uring Afer Ecovery
126
Four Wafer Recovery Scenarios after Emo
130
Wafer Recovery with Power on (no Emo)
134
Lost Wafer Recovery - Input Robot
138
Lost Wafer Recovery - Output Robot
139
Optional Process Settings
141
Introduction
141
Select Wafer Diameter
142
Activate/Deactivate Flat Finder
144
Select Process Recipe
148
Envoy (Chemical Distribution Unit - Cdu) Status
150
Maintenance Alarms
151
Brush Motor Alarms
154
First Wafer Dose
155
Smooth Wafer Travel Checklist
157
Introduction
157
Process Recipe
161
Change Process Recipe
161
Modify Brush #1 Recipe
165
Set or Change EVENT Parameters
166
Change EVENT TIME
168
Change EVENT ROLLER SPEED
169
Change EVENT BRUSH SPEED
170
Change EVENT Application of NH4OH or HF
170
Change EVENT Application of DI HIGH FLOW
171
Change EVENT Application of DI LOW FLOW
172
Change EVENT Application of EDGE CLEAN
172
Set or Change Brush Station #1 General (Other) Parameters
173
Change ENTRANCE and EXIT SPRAY
175
Change DI LOW FLOW MODE
176
Change PROCESS ALARM TIMEOUT, FLUSH DURATION and FLUSH DURATION
177
Change BRUSH IDLE SPEED
179
Change BRUSH HEIGHT
180
Modify Brush #2 Recipe
181
Change FLAT FINDER
182
Brush Station #2 Screen HF2 Key Setting
183
Change HF Flow Option
183
Modify Brush Cleaning Options
183
Drip Wafer Count Brush Cleaning
185
Change DRIP TIME
190
Change DRIP WAFER COUNT
191
Change DRIP CHEM
192
Change DRIP LOW FLOW DI
193
Change DRIP HI FLOW DI
194
Change Idle Time Brush Cleaning Interval
195
Change BRUSH IDLE TIME
196
Change BRUSH IDLE on TIME
197
Change BRUSH IDLE off TIME
198
Change EDGE CLEAN on TIME
199
Change EDGE CLEAN off TIME
200
Change IDLE CHEM
201
Change IDLE LOW FLOW DI
202
Change IDLE HI FLOW DI
203
Wafer EFFECT (Brush Conditioning)
204
DOSE MODE - 1ST WAFER or ALL WAFERS
206
Change WAFER IDLE TIME
206
Change WAFER DOSE TIME
207
Change DOSE CHEM
209
Change DOSE LOW FLOW DI
209
Change DOSE HI FLOW DI
210
Modify Spin Events
211
Choose Spin Station EVENT
213
Change UPPER RINSE
213
Change LOWER RINSE
214
Change HEAT LAMP
214
Megasonic Generator Buttons
215
Change MEGASONICS GEN. (Option)
215
Change Meg Event TIME
216
Change SPINDLE SPEED (During Meg)
216
Change MEGASONIC SWEEP
217
View Process Recipe
218
Recipe Transfer Procedure (Copy Disk)
227
Define Default Process
230
Alarms
239
Introduction
239
Alarm Types
240
Alarms on the Screen
241
Gem Alarms (Error Messages )
243
Alarm Configuration Screen
244
Selectable Alarms
245
Accessing Selectable Alarms
245
Programmable Alarms
246
Accessing Alarm Configuration Menu
246
Alarm Configuration Menu Screen Description
246
Alarm Description
247
Configuration Options - Message Box
247
Choosing an Alarm for Configuration
248
Configuring the Alarm
248
Handling Alarms
251
Alarm Description 1 -161
251
Alarm ID: 1
251
Alarm ID: 2
251
Alarm ID: 10
251
Alarm ID: 11
251
Alarm ID: 12
252
Alarm ID: 13
252
Alarm ID: 14
252
Alarm ID: 15
252
Alarm ID: 16
252
Alarm ID: 17
252
Alarm ID: 18
253
Alarm ID: 19
253
Alarm ID: 20
253
Alarm ID: 21
253
Alarm ID: 22
253
Alarm ID: 23
253
Alarm ID: 24
254
Alarm ID: 25
254
Alarm ID: 26
254
Alarm ID: 27
254
Alarm ID: 28
254
Alarm ID: 29
254
Alarm ID: 30
255
Alarm ID: 31
255
Alarm ID: 32
255
Alarm ID: 33
255
Alarm ID: 34
255
Alarm ID: 35
255
Alarm ID: 36
256
Alarm ID: 37
256
Alarm ID: 38
256
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