Nokia HSU–1 Technical Documentation Manual page 11

After Sales
Technical Documentation
C015 2310544 Ceramic cap.
C016 2310336 Ceramic cap.
C017 2604431 Tantalum cap.
C018 2604209 Tantalum cap.
C019 2604431 Tantalum cap.
C020 2604209 Tantalum cap.
C021 2307816 Ceramic cap.
C022 2604431 Tantalum cap.
C023 2310336 Ceramic cap.
C024 2310512 Ceramic cap.
C025 2310752 Ceramic cap.
C026 2310336 Ceramic cap.
C027 2310784 Ceramic cap.
C028 2310336 Ceramic cap.
C029 2310336 Ceramic cap.
C030 2310512 Ceramic cap.
C031 2310336 Ceramic cap.
C032 2310512 Ceramic cap.
C033 2310512 Ceramic cap.
C034 2310512 Ceramic cap.
C035 2310512 Ceramic cap.
C036 2310512 Ceramic cap.
C037 2310512 Ceramic cap.
L001 3608502 Chip coil
L002 3608502 Chip coil
V001 4200917 Transistor
V002 4110140 Zener diode
V003 4110140 Zener diode
V004 4110140 Zener diode
N001 4301062 IC, regulator
N002 4306494 IC, 2 x op.amp.
N003 4309488 IC, 4 x bi.switch
S001 5304759 Reed relay 10at 0.5a 2x15 smd
X001 5416638 Connector 8–pole right angle 1.5
X002 5416640 Pin header m1x2 p1.5 90deg 1a0r02
9854017 PCB DG1 30.0X72.0X1.0 M2 6/PA
9854017 PC board
Original 50/96
1.0 n 5 % 50 V 0805
18 p 5 % 50 V 0805
10 u 20 % 16 V 6.0x3.2x2.5
1.0 u 20 % 16 V 3.2x1.6x1.6
10 u 20 % 16 V 6.0x3.2x2.5
1.0 u 20 % 16 V 3.2x1.6x1.6
47 n 20 % 25 V 0805
10 u 20 % 16 V 6.0x3.2x2.5
18 p 5 % 50 V 0805
560 p 5 % 50 V 0805
10 n 20 % 50 V 0805
18 p 5 % 50 V 0805
100 n 10 % 25 V 0805
18 p 5 % 50 V 0805
18 p 5 % 50 V 0805
560 p 5 % 50 V 0805
18 p 5 % 50 V 0805
560 p 5 % 50 V 0805
560 p 5 % 50 V 0805
560 p 5 % 50 V 0805
560 p 5 % 50 V 0805
560 p 5 % 50 V 0805
560 p 5 % 50 V 0805
5 % Q=28/35 MHz 1206
5 % Q=28/35 MHz 1206
BC848B/BCW32 npn 30 V 100 mA SOT23
BZX84 5 % 6.8 V 0.3 W SOT23
BZX84 5 % 6.8 V 0.3 W SOT23
BZX84 5 % 6.8 V 0.3 W SOT23
LP2951AC SO8S
TL074ID SO14
74HC4066 SO14S
1.5
1A0R02
DG1 30.0x72.0x1.0 m2 6/pa
Handset HSU–1
Page – 11