Table Of Contents - Sony MD Walkman MZ-E75 Service Manual

Specifications ........................................................................... 1
1. SERVICING NOTE
...................................................... 2
2. GENERAL
Location and Function of Controls .................................... 3
3. DISASSEMBLY
3-1. Upper Panel ASSY, "Panel ASSY, Bottom" ............... 4
3-2. Belt, Ornamental ......................................................... 4
3-3. Main Board ................................................................. 5
3-4. Optical Pick-up Block ASSY ..................................... 5
4. TEST MODE
.................................................................. 6
5. ELECTRICAL ADJUSTMENTS
IN NO EVENT SHALL SELLER BE
LIABLE FOR ANY DIRECT,
INCIDENTAL OR CONSEQUENTIAL
DAMAGES OF ANY NATURE, OR
LOSSES OR EXPENSES RESULTING
FROM ANY DEFECTIVE PRODUCT
OR THE USE OF ANY PRODUCT.
"MD WALKMAN" is a trademark of Sony
Corporation.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
When repairing this device with the power on, if you remove the main board, this device stops working.
In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S801).

TABLE OF CONTENTS

............................. 9
This Mini Disc player is classi-
fied as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on the
bottom exterior.
SECTION 1
SERVICING NOTE
Mechanism deck section
Open/Close detection switch (S801)
6. DIAGRAMS
6-1. Explanation of IC Terminals ..................................... 10
6-2. Block Diagram .......................................................... 13
6-3. Printed Wiring Boards .............................................. 16
6-4. Schematic Diagram ................................................... 19
7. EXPLODED VIEWS
7-1. Main Section ............................................................. 26
7-2. Mechanism Deck Section ......................................... 27
8. ELECTRICAL PARTS LIST
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
* Replacement of CXD2661GA-2 (IC601) used
in this set requires a special tool. Therefore, it
cannot be replaced.
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