Removal and Replacement Procedures
5.21 Heat Sink Module
Heat sink module (includes fan and thermal paste)
1. Prepare the notebook for disassembly (refer to
and remove the following components:
a. Optical drive (refer to
b. Memory module compartment cover (refer to
c. Mini PCI compartment cover (refer to
d. Switch cover (refer to
e. Keyboard (refer to
f. Display assembly (refer to
g. Top cover (refer to
h. System board (refer to
5–60
Spare Part Number Information
Section
5.5)
Section
5.8)
Section
5.10)
Section
Section
5.12)
Section
5.16)
Maintenance and Service Guide
380031-001
Section
Section
Section
5.7)
5.11)
5.3)
5.6)