Table of Contents
PART I English Edition
PART I English Edition
PART I English Edition
PART I English Edition
1-1
1-2
Package Contents ................................................................. 3
1-3
Mainboard Layout .................................................................. 4
1-4
2-1
2-2
2-3
2-4
2-5
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
95 Device Manager Menu
Feature Explanations
Feature Explanations
Feature Explanations
Feature Explanations
Feature Explanations
SeePU Technology .......................................................................... 7
Software Power-Off Control ...................................................... 10/32
Power-On By Modem .................................................................... 10
Poly-fuse Over Current Protection ................................................ 11
Over-ride Power Button Connector ............................................... 12
iii
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