Emboss Carrier Taping Standard (Sot89-3Pin); Taping Information - Epson Power Supply IC S1F70000 Technical Manual

Appendix

EMBOSS CARRIER TAPING STANDARD (SOT89-3pin)

TAPING INFORMATION

The emboss carrier taping standard is shown in the
following table and figure. This standard conforms to
Dimension code
A
B
D
E
F
P1
P0
T
Device cavity
T2
There are no joints in either the cover or carrier tapes.
Less than 0.2% of the total device count is comprised
of non-sequential blanks. There are no sequential
6–6
Dimensions/angles (mm/ )
5.0
4.6
1.5 +0.1, –0.05
1.50 0.1
5.65 0.05
8.0 0.1
4.0 0.1
Feeder hole
the EIAJ RCI00B electronic parts taping specification.
Each tape holds 1,000 devices.
Dimension code
P2
T
T2
W
W1
Note
The tape thickness is 0.1 mm Max.
D
A
B
P1
blanks. This does not apply to the tape leader and
trailer.
EPSON
Dimensions/angles (mm/ )
2.0 0.05
0.3
2.3
12.0 0.2
9.5
30 Max.
Cross section with device position
Travel direction
P2 P0
E
F
W
S1F70000 Series
Technical Manual