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A
B
MOTOROLA ANALOG IC DEVICE DATA
Downloaded from
Elcodis.com
electronic components distributor
28
15
1
14
A
G
H
F
D
D
28
15
1
14
PIN 1 IDENT
e
B
0.025
C
A
B
M
S
S
MC44302A
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 710–02
ISSUE B
B
L
C
N
J
M
K
SEATING
PLANE
DW SUFFIX
PLASTIC PACKAGE
CASE 751F–05
(SO–28L)
ISSUE F
0.10
C
SEATING
C
PLANE
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
36.45
37.21
1.435
1.465
B
13.72
14.22
0.540
0.560
C
3.94
5.08
0.155
0.200
D
0.36
0.56
0.014
0.022
F
1.02
1.52
0.040
0.060
G
2.54 BSC
0.100 BSC
H
1.65
2.16
0.065
0.085
J
0.20
0.38
0.008
0.015
K
2.92
3.43
0.115
0.135
L
15.24 BSC
0.600 BSC
_
_
_
_
M
0
15
0
15
N
0.51
1.02
0.020
0.040
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSIONS.
4. MAXIMUM MOLD PROTRUSION 0.015 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM
MIN
MAX
A
2.35
2.65
A1
0.13
0.29
B
0.35
0.49
C
0.23
0.32
D
17.80
18.05
L
E
7.40
7.60
e
1.27 BSC
H
10.05
10.55
L
0.41
0.90
_
_
q
0
8
q
27
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