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Quectel EM160R-GL Hardware Design

Quectel EM160R-GL Hardware Design

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EM160R-GL
Hardware Design
LTE-A Module Series
Version: 1.3.3
Date: 2023-10-18
Status: Preliminary

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  • Page 1 EM160R-GL Hardware Design LTE-A Module Series Version: 1.3.3 Date: 2023-10-18 Status: Preliminary...
  • Page 2 LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE-A Module Series About the Document Revision History Update Log Version Date What/Where Update 1.0.0 2020-08-31 Creation of the document Jim HAN/ 2020-12-23 First official release Lewis PENG Updated the function diagram (Figure 1). Updated the I/O parameter definitions (Table 3). Updated the description of turn-on timing (Table 7).
  • Page 6 To add the data of Rx only. Lewis PENG Remove the type Compass in GNSS frequency (Chapter 4.2). To follow the specification of EM160R-GL. Lewis PENG Updated the data in GNSS performance (Table 35). To add the data of GNSS performance.
  • Page 7 LTE-A Module Series Added related note description in turn-on chapter (Chapter 3.4.1). Optimize the description and reduce risk points. Fung ZHU Added related note description of RESET# (Chapter 3.5). Optimize the description and reduce risk points. Fung ZHU 1.3.3 2023-10-18 Added related note description in (U)SIM design notices (Chapter 3.6.4).

  • Page 8: Table Of Contents

    LTE-A Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 7 Table Index ..............................9 Figure Index ............................... 11 Introduction ............................12 1.1. Introduction ..........................12 1.2. Reference Standard ........................12 1.3. Special Marks ..........................13 Product Overview ..........................
  • Page 9 LTE-A Module Series 3.10. Antenna Tuner Control Interfaces* ................... 44 3.10.1. Antenna Tuner Control Interface through GPIOs ............44 3.10.2. Antenna Tuner Control Interface through RFFE ............45 3.11. Configuration Pins ........................45 RF Specifications ..........................47 4.1. Cellular Network ........................47 4.1.1.
  • Page 10 LTE-A Module Series Table Index Table 1: Special Marks ..........................13 Table 2: Frequency Bands and GNSS Functions of EM160R-GL ............. 14 Table 3: Key Features of EM160R-GL ....................... 15 Table 4: Parameter Definition ........................20 Table 5: Pin Description ..........................20 Table 6: Pin Definition of VCC and GND Pins ...................
  • Page 11 LTE-A Module Series Table 42: EM160R-GL Power Consumption ....................61 Table 43: Electrostatic Discharge Characteristics (Temperature: 25–30 ° C, Humidity: 40 ± 5 %) ..... 64 Table 44: Related Documents ........................72 Table 45: Terms and Abbreviations ......................72 EM160R-GL_Hardware_Design...
  • Page 12 Figure 19: Reference Design of WAKE_ON_WAN# .................. 42 Figure 20: Reference Design of DPR ......................43 Figure 21: Recommended Circuit of EM160R-GL Configuration Pins ............46 Figure 22: Antenna Connectors on the EM160R-GL Module ..............54 Figure 23: Dimensions of the Receptacle (Unit: mm) ................55 Figure 24: Dimensions of Mated Plugs (Ø...

  • Page 13: Introduction

    LTE-A Module Series Introduction 1.1. Introduction This document introduces EM160R-GL module and describes its air interfaces and hardware interfaces which are connected to your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. This document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

  • Page 14: Special Marks

    LTE-A Module Series 1.3. Special Marks Table 1: Special Marks Mark Definition Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, argument, and so on, it indicates that the function, feature, interface, pin, AT command, argument, and so on, is under development and currently not supported;...

  • Page 15: Product Overview

    LTE-A Module Series Product Overview 2.1. Frequency Bands and Functions EM160R-GL is an LTE-A/UMTS/HSPA+ wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface.

  • Page 16: Key Features

    LTE-A Module Series 2.2. Key Features Table 3: Key Features of EM160R-GL Feature Details Function Interface PCI Express M.2 Interface Supply voltage: 3.135–4.4 V Power Supply Typical supply voltage: 3.7 V ⚫ WCDMA: Class 3 (23 dBm ± 2 dB) ⚫...
  • Page 17 ⚫ Data update rate: 1 Hz ⚫ Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands ⚫ Quectel enhanced AT commands ⚫ Size: 42.0 mm × 30.0 mm × 2.3 mm Physical Characteristics ⚫ Weight: approx. 6.8 g ⚫...

  • Page 18: Functional Diagram

    MIMO2 MIMO2 WWAN_LED# WAKE_ON_WAN# W_DISABLE1# GNSS ANT_DIV/GNSS W_DISABLE2# Figure 1: Functional Diagram 2.4. EVB Kit Quectel supplies an evaluation board (5G-M2 EVB) with accessories to develop and test the module. For more details, see document [2]. EM160R-GL_Hardware_Design 17 / 73...

  • Page 19: Application Interfaces

    LTE-A Module Series Application Interfaces The physical connections and signal levels of EM160R-GL comply with PCI Express M.2 specifications. This chapter mainly describes the definition and application of the following interfaces/signals/pins of EM160R-GL: ⚫ Power supply ⚫ (U)SIM interface ⚫...

  • Page 20: Pin Assignment

    LTE-A Module Series 3.1. Pin Assignment The following figure shows the pin assignment of EM160R-GL. The top side contains EM160R-GL and antenna connectors. Pin Name Pin Name CONFIG_2 CONFIG_1 ANT_CONFIG RESET# USIM_DET ANTCTL3 COEX_TXD ANTCTL2 COEX_RXD ANTCTL1 COEX3 PIN75 ANTCTL0...

  • Page 21: Pin Description

    LTE-A Module Series 3.2. Pin Description The following tables show the pin definition and description of EM160R-GL. Table 4: Parameter Definition Parameter Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output...
  • Page 22 LTE-A Module Series Internally pulled max = 4.4 V FULL_CARD_ down with a 100 kΩ Turn on/off the module min = 1.19 V POWER_OFF# max = 0.2 V resistor. RESERVED Reserved W_DISABLE1# Airplane mode control 1.8/3.3 V Active low. RESERVED Reserved RF status indication Open drain and...
  • Page 23 LTE-A Module Series Ground DIO, USIM_DATA (U)SIM card data 1.8/3.0 V Internally pulled up. RESERVED Reserved High-Voltage: Vmin = 3.05 V Vnom = 2.85 V Vmax = 2.7 V Power supply for USIM_VDD (U)SIM card Low-Voltage: Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V RESERVED...
  • Page 24 LTE-A Module Series Used for external MIPI If unused, keep it RFFE_CLK* IC control open. Ground Used for external MIPI If unused, keep it RFFE_DATA* IC control open. ANTCTL0* Antenna tuner control 1.8 V COEX3* COEX GPIO 1.8 V ANTCTL1* Antenna tuner control 1.8 V LTE&WLAN...

  • Page 25: Power Supply

    LTE-A Module Series 3.3. Power Supply Table 6: Pin Definition of VCC and GND Pins Pin No. Pin Name DC Characteristics Description 3.135–4.4 V Power supply for the 2, 4, 70, 72, 74 3.7 V typical DC supply module 3, 5, 11, 27, 33, 39, 45, 51, Ground 57, 71, 73 3.3.1.

  • Page 26: Reference Design For Power Supply

    LTE-A Module Series The following figure shows a reference circuit of VCC. VCC (3.7 V Typ.) 2, 4 220 μF 1 μF 100 nF 33 pF 10 pF 3, 5, 11 70, 72, 74 220 μF 1 μF 100 nF 33 pF 10 pF 27, 33, 39,...

  • Page 27: Turn On, Turn Off And Reset Scenarios

    LTE-A Module Series 3.4. Turn On, Turn Off and Reset Scenarios 3.4.1. Turn On Pulling up the FULL_CARD_POWER_OFF# pin will turn on the module. Table 7: Pin Definition of FULL_CARD_POWER_OFF# Pin Name Pin No. Description Comment Internally pulled down with a FULL_CARD_POWER_OFF# Turn on/off the module 100 kΩ...
  • Page 28 LTE-A Module Series Figure 7: Turn-on Timing Table 8: Description of Turn-on Timing Index Min. Typ. Max. Comment RESET# will be pulled high internally and automatically when the host doesn’t pull high RESET#. 0 ms 50 ms If the host pulls low RESET#, module will be under reset state. 0 ms The module is waiting for turning on.

  • Page 29: Turn Off

    LTE-A Module Series Module GPIO(AUX Reset) PERST# PCIE_RST#(Global PCIe Reset) Figure 8: Reference Circuit for Laptop PCIe Reset Logic 3.4.2. Turn Off Pulling down the FULL_CARD_POWER_OFF# pin will turn off the module. The turn-off timing is illustrated in the following figure. 3.7 V VCC(H) ≥...

  • Page 30: Reset

    LTE-A Module Series 3.5. RESET# RESET# is an active low signal (1.8 V logic level). When this pin is asserted, the module will immediately enter reset condition. Please note that triggering the RESET# signal will lead to loss of all data in the module and removal of system drivers.
  • Page 31 LTE-A Module Series 3.7 V VCC(H) ≥ 1.19 V FULL_CARD_ POWER_OFF# 1.8 V RESET# CLKREQ# Execute AT+CFUN=0, and the module responds OK PERST# PCIE_REFCLK Module Status Active Resetting Booting Figure 11: Timing of Resetting the Module Table 11: Description of Reset Timing Index Min.

  • Page 32: U)Sim Interface

    LTE-A Module Series The host should control RESET# and PERST# based on the timing sequence. If the host fails to control RESET# and PERST# based on the timing sequence, instability in PCIe will be caused. When the FULL_CARD_POWER_OFF# signal is low, please avoid any leakage current entering the module's DPR pin from the host.

  • Page 33: Normally Closed (U)Sim Card Connector

    LTE-A Module Series The following command enables or disables (U)SIM card hot-plug function. The level of (U)SIM card detection pin should also be set when the (U)SIM card is inserted. AT+QSIMDET (U)SIM Card Detection Test Command Response AT+QSIMDET=? +QSIMDET: (list supported <enable>s),(list supported <insert_level>s)

  • Page 34: Normally Open (U)Sim Card Connector

    LTE-A Module Series (U)SIM hot-plug is enabled by executing AT+QSIMDET=1,1, a (U)SIM card insertion will drive USIM_DET from low to high level, and the removal of it will drive USIM_DET from high to low level. ⚫ When the (U)SIM is absent, CD is shorted to ground and USIM_DET is at low level. ⚫...

  • Page 35: U)Sim Card Connector Without Hot-Plug

    LTE-A Module Series The following figure shows a reference design for (U)SIM interface with a normally open (U)SIM card connector. Module (U)SIM Card Connector 100 nF USIM_VDD USIM_VDD USIM_RST USIM_CLK 10 kΩ USIM_DET USIM_DATA TVS array NOTE: All these resistors, capacitors and TVS array should be close to (U)SIM card connector in PCB layout. The external pull-up resistor of USIM_DATA is optional.

  • Page 36: Pcie Interface

    LTE-A Module Series 3.7. PCIe Interface The module provides one integrated PCIe interface, featuring as follows: ⚫ PCI Express Base Specification Revision 4.0, Version 1.1 ⚫ Data rate up to 5 Gbps per lane Table 13: Pin Definition of PCIe Interface Pin No.

  • Page 37: Endpoint Mode

    PCIe wake up the host Active low. 3.7.1. Endpoint Mode EM160R-GL supports endpoint (EP) mode. In this mode, the module is configured as a PCIe EP device. The following figure shows a reference circuit of PCIe endpoint mode. Host Module...

  • Page 38: Pcie D3 Cold State

    LTE-A Module Series Figure 15: PCIe Interface Reference Circuit (EP Mode) To ensure the signal integrity of PCIe interface, AC coupling capacitors C5 and C6 should be placed close to the host on PCB. C1 and C2 have been integrated inside the module, so do not place these two capacitors on your schematic and PCB.

  • Page 39: Control And Indication Interfaces

    LTE-A Module Series VCC(H) FULL_CARD_POWER_OFF#(H) RESET#(H) NOTE PEWAKE# PERST# exit Module State cold NOTE: PEWAKE# may be pulled up before or after PERST# is pulled up, depending on when HOST pulls up PERST#. This time does not affect the normal operation of the module and can be ignored. Figure 16: PCIe D3 State Timing Cold...

  • Page 40: W_Disable1

    LTE-A Module Series ANT_CONFIG Antenna configuration 3.8.1. W_DISABLE1# The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware operation. The W_DISABLE1# pin is pulled up by default. Driving it low will set the module to airplane mode.

  • Page 41: Wwan_Led

    LTE-A Module Series A simple voltage-level translator based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module, as shown in the following figure. So, the control signals (GPIO) of the host device could be a 1.8 V or 3.3 V voltage level and pull-up resistor is not needed on the host side.
  • Page 42 LTE-A Module Series VCC (Typ. 3.7V) 2, 4 70,72,74 330 Ω LED1 LED_WWAN # Figure 18: Reference Design of WWAN_LED# Table 18: RF Status Indications of WWAN_LED# WWAN_LED# Level RF Status Low Level High Level NOTE RF function is turned off if any of the following circumstances occurs: ⚫...

  • Page 43: Wake_On_Wan

    Figure 19: Reference Design of WAKE_ON_WAN# 3.8.5. DPR EM160R-GL provides a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection. The signal is sent by a host system proximity sensor to the module to provide an input trigger which will reduce the output power in the radio transmission.

  • Page 44: Ant_Config

    2. See document [3] for more details about AT+QCFG="sarcfg". 3.8.6. ANT_CONFIG EM160R-GL provides an ANT_CONFIG pin for antenna configuration. The signal of the pin is sent from host system to the module. ANT_CONFIG is an input port which is pulled high internally by default. The definition of ANT_CONFIG is shown in the table below.

  • Page 45: Coex Uart

    LTE-A Module Series 3.9. COEX UART* The module provides one COEX UART. Table 22: Pin Definition of COEX UART Pin Name Pin No. Description COEX3 COEX GPIO COEX_RXD LTE&WLAN coexistence receive COEX_TXD LTE&WLAN coexistence transmit NOTE Please note that COEX_RXD and COEX_TXD cannot be used as general UART. 3.10.

  • Page 46: Antenna Tuner Control Interface Through Rffe

    Used for external MIPI IC control If unused, keep them open. RFFE_DATA Used for external MIPI IC control 3.11. Configuration Pins EM160R-GL provides four configuration pins which are defined as below. Table 25: Configuration Pins of the Module Pin No. Pin Name Description CONFIG_0 Connected to GND internally.
  • Page 47 GPIO Note: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. Figure 21: Recommended Circuit of EM160R-GL Configuration Pins Table 26: Configuration Pins List of M.2 Specification CONFIG_0 CONFIG_1...

  • Page 48: Rf Specifications

    GNSS antenna interface. They are used to resist the fall of signals caused by high-speed movement and multipath effect. The impedance of antenna ports is 50 Ω. 4.1. Cellular Network 4.1.1. Antenna Interface & Frequency Bands Table 27: EM160R-GL Connector Definition of Antenna Interfaces Connector Name Description Comment Main antenna interface: ⚫...
  • Page 49 LTE-A Module Series Table 28: Frequency Bands 3GPP Band Transmit Receive Unit WCDMA B1 1920–1980 2110–2170 WCDMA B2 1850–1910 1930–1990 WCDMA B3 1710–1785 1805–1880 WCDMA B4 1710–1755 2110–2155 WCDMA B5 824–849 869–894 WCDMA B6 830–840 875–885 WCDMA B8 880–915 925–960 WCDAM B19 830–845 875–890...

  • Page 50: Rx Sensitivity

    LTE-A Module Series LTE-FDD B28 703–748 758–803 LTE-FDD B29 717–728 LTE-FDD B30 2305–2315 2350–2360 LTE-FDD B32 1452–1496 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B39 1880–1920 1880–1920 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2496–2690 2496–2690 LTE-TDD B42 3400–3600 3400–3600 LTE-TDD B43 3600–3800 3600–3800 LTE-TDD B46 5150–5925...
  • Page 51 LTE-A Module Series WCDMA B8 -111 -103.7 WCDMA B19 -111 -106.7 LTE-FDD B1 -100.7 -96.3 10 MHz LTE-FDD B2 -100.3 -94.3 10 MHz LTE-FDD B3 -100.6 -93.3 10 MHz LTE-FDD B4 -100.6 -96.3 10 MHz LTE-FDD B5 -102 -94.3 10 MHz LTE-FDD B7 -99.4 -94.3...

  • Page 52: Tx Power

    LTE-A Module Series LTE-TDD B46 -96.5 -88.5 20 MHz LTE-TDD B48 -100.6 -95.0 10 MHz LTE-FDD B66 -100.4 -95.8 10 MHz Table 30: Four-Antenna Conducted RF Receiver Sensitivity Frequency Band Rx Sensitivity (Typical) (dBm) 3GPP (dBm) Comment LTE-FDD B1 -103.5 10 MHz LTE-FDD B2 -103...

  • Page 53: Gnss

    4.2. GNSS 4.2.1. Antenna Interface & Frequency Bands EM160R-GL includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BDS and Galileo. The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate.

  • Page 54: Gnss Performance

    LTE-A Module Series 4.2.2. GNSS Performance Table 33: GNSS Performance Parameter Description Condition Typ. Unit Cold start Autonomous -146 Sensitivity Reacquisition Autonomous -158 Tracking Autonomous -158 Autonomous 31.13 Cold start @ open sky XTRA enabled 17.87 Autonomous 26.59 Warm start TTFF @ open sky XTRA enabled...

  • Page 55: Antenna Connectors

    4.3. Antenna Connectors 4.3.1. Antenna Connector Location The module has four antenna connectors: main, Rx-diversity/GNSS, MIMO1 and MIMO2, which are shown below. Main MIMO1 MIMO2 Rx-diversity/GNSS Antenna Antenna Antenna Antenna Figure 22: Antenna Connectors on the EM160R-GL Module EM160R-GL_Hardware_Design 54 / 73...

  • Page 56: Antenna Connector Specifications

    LTE-A Module Series 4.3.2. Antenna Connector Specifications EM160R-GL is mounted with standard 2 mm × 2 mm receptacle antenna connectors for convenient antenna connection. The connector dimensions are illustrated below: Figure 23: Dimensions of the Receptacle (Unit: mm) Table 34: Major Specifications of the RF Connector...

  • Page 57: Antenna Connector Installation

    4.3.3. Antenna Connector Installation The receptacle RF connector used in conjunction with EM160R-GL will accept two types of mated plugs that will meet a maximum height of 1.2 mm using a Ø 0.81 mm coaxial cable or a maximum height of 1.4 mm utilizing a Ø...
  • Page 58 LTE-A Module Series The following figure illustrates the connection between the receptacle RF connector on EM160R-GL and the mated plug using a Ø 1.13 mm coaxial cable. Figure 26: Space Factor of Mated Connectors (Ø 1.13 mm Coaxial Cables) (Unit: mm)

  • Page 59: Antenna Requirements

    LTE-A Module Series 4.4. Antenna Requirements The following table shows the requirements on main antenna, GNSS antenna, MIMO1 and MIMO2 antennas. Table 35: Antenna Requirements Type Requirements ⚫ VSWR: ≤ 2 ⚫ Efficiency: > 30 % ⚫ Main Antenna (Tx/Rx) Max input power: 50 W ⚫...

  • Page 60: Electrical Characteristics And Reliability

    LTE-A Module Series Electrical Characteristics and Reliability 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital pins of the module are listed in the following table. Table 36: Absolute Maximum Ratings Parameter Min. Max. Unit -0.3 Voltage at Digital Pins -0.3...

  • Page 61: Digital I/O Characteristics

    LTE-A Module Series 5.3. Digital I/O Characteristics Table 38: Logic Levels of 1.8 V Digital I/O Parameter Description Min. Max. Unit VDDIO_1V8 Supply voltage 1.94 High-level input voltage 0.65 × VDDIO_1V8 VDDIO_1V8 + 0.3 Low-level input voltage -0.3 0.35 × VDDIO_1V8 High-level output voltage VDDIO_1V8 - 0.45 VDDIO_1V8...

  • Page 62: Operating And Storage Temperatures

    Typ. Max. Unit Operating temperature Range º C Extended Temperature Range º C Storage temperature Range º C 5.5. Power Consumption Table 42: EM160R-GL Power Consumption Mode Condition Typ. Unit μA OFF state Power off AT+CFUN=0 1.55 WCDMA PF = 64 2.81...
  • Page 63 LTE-A Module Series LTE-FDD PF = 128 3.41 LTE-FDD PF = 256 2.57 LTE-TDD PF = 32 5.03 LTE-TDD PF = 64 5.51 LTE-TDD PF = 128 2.91 LTE-TDD PF = 256 2.57 WCDMA PF = 64 18.76 ldle State LTE-FDD PF = 64 15.38 LTE-TDD PF = 64...
  • Page 64 LTE-A Module Series LTE-FDD B1 CH300 @ 24.81 dBm 919.73 LTE-FDD B2 CH900 @ 24.86 dBm 785.26 LTE-FDD B3 CH1575 @ 24.35 dBm LTE-FDD B4 CH2175 @ 24.79 dBm 895.19 LTE-FDD B5 CH2525 @ 24.64 dBm 707.23 LTE-FDD B7 CH3100 @ 23.62 dBm 902.96 LTE-FDD B8 CH3625 @ 24.91 dBm 810.75...

  • Page 65: Esd Protection

    LTE-A Module Series LTE-TDD B48 CH55590 @ 21.88 dBm 305.05 WCDMA B1 CH10700 @ 24.52 dBm 739.17 WCDMA B2 CH9800 @ 24.25 dBm 648.81 WCDMA B3 CH1338 @ 24.18 dBm 680.93 WCDMA B4 CH1638 @ 24.41 dBm 788.8 WCDMA WCDMA B5 CH4407 @ 23.85 dBm 577.69 WCDMA B6 CH4400 @ 23.84 dBm 578.14...

  • Page 66: Thermal Dissipation

    LTE-A Module Series 5.7. Thermal Dissipation HB_PAMID MB_PAMID LB_PAMID Figure 27: Distribution of Heat Source Chips Inside the Module The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power and data rate) will be affected to a certain extent.

  • Page 67: Notification

    LTE-A Module Series Screw Heatsink Heatsink Thermal pad Module Module Thermal pad Figure 28: Placement and Fixing of the Heatsink 5.8. Notification Please follow the principles below in the module application. 5.8.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.

  • Page 68: Mechanical Information

    LTE-A Module Series Mechanical Information This chapter mainly describes mechanical dimensions and packaging specifications of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.15 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 29: Mechanical Dimensions NOTE The package warpage level of the module refers to the JEITA ED-7306 standard.

  • Page 69: Top And Bottom Views

    Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. 6.3. M.2 Connector EM160R-GL adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification Revision 4.0. EM160R-GL_Hardware_Design...

  • Page 70: Module Installation

    LTE-A Module Series 6.4. Module Installation The module needs to be fixed firmly to avoid poor contact caused by shaking. When installing the module, it is recommended to be mounted on the socket with a screw as shown below. Figure 31: Installation Schematic EM160R-GL_Hardware_Design 69 / 73...

  • Page 71: Packaging Specifications

    LTE-A Module Series 6.5. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts blister tray packaging and details are as follow: 6.5.1.

  • Page 72: Packaging Process

    LTE-A Module Series 6.5.2. Packaging Process Each blister tray packs 15 modules. Stack Packing 11 blister trays together and then put 10 blister trays with modules together, and put blister trays into conductive bag, seal and 1 empty blister tray on the top. pack the conductive bag.

  • Page 73: Appendix References

    LTE-A Module Series Appendix References Table 44: Related Documents Document Name [1] Quectel_EM160R-GL_CA_Feature [2] Quectel_5G-M2_EVB_User_Guide [3] Quectel_EG512R&EM1x0R_Series_AT_Commands_Manual [4] Quectel_LTE-A(Q)_Series_GNSS_Application_Note [5] Quectel_LTE_Module_Thermal_Design_Guide Table 45: Terms and Abbreviations Abbreviation Description Bits Per Second DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air Downlink Diversity Receive Electrostatic Discharge...
  • Page 74 LTE-A Module Series kbps Kilo Bits Per Second Light Emitting Diode Long Term Evolution Mbps Million Bits Per Second Mobile Equipment (Module) MIMO Multiple-Input Multiple-Output MLCC Multiplayer Ceramic Chip Capacitor Multimedia Messaging Service Mobile Originated Mobile Terminated NMOS N-type Metal-Oxide-Semiconductor Protocol Data Unit Point-to-Point Protocol Primary Receive...
  • Page 75 Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host...
  • Page 76 be used only when all FCC/IC compliance requirements are met.
  • Page 77 Antenna (1) The antenna must be installed such that 20 cm is maintained between the antenna and users, (2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product.
  • Page 78 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual...
  • Page 79 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
  • Page 80 responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
  • Page 81 This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.
  • Page 82 Industry Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
  • Page 83 required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
  • Page 84 Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
  • Page 85 This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 10224A-2020EM160GL”.
  • Page 86 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

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