Related Manuals for Lantronix Open-Q 660 mSOM
Summary of Contents for Lantronix Open-Q 660 mSOM
- Page 1 Open-Q™ 660 µSOM Development Kit User Guide Part Number PMD-00083 Revision A October 2020...
- Page 2 Phone: 949-453-3990 Fax: 949-453-3995 IES Customer Support Portal https://helpdesk.intrinsyc.com Lantronix Technical Support http://www.lantronix.com/support Sales Offices For a current list of our domestic and international sales offices, go to the Lantronix web site at http://www.lantronix.com/about-us/contact/ Open-Q™ 660 µSOM Dev Kit User Guide...
- Page 3 Intrinsyc document number: ITC-01RND1336-UG-001 October 2020 Initial Lantronix document. Added Lantronix document part number, Lantronix logo, branding, contact information, and links. For the latest revision of this product document, please go to: http://tech.intrinsyc.com. Open-Q™ 660 µSOM Dev Kit User Guide...
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Page 4: Table Of Contents
Contents 1 Introduction Purpose _____________________________________________________________ 7 Scope ______________________________________________________________ 7 Intended Audience ____________________________________________________ 7 2 Documents Reference Documents _________________________________________________ 8 Terms and Acronyms __________________________________________________ 8 3 Open-Q 660 µSOM Development Kit Introduction _________________________________________________________ 10 Development Platform Notice ___________________________________________ 10 Anti-Static Handling Procedures _________________________________________ 10 Development Kit Contents _____________________________________________ 10 3.4.1 Important Locations _______________________________________________ 11... - Page 5 3.7.20 Audio Headset Jack J1800 (8) ______________________________________ 41 3.7.21 WLAN / BT Antenna Connections ___________________________________ 41 3.7.22 Quiet Thermistor RT800 (35) _______________________________________ 42 3.7.23 Haptic Output Header J802 (10) ____________________________________ 43 List of Figures Figure 1. Assembled Open-Q 660 µSOM Development Kit ..............11 Figure 2.
- Page 6 Table 7. Development Kit Buttons ......................25 Table 8. Development Kit LEDs (24) ....................25 Table 9. Camera Flash/Torch Connectors pinout ................31 Table 10. Digital IO Expansion Header J2200 Pinout ................33 Table 11 - Sensor Expansion Header J2100 Pinout ................34 Table 12.
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Page 7: Introduction
Configuration • • • Carrier Board • Available peripherals 1.3 Intended Audience This document is intended for users who would like to develop custom applications on the Lantronix Open-Q 660 µSOM Development Kit. Open-Q™ 660 µSOM Dev Kit User Guide... -
Page 8: Documents
This section lists the supplementary documents for the Open-Q 660 µSOM Development Kit. Applicable Documents Reference Title Intrinsyc Purchase and Software License Agreement for the Open-Q Development 2.1 Reference Documents The below listed documents are available on the Lantronix Technical Portal: https://tech.intrinsyc.com (dev kit registration required). Reference Title Open-Q 660 µSOM HW Device Specification... - Page 9 2: Documents Term and acronyms Definition eMMC Embedded Multimedia Card US Federal Communications Commission FWVGA Full Wide Video Graphics Array Global Positioning system HDMI High Definition Media Interface HSIC High Speed Inter Connect Bus JTAG Joint Test Action Group Low Noise Amplifier MIPI Mobile Industry processor interface Multi-Purpose Pin...
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Page 10: Open-Q 660 Μsom Development Kit
3: Open-Q 660 µSOM Development Kit 3 Open-Q 660 µSOM Development Kit 3.1 Introduction The Open-Q 660 provides a quick reference and evaluation platform for the Qualcomm Snapdragon SDA660 Platform. The development kit is suited for Android application developers, OEMs, consumer manufacturers, hardware component vendors, camera vendors, and product designers to evaluate, optimize, test and deploy applications that can utilize the Qualcomm Snapdragon SDA660 Platform technology. -
Page 11: Important Locations
3: Open-Q 660 µSOM Development Kit Mini-ITX form-factor carrier board AC power adapter 3.4.1 Important Locations The diagram below shows the locations of key components, interfaces, and controls. Figure 1. Assembled Open-Q 660 µSOM Development Kit Open-Q™ 660 µSOM Dev Kit User Guide... -
Page 12: Table 1. List Of Development Kit Features Itemized In The Figure Above
3: Open-Q 660 µSOM Development Kit Table 1. List of Development Kit Features itemized in the figure above Position Feature Description Reference Designator DC Power Supply Jack J400 Power Source Selector S300 Battery Input Header J300 Battery configuration DIP switch S301 SOM Current Sense Probe Header J301... -
Page 13: Block Diagram
3: Open-Q 660 µSOM Development Kit LED Charge DS2504 LED Power DS2503 LED Blue DS2500 LED Green DS2501 LED Red DS2502 Sensors Expansion Header J2100 Button Power S2503 Button Volume + S2500 Button Volume - S2502 Button GP SW S2501 Open-Q LCD Panel Digital IO Expansion Header J2200... -
Page 14: Optional Accessories
3.4.3 Optional Accessories Optional accessories are available for the Open-Q 660 µSOM Development Kit, like LCD Panel, Camera adapter, and sensor board. Please visit the Lantronix product store for availability of these accessories: http://shop.intrinsyc.com, or contact sales. Open-Q™ 660 µSOM Dev Kit User Guide... -
Page 15: Getting Started
This section explains how to setup the Open-Q 660 µSOM Development Kit and start using it. 3.5.1 Registration To register the development kit and gain access to the Lantronix Technical Document Portal, please visit: https://tech.intrinsyc.com/account/register. To proceed with registration, the development kit serial number is required. These serial numbers can be found on the labels that are present on the SOM and carrier boards. -
Page 16: Open-Q 660 Carrier Board
Volume +Key Volume – key SMD Button Volume – Key Sensor Connector 24 pin Sensor Expansion Connector Available via Lantronix optional accessories kit Digital IO Expansion Exposes general purpose IO for user Header development Audio Headset Jack Audio Headset Jack... -
Page 17: Som Board To Board Connectors
3: Open-Q 660 µSOM Development Kit Item Position Description Specification Usage Audio Outputs Audio Outputs Header 3 Line outputs, 1 earphone Amplifiers Expansion amplifier output Audio I/O 7, 9 2 x Audio I/O headers 3 x I2S, DMIC PDM, Various digital audio SPI/I2C interfaces I/O functions Haptic motor header... -
Page 18: Configuration - Dip Switch S2600 (23)
See the table below for a description of the DIP switch connections. Table 3 - System Configuration DIP Switch Settings Function Description Notes Switch For factory mode programming. For Lantronix use only. Leave open / FORCED_USB_BOOT S2600-1 Connected to APQ GPIO57. OFF. Enables WATCHDOG_DISABLE when DIP switch turned on. Connected to Unsupported feature. -
Page 19: Input Power Selection (2)
3: Open-Q 660 µSOM Development Kit Function Description Notes Switch For default boot configuration, leave APQ boot configuration bit 3. open / OFF. Other boot BOOT_CONFIG[3] S2600-5 Connected to APQ GPIO60 configurations not supported. Default configuration is open / OFF. To enable auto power on of the SOM, CBL_PWN_N S2600-6... -
Page 20: Figure 5. Battery Id And Thermistor Dip Switch S301 (4)
3: Open-Q 660 µSOM Development Kit position when power is supplied by the external power supply or to force disabling of the SOM battery charger. Figure 5. Battery ID and Thermistor DIP Switch S301 (4) 3.7.3.3 DC Power Input Jack J400 (1) The Open-Q 660 µSOM Development Kit power source connects to the 12V DC power supply jack J400. -
Page 21: Som Current Sense Header J301 (5)
3: Open-Q 660 µSOM Development Kit Figure 7. Battery Connector J300 (3) Table 4. Battery Connector J300 Pinout Pin No Signal Description System ground, Battery Negative Wire System ground, Battery Negative Wire BATT_THERM_CONN Thermistor BATT_ID_CONN ID Resistor VBATT_CONN Battery Positive Wire VBATT_CONN Battery Positive Wire 3.7.4 SOM Current Sense Header J301 (5) -
Page 22: Coin Cell Battery Holder B300 (37)
3: Open-Q 660 µSOM Development Kit Figure 8. SOM Current Sense Header J301 (5) The table below summarizes the pin outs of header J301 Table 5 - Power Header J301 Pinout Pin No Signal Description SOM_PWR_SENSE_P SOM power positive current sense line SOM_PWR_SENSE_N SOM power negative current sense line System Ground... -
Page 23: Power Header J700 (36)
3: Open-Q 660 µSOM Development Kit Figure 9. Coin Cell Battery Holder B300 3.7.6 Power Header J700 (36) Figure 10. Power Header J700 (36) The Power Header J700 provides main carrier board switching rails – 1.8V, 3.3V, 5.0V and 12V as well as a few carrier board LDO regulators for custom camera modules or any other purposes supplying 1.1V and 2.8V low noise power. -
Page 24: Table 6. Power Header J700 (36)
3: Open-Q 660 µSOM Development Kit Table 6. Power Header J700 (36) Signal Description Signal Description +1.1V Carrier Board MB_ELDO_CAM0_DVDD MB_ELDO_CAM0_VCM +2.8V Carrier Board LDO for CAM 0 _1P1 _2P8 LDO for CAM 0 VCM DVDD, Camera core No Net System Ground +3.3V Carrier Board +1.8V Carrier Board... -
Page 25: User Buttons And Leds
3: Open-Q 660 µSOM Development Kit 3.7.7 User Buttons and LEDs There are four user buttons and four LED’s on the Open-Q 660 µSOM Development Kit. Following is the information regarding the User Buttons: Table 7. Development Kit Buttons Reference User Button Function Designator... -
Page 26: Usb Type C (For Adb) J2300 (11)
3: Open-Q 660 µSOM Development Kit The UART connection used on the Open-Q 660 is a USB micro B connector (J1600). This debug UART is available over USB via the FTDI FT232RQ chip on the carrier board. To get the serial terminal working with a PC, user needs to ensure that the appropriate FTDI drivers are installed. -
Page 27: Micro Sd Card Socket J1500 (34)
3: Open-Q 660 µSOM Development Kit 3.7.11 Micro SD Card Socket J1500 (34) Figure 14. Micro SD Card Socket J1500 J1500 (Micro-SD card connector) provides 4-bit secure digital (SD) interface for external storage. It is located on the bottom side of the carrier board right under the Display Module. The SD interface supports High Speed mode. -
Page 28: Display Connector J1300 (30)
Figure 15. Display Connector J1300 The 100-pin display connector, J1300, allows for an optional display adapter to be connected to the development kit. Lantronix offers a compatible LCD panel accessory for the Open-Q 660 µSOM Development Kit. It can be purchased here: https://shop.intrinsyc.com/products/open-q-810-820-lcd. -
Page 29: Camera Connectors J1000 (15), J1100 (16), J1200 (17)
The Open-Q 660 µSOM Development Kit includes three camera interface connectors, J1000, J1100 and J1200 allowing users to connect multiple camera adapters to the development kit. Lantronix offers compatible camera module accessories for the Open-Q 660 µSOM Development Kit here: https://shop.intrinsyc.com/collections/accessories. -
Page 30: Camera Flash/Torch Connectors J1001 (18) And J1201 (19)
3: Open-Q 660 µSOM Development Kit Figure 16. Typical Camera Connector 3.7.14 Camera Flash/Torch Connectors J1001 (18) and J1201 (19) In addition to the three camera connectors, the video capturing subsystem of the Open-Q 660 µSOM Development Kit is equipped with two connectors for flash or torch devices (J1001 and J1201). The power management IC PM660 has three flash channels, each with a maximum 1.5A rated regulated current sink. -
Page 31: Figure 17. Camera Flash/Torch Connectors J1001 (18) And J1201 (19)
3: Open-Q 660 µSOM Development Kit Figure 17. Camera Flash/Torch Connectors J1001 (18) and J1201 (19) Table 9. Camera Flash/Torch Connectors pinout Pin No Signal Name Description SOM_SYS_PWR_PER System power 3.9V. Current limited to <0.5A System ground GPIO_41_FL_STROBE_TRIG APQ GPIO 41, input from external CMOS level flash trigger FLASH_LED1 or FLASH_LED2 PM660 flash current sink channel 1 and 2, Full scale 0.24A regulated in 48 steps... -
Page 32: Digital Io Expansion Header J2200 (31)
3: Open-Q 660 µSOM Development Kit Typical interfacing to these flash channels is shown below: 3.7.15 Digital IO Expansion Header J2200 (31) Figure 18. Digital IO Expansion header J2200 The header J2200 is a 20-pin connector that provides access to a selection of SOM GPIO signals and power rails. -
Page 33: Table 10. Digital Io Expansion Header J2200 Pinout
3: Open-Q 660 µSOM Development Kit Table 10. Digital IO Expansion Header J2200 Pinout Signal Description Signal Description PMIC LDO Regulator L13A. PMIC LDO Regulator VREG_L13A_1P8 VREG_L13A_1P8 1.8V L13A. 1.8V GPIO_0_BLSP1_S APQ BLSP1 SPI, GPIO_0. Carrier board switching MB_VREG_3P3 PI_MOSI Master output regulator. -
Page 34: Sensor Io Expansion Header J2100 (25)
3: Open-Q 660 µSOM Development Kit 3.7.16 Sensor IO Expansion Header J2100 (25) Figure 19. Sensor Expansion Header J2100 The sensor expansion header J2100 allows for a 24-pin connection to an optional sensor board. If user application does not require a sensor, then this header can be used for other applications that require I2C, SPI or GPIO input and output connections. -
Page 35: Audio Inputs Expansion Header J1900 (33)
3: Open-Q 660 µSOM Development Kit LPI_GPIO_8_SPI_1_C Low Power APQ GPIO LPI_GPIO_10_SPI_1_ Low Power APQ GPIO 8, SPI1 Chip Select Neg. MOSI 10, SPI1 Master Output LPI_GPIO_9_SPI_1_C Low Power APQ GPIO LPI_GPIO_11_SPI_1_ Low Power APQ GPIO 9, SPI1 Clock MISO 11, SPI1 Master Input LPI_GPIO_1_PWR_E Low Power APQ GPIO... -
Page 36: Audio Outputs Expansion Header J1901 (32)
3: Open-Q 660 µSOM Development Kit Table 12. Audio Inputs Expansion Header Pinout J1900 (33) Signal Description Signal Description CDC_IN1_P Codec Input 1 Positive CDC_IN1_N Codec Input 1 Negative CDC_IN5_P Codec Input 5 Positive CDC_IN5_N Codec Input 5 Negative CDC_MIC_BIAS1 Microphone Bias 1 CDC_MIC_BIAS3 Microphone Bias 3... -
Page 37: Figure 21. Audio Outputs Expansion Header J1901 (32)
3: Open-Q 660 µSOM Development Kit Figure 21. Audio Outputs Expansion Header J1901 (32) Table 13. Audio Outputs Expansion Header Pinout J1901 Signal Description Signal Description Codec Line Out 1 CDC_LINE_OUT1_ Codec Line Out 1 CDC_LINE_OUT1_P Positive Negative Codec Line Out 2 CDC_LINE_OUT2_ Codec Line Out 2 CDC_LINE_OUT2_P... -
Page 38: Audio Io Expansion Headers 1 And 2, J2000 (9) And J2001 (7)
3: Open-Q 660 µSOM Development Kit Signal Description Signal Description 5.0V Carrier Board MB_VREG_5P0 System Ground Switching Regulator 3.7.19 Audio IO Expansion Headers 1 and 2, J2000 (9) and J2001 (7) Figure 22. Audio IO Expansion Headers 1 and 2, J2000 and J2001 The Audio IO expansion headers J2000 and J2100 are 40-pin and 20-pin connecters that expose digital audio related signals as described in the pinout table below. - Page 39 3: Open-Q 660 µSOM Development Kit Signal Description Signal Description GPIO_8_BLSP3_ APQ BLSP3, GPIO 8, Ground SPI_MOSI SPI Master Output GPIO_9_BLSP3_ APQ BLSP3, GPIO 9, PM660_GPIO_3_DIV_ PMIC GPIO 3, Clock output SPI_MISO SPI Master Input CLK_1_R_IO GPIO_10_BLSP3 APQ BLSP3, GPIO 10, GPIO_61_MI2S_1_MC APQ GPIO 61, MI2S 1, _SPI_CS_N...
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Page 40: Table 15. Audio Io Expansion Header #2 J2001 Pinout
3: Open-Q 660 µSOM Development Kit Carrier Board Regulator, GPIO_31_AUD_IO_GP MB_VREG_5P0 APQ GPIO 31 5.0V GPIO_28_AMP_FAUL DC_IN_12V Main 12.0V Power APQ GPIO 28 GPIO_29_AMP_RST_ Ground APQ GPIO 29 Table 15. Audio IO Expansion Header #2 J2001 Pinout Signal Description Signal Description Analog Microphone GPIO_62_MI2S_2_M... -
Page 41: Audio Headset Jack J1800 (8)
3: Open-Q 660 µSOM Development Kit 3.7.20 Audio Headset Jack J1800 (8) In addition to expansion headers, the user can use standard 3.5mm Audio Headset Jack J1800 directly, which provides stereo output to headphone, microphone input and headset detection circuits. Figure 23. -
Page 42: Quiet Thermistor Rt800 (35)
3: Open-Q 660 µSOM Development Kit Figure 25. Channel 0 and 1 WLAN/BT routing and PCB Antennas on Carrier Board If more advanced antenna solution is required it is always possible to connect custom antennas to the SOM U.FL connectors. 3.7.22 Quiet Thermistor RT800 (35) The Quiet Thermistor RT800 is provided to allow better control over the system thermal management... -
Page 43: Haptic Output Header J802 (10)
3: Open-Q 660 µSOM Development Kit Figure 26. Quiet Thermistor RT800 Location (34) 3.7.23 Haptic Output Header J802 (10) The haptic output header J802 is provided for the user to gain access to the SOM’s PM660 haptic output driver. This driver supports both ERM and LRA modes. Pin 1 is positive and pin 2 is negative driver’s lines. Figure 27.