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This document is provided with the BOOSTXL-DRV8305EVM customer evaluation module (EVM) as a
supplement to the DRV8305 data sheet
Amplifiers and Voltage
implementation of the BoosterPack™ plug-in module.
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BOOSTXL-DRV8305EVM Schematic
Trademarks
BoosterPack, LaunchPad, NexFET, Piccolo, InstaSPIN-FOC, InstaSPIN, MotorWare are trademarks of
Texas Instruments.
All other trademarks are the property of their respective owners.
SLVUAI8A - August 2015 - Revised June 2017
Submit Documentation Feedback
BOOSTXL-DRV8305EVM User's Guide
Regulator). This user's guide provides details on the setup and hardware
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Copyright © 2015-2017, Texas Instruments Incorporated
SLVUAI8A - August 2015 - Revised June 2017
(DRV8305 Three Phase Gate Driver With Current Shunt
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BOOSTXL-DRV8305EVM User's Guide
User's Guide
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Summary of Contents for Texas Instruments BOOSTXL-DRV8305EVM
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Page 1: Table Of Contents
User's Guide SLVUAI8A – August 2015 – Revised June 2017 BOOSTXL-DRV8305EVM User’s Guide This document is provided with the BOOSTXL-DRV8305EVM customer evaluation module (EVM) as a supplement to the DRV8305 data sheet (DRV8305 Three Phase Gate Driver With Current Shunt Amplifiers and Voltage Regulator). -
Page 2: Boostxl-Drv8305Evm
BOOSTXL-DRV8305EVM www.ti.com BOOSTXL-DRV8305EVM PCB 3-D Views Figure 1 shows the top view of the BOOSTXL-DRV8305EVM board. Figure 2 shows the BoosterPack header signals. Figure 1. PCB Image (From Above) BOOSTERPACK -> LAUNCHPAD 3.3V INH_A INL_A nFAULT VSEN_A INH_B VSEN_B INL_B... -
Page 3: Pcb 3-D Views
Figure 4 show the top and bottom three-dimensional PCB views. Figure 3. 3-D Top View Figure 4. 3-D Bottom View SLVUAI8A – August 2015 – Revised June 2017 BOOSTXL-DRV8305EVM User’s Guide Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated... -
Page 4: Introduction
Introduction The BOOSTXL-DRV8305EVM BoosterPack is a complete 3-phase driver stage in order to evaluate motor application with the DRV8305 motor gate driver. It utilizes a compact and modular form factor for ease of use and is designed to dock with compatible TI LaunchPad™ development kits for a complete motor control system. -
Page 5: Pinout
Introduction www.ti.com Pinout The BOOSTXL-DRV8305EVM brings out a mixture of power, control, and feedback signals to the XL LaunchPad headers. Figure 6. BOOSTXL-DRV8305EVM Pinout • Terminal block headers for the power supply and motor connections • Onboard LM16006 step-down buck regulator to provide 3.3-V power to the LaunchPad •... -
Page 6: Getting Started
Getting Started Requirements The BOOSTXL-DRV8305EVM is not a standalone motor control kit and requires a compatible XL LaunchPad to provide the appropriate motor control signals. The BOOSTXL-DRV8305EVM has been specifically designed for the LAUNCHXL-F28027F InstaSPIN-FOC LaunchPad. In addition to the BoosterPack and a compatible XL LaunchPad, a 3-phase motor and sufficient power supply are required. -
Page 7: Connecting The Hardware
4. Enable the power supply. A fault may appear on the nFAULT LED. This is normal and should be cleared when the status registers are read or EN_GATE is taken HIGH. 5. Enable the control algorithm and begin spinning the motor. The BOOSTXL-DRV8305EVM BoosterPack combined with a compatible XL LaunchPad will provide a complete motor drive and control evaluation platform. -
Page 8: Detailed Hardware Description
Detailed Hardware Description The BOOSTXL-DRV8305EVM BoosterPack is a complete drive stage for 3-phase motor applications. The design consists of the DRV8305 motor gate driver, CSD18540Q5B N-Channel NexFET Power MOSFETs, and LMR16006 buck regulator. See the respective data sheets for the DRV8305 (SLVSCX2), CSD18540Q5B (SLPS488), and LMR16006 (SNVSA24) for more information concerning each device. -
Page 9: Boosterpack Gpio Signals
The InstaSPIN GUI allows easy access to read and modify the DRV8305’s internal registers. These can be accessed on the DRV8305 tab of the InstaSPIN Universal GUI. Figure 11. Enable System SLVUAI8A – August 2015 – Revised June 2017 BOOSTXL-DRV8305EVM User’s Guide Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated... -
Page 10: Drv8305 Spi Registers
Manual reads or writes to individual registers can be made with the Manual Write and Manual Read buttons (in decimal). Figure 12. DRV8305 SPI Registers BOOSTXL-DRV8305EVM User’s Guide SLVUAI8A – August 2015 – Revised June 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated... -
Page 11: Boostxl-Drv8305Evm Schematic
INH_C PWRGD VSEN_PVDD GND INL_C LMR16006XDDC Green SCLK ISEN_A 20.0k ISEN_B EN_GATE ISEN_C WAKE VSEN_A VSEN_B Figure 13. BOOSTXL-DRV8305EVM Schematic SLVUAI8A – August 2015 – Revised June 2017 BOOSTXL-DRV8305EVM User’s Guide Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated... -
Page 12: Hardware Source Files
The complete design files can be found on the tool folder, including the schematic, Gerbers, designs files, PCB views, and bill of materials. BOOSTXL-DRV8305EVM User’s Guide SLVUAI8A – August 2015 – Revised June 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated... - Page 13 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (August 2015) to A Revision ..................... Page ....................• Added the Operating Conditions section SLVUAI8A – August 2015 – Revised June 2017 Revision History Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated...
- Page 14 STANDARD TERMS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein.
- Page 15 FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
- Page 16 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes.
- Page 17 Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2018, Texas Instruments Incorporated...
- Page 18 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2019, Texas Instruments Incorporated...
- Page 19 Support & Product Order Tools & Technical Community Folder Software Documents CSD18540Q5B SLPS488B – JUNE 2014 – REVISED APRIL 2017 CSD18540Q5B 60-V, N-Channel NexFET™ Power MOSFETs 1 Features Product Summary • Ultra-Low Q and Q = 25°C TYPICAL VALUE UNIT •...
- Page 20 175°C......................• Added Receiving Notification of Documentation Updates Community Resources to Device and Documentation Support section..................................• Updated the mechanical drawing............................Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B...
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Page 21: Specifications
R is determined by the user’s board θJC θJA design. (2) Device mounted on FR4 material with 1-in (6.45-cm ), 2-oz (0.071-mm) thick Cu. Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B... -
Page 22: Typical Mosfet Characteristics
2-oz (0.071-mm) thick 2-oz (0.071-mm) thick DRAIN DRAIN M0137-02 M0137-01 5.3 Typical MOSFET Characteristics = 25°C (unless otherwise stated) Figure 1. Transient Thermal Impedance Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B... - Page 23 - Case Temperature (° C) - Gate-to-Source Voltage (V) D006 D007 = 250 µA Figure 6. Threshold Voltage vs Temperature Figure 7. On-State Resistance vs Gate-to-Source Voltage Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B...
- Page 24 Figure 10. Maximum Safe Operating Area Figure 11. Single Pulse Unclamped Inductive Switching 100 125 150 175 200 - Case Temperature (° C) D012 Figure 12. Maximum Drain Current vs Temperature Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B...
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Page 25: Glossary
TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.3 Trademarks NexFET, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 6.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. - Page 26 0.419 4.90 5.00 5.10 5.90 6.00 6.10 3.48 3.58 3.68 1.27 TYP 0.36 0.46 0.56 0.46 0.56 0.66 0.57 0.67 0.77 0° — — θ 1.40 TYP Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B...
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Page 27: Recommended Pcb Pattern
0.562 x 4 0.286 0.746 x 8 (0.086) 2.186 4.318 (0.170) 0.300 (0.012) 1.270 (0.050) (0.050) 1.270 (0.051) (0.030) (0.060) 1.294 (0.042) 0.766 1.525 1.072 (0.259) 6.586 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B... - Page 28 3. Material: black static-dissipative polystyrene. 4. All dimensions are in mm (unless otherwise specified). 5. A0 and B0 measured on a plane 0.3 mm above the bottom of the pocket. Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Product Folder Links: CSD18540Q5B...
- Page 29 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing Ball material (4/5) CSD18540Q5B ACTIVE VSON-CLIP 2500 RoHS-Exempt NIPDAU | SN Level-1-260C-UNLIM -55 to 175 CSD18540...
- Page 30 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 Addendum-Page 2...
- Page 31 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated...
- Page 32 Support & Sample & Product Tools & Technical Community Folder Software Documents LMR16006 SNVSA24 – OCTOBER 2014 ® LMR16006 SIMPLE SWITCHER 60 V 0.6 A Buck Regulators With High Efficiency ECO Mode 1 Features 3 Description The LMR16006 is a PWM DC/DC buck (step-down) •...
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Page 33: Revision History
12.6 Glossary ..............8.1 Overview ..............13 Mechanical, Packaging, and Orderable 8.2 Functional Block Diagram ......... Information ............5 Revision History DATE REVISION NOTES October 2014 Initial release. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006... - Page 34 Power input voltage pin. Input for internal supply and drain node input for internal high-side MOSFET. Switch node. Connect to inductor, diode, and C cap. boot Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 35 JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, numberof thermal vias, board size, ambient temperature, and air flow. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 36 UNIT SW (SW PIN) Switching frequency LMR16006X LMR16006Y 1785 2100 2415 Minimum turn-on time = 2.1 MHz ON_MIN Maximum duty cycle LMR16006X LMR16006Y (1) Ensured by design. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 37 3.45 3.35 3.25 Shutdown 3.15 Sleep Input Voltage (V) Temperature (qC) D005 D006 = 5 V Figure 5. Shut-Down Current and Quiescent Current Figure 6. UVLO Threshold Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 38 100 mA Load 10 mA Load Input Voltage (V) Vin (V) D008 D009 = 5 V = 600 mA =5 V Figure 7. Line Regulation Figure 8. Dropout Curve Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 39 Leading Edge Blanking Bootstrap Regulator Logic & PWM Latch Driver Wimp FET CB Refresh ± Frequency Shift 0.765 V COMP ± Main OSC ô Bandgap Slope SHDN Compensation Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 40 If the FB pin voltage is lower than the internal reference voltage for a considerable time, the output of the error amplifier will respond by clamping the error amplifier Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 41 When the load current is low and the output voltage is within regulation, the device enters an ECO mode and draws only 28 µA input quiescent current. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
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Page 42: Submit Documentation Feedback
2. Optimize your design for key parameters like efficiency, footprint and cost using the optimizer dial and compare this design with other possible solutions from Texas Instruments. 3. WEBENCH Power Designer provides you with a customized schematic along with a list of materials with real time pricing and component availability. - Page 43 0.15 V. Using these numbers gives a minimum capacitance of 10.8 µF. For ceramic capacitors, the ESR is usually small enough to ignore in this calculation. Aluminum electrolytic and tantalum capacitors have higher ESR that should be taken into account. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 44 = 0.6 A, Cin = 2.2 µF, ƒ = 700 kHz, yields an input voltage ripple of 97 mV OUT_max and a rms input ripple current of 0.3 A. cirms 0.25 (10) Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 45 Table 2. Recommended Typical Output Voltage Vout (V) R1 (kΩ) R2 (kΩ) L (μH) Cout (μF) LMR16006 Y 54.9 (1%) 10 (1%) LMR16006 Y 147 (1%) 10 (1%) Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 46 Time (200 µs/DIV) = 24 V = 12 V = 600 mA = 24 V = 12 V = 600 mA Figure 12. Start-Up Figure 13. Shut-Down Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 47 Time (100 µs/DIV) Time (800 µs/DIV) = 12 V = 5 V = 12 V = 5 V Figure 16. Short Circuit Entry Figure 17. Short Circuit Recovery Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 48 6. For more detail on switching power supply layout considerations see AN-1149 Layout Guidelines for Switching Power Supplies SNVA021 11.2 Layout Example Figure 18. Layout Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMR16006...
- Page 49 2. Optimize your design for key parameters like efficiency, footprint and cost using the optimizer dial and compare this design with other possible solutions from Texas Instruments. 3. WEBENCH Power Designer provides you with a customized schematic along with a list of materials with real time pricing and component availability.
- Page 50 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing Ball material (4/5) LMR16006XDDCR ACTIVE SOT-23-THIN 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 D02X...
- Page 51 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
- Page 52 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Reel Reel Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1 (mm) LMR16006XDDCR SOT- 3000 178.0 23-THIN LMR16006XDDCT SOT- 178.0 23-THIN LMR16006YDDCR...
- Page 53 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2017 *All dimensions are nominal Device Package Type Package Drawing Pins Length (mm) Width (mm) Height (mm) LMR16006XDDCR SOT-23-THIN 3000 210.0 185.0 35.0 LMR16006XDDCT SOT-23-THIN 210.0 185.0 35.0 LMR16006YDDCR SOT-23-THIN 3000 210.0 185.0 35.0 LMR16006YDDCT SOT-23-THIN 210.0 185.0 35.0...
- Page 54 PACKAGE OUTLINE DDC0006A SOT - 1.1 max height SCALE 4.000 3.05 1.100 2.55 0.847 1.75 0.1 C 1.45 PIN 1 INDEX AREA 4X 0.95 3.05 2.75 C A B 0 -8 TYP 0.25 SEATING PLANE 0.20 GAGE PLANE 0.12 4214841/B 11/2020 NOTES: 1.
- Page 55 EXAMPLE BOARD LAYOUT DDC0006A SOT - 1.1 max height SYMM 6X (1.1) 6X (0.6) SYMM 4X (0.95) (R0.05) TYP (2.7) LAND PATTERN EXAMPLE EXPLOSED METAL SHOWN SCALE:15X METAL UNDER SOLDER MASK SOLDER MASK METAL SOLDER MASK OPENING OPENING EXPOSED METAL EXPOSED METAL 0.07 MIN 0.07 MAX...
- Page 56 EXAMPLE STENCIL DESIGN DDC0006A SOT - 1.1 max height SYMM 6X (1.1) 6X (0.6) SYMM 4X(0.95) (R0.05) TYP (2.7) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214841/B 11/2020 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
- Page 57 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated...
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