Device Connections; Pcb Layout Guidelines - Texas Instruments SimpleLink CC2651R3SIPA Manual

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Table 10-3 provides the bill of materials for the alternate application circuit using the CC2651R3SIPA module in
Section 10.2.
For full operation reference design, see the
Table 10-3. Bill of Materials for Alternate Application Schematic
PART
VALUE
REFERENCE
(1)
C14, C15, C91 15 pF
C81 12 pF
(2)
C17, C18
2.7 nH
(3)
L16
2.2 nH
J7 U.FL
U1 CC2651R3SIPA
Y6 32.768kHz
(1) C15 is placed when using the integrated antenna. C14 is placed when using an external antenna
(2) C17 and C18 are optional, but should be place in the design as it allows for additional tuning of the resonance frequency
(3) L16 is mounted when using the integrated antenna. The recommended starting value when following the layout recommendation in
Section 10.4.4 is 2.7 nH for a 1.6 mm board and 2.2 nH for a 0.8 mm board.

10.3 Device Connections

10.3.1 Reset
In order to meet the module power-on-reset requirements, VDDS (Pin 37) and VDDS_PU (Pin 38) should be
connected together. If the reset signal is not based upon a power-on-reset and is derived from an external MCU,
then VDDS_PU (Pin 38) should be No Connect (NC). Please refer to
implementation.
10.3.2 Unused Pins
All unused pins can be left unconnected without the concern of having leakage current.

10.4 PCB Layout Guidelines

This section details the PCB guidelines to speed up the PCB design using the CC2651R3SIPA module. The
integrator of the CC2651R3SIPA modules must comply with the PCB layout recommendations described in the
following subsections to minimize the risk with regulatory certifications for the FCC, IC/ISED, ETSI/CE, and RAR
(UK). Moreover, TI recommends customers to follow the guidelines described in this section to achieve similar
performance to that obtained with the TI reference design.
10.4.1 General Layout Recommendations
Ensure that the following general layout recommendations are followed:
• Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
• Do not run signal traces underneath the module on a layer where the module is mounted.
Copyright © 2023 Texas Instruments Incorporated
LP-CC2651R3SIPA Design
MANUFACTURER PART NUMBER
Murata GRM0335C1E150JA01D
Murata GRT0335C1H120JA02D
Do Not Mount
Murata LQP03TN2N7B02
Murata LQP03TG2N2B02
Hirose U.FL-R-SMT-1(01)
Texas Instruments CC2651R3SIPAT0MOUR
TAI-SAW
Product Folder Links: CC2651R3SIPA
SWRS278B – FEBRUARY 2022 – REVISED AUGUST 2023
Files.
Capacitor, ceramic, 15 pF, 50 V, ±5%,
C0G/NP0, 0201
Capacitor, ceramic, 12 pF, 50 V, ±5%,
C0G/NP0, 0201
Inductor, thick film, 2.7 nH, 500 mA, 200
mOhm, ±0.1 nH, 0201
Inductor, thick film, 2.2 nH, 500 mA, 200
mOhm, ±0.1 nH, 0201
U.FL (UMCC) connector receptacle, male
pin 50 Ω, surface mount solder
SimpleLink™ multiprotocol 2.4-GHz
wireless MCU with integrated power
amplifier and Antenna
Crystal, resonator, 32.768kHz, -40
TZ1166C
o
+125 C, SMD
Figure 10-1 for the recommended circuit
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CC2651R3SIPA
DESCRIPTION
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