Hardware Installation and Reference Guide
2.2.4
Temperature and Humidity Requirements
To ensure the normal operation and prolonged service life of the switch, maintain an appropriate temperature
and humidity in the machine room. Working in an environment with too high or too low temperature and humidity
for a long period may damage the switch.
In an environment with high relative humidity, the insulating material may have poor insulation or even leak
electricity.
In an environment with low relative humidity, the insulating strip may dry and shrink, loosening screws.
In a dry environment, the internal circuits are prone to static electricity.
A high temperature can accelerate the aging process of insulation materials, greatly reducing the reliability
of the switch and severely affecting its service life.
Note
The working temperature and humidity of the switch are measured at the point that is 1.5 m (59.06 in.) above
the floor and 0.4 m (15.75 in.) before the device when there is no protective plate in front or at the back of the
switch.
2.2.5
Cleanliness Requirements
Dust poses a major threat to the switch. The indoor dust takes on a positive or negative static electric charge
when falling on the switch, causing poor contact of the metallic joint. Such electrostatic adhesion may occur
more easily when the relative humidity is low, not only affecting the service life of the switch, but also causing
communication faults. The following table describes the requirements for the dust content and granularity in the
machine room.
Table 2-1
Requirements for Dust
Dust
Dust particles (diameter≥ 0.5 μm)
Dust particles (diameter ≥ 5 μm)
Apart from dust, the salt, acid, and sulfide in the air in the machine room must meet strict requirements. These
harmful substances will accelerate metal corrosion and component aging. Therefore, the machine room should
be properly protected against the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen
dioxide, and chlorine gas. The following table lists limit values for harmful gases.
Table 2-2
Requirements for Gases
Gas
Sulfur dioxide (SO
Hydrogen sulfide
Nitrogen dioxide (NO
Unit
Particles/m
Particles/m
Average (mg/m
)
0.3
2
(H
S)
0.1
2
)
0.5
2
3
3
3
)
12
Preparing for Installation
Maximum Quantity
6
3.5×10
4
3×10
3
Maximum (mg/m
)
1.0
0.5
1.0
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