Introduction; Reference Documents; Acronyms And Terminology - Edge-Core AS7326-56X Programming Manual

1. Introduction

The Switch is a 1U high and 536mm deep chassis base on Broadcom Trident3 chipset.
The physical layer will consist of 48x25G SFP28, 8x100G QSFP28 ports and 2x10G SFP+
ports. The chassis will have a nominal operating temperature range of 0 to +40 Degree C.
The CPU board is for management of the switch board , the solution is Intel BroadWell-
DE, that CPU board provide these interface: x4 PCIe2.0, SGMII, MDC/MDIO, USB2.0, and
2channel I2C connect to the switch board. There are mSATA and eUSB devices in the CPU
board and memory support DDR4 with ECC sodimm.
The following are key features of the product:

Redundant and hot-swappable PS (1+1)
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Rear facing for all connections
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Redundant and hot swappable fans (4+1)
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1U rank mountable or desktop target 515mm

48 SFP28 25G + 8 QSFP28 40G/100G + 2 10G SFP+ ports

CPU module
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USB port (5V/1A)
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SyncE & 1588 support (Reserve)
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Environmental goal operation:
Front to Back Air Flow (0 to +45 degree C)
Back to Front Air Flow (0 to +45 degree C)

1.1. Reference Documents

 Broadcom BCM56870 Data Sheet
 IDT89307 WANPLL Data Sheet
544040_Broadwell_DE_EDS_vol1_544040_rev1p0.pdf
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 544041_Broadwell_DE_EDS_Registers_Vol2_544041_v1_0.pdf
 544042_Broadwell_DE_SoC_EDS_vol3_544042_v1_0.pdf
 544043_Broadwell_DE_EDS_rev_0_75.pdf
 544044_Broadwell_DE_EDS_Vol5_544044_rev0_71.pdf

BCV-R-SB_SCH_20140804.pdf

CamelBackMnt_FAB-B_NCOR2_09-09-14.pdf

1.2. Acronyms and Terminology

Some of the acronyms used in this document are listed below:
CCSR Configuration, Control, and Status Register
PCB Printed Circuit Board
PCBA Printed Circuit Board Assembly
PSU Power Supply Unit
BMC Baseboard management controller.
POR Power On Reset
EDGECORE NETWORKS CORPORATION 2018
CPU: Intel Broadwell-DE XeonD-1518
DDR SDRAM: 8GB x 2 2133MHz with ECC (DDR4 SO-DIMM)
SPI Flash (Boot): 16MB
USB to NAND Flash memory : 8GB SLC
mSATA: 32GB MLC (Reserve)
m.2 SATA: 64GB MLC
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