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ONTRAK II CE Series Installation Manual

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OnTrak DSS-200
TM
Series II CE
Installation
Document 20-0200-017-004 (Clean Room), Revision C
Document 20-0200-018-004 (Paper), Revision C
Software Version 2.0.1a
Revision C
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February 1999

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  • Page 1 OnTrak DSS-200 Series II CE Installation Document 20-0200-017-004 (Clean Room), Revision C Document 20-0200-018-004 (Paper), Revision C Software Version 2.0.1a Revision C Go Back to Main Menu February 1999...
  • Page 2 The information contained in this document is subject to change without notice. OnTrak Systems, Incorporated makes no warranty of any kind with regard to this material including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. OnTrak Systems, Incorporated shall not be liable for errors contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this material.
  • Page 3 Installation Describes the detailed steps required to install and hook up the system. Technical Bulletins This section is provided to store OnTrak technical bulletins. Facility Layout Contains the facility layout drawings. Lam Research Corporation strives to continually improve products and often creates custom configurations for our customers on special request.

  • Page 4: Reorder & Revision History

    REORDER & REVISION HISTORY REORDER INSTRUCTIONS To reorder the complete three volume set of Series II CE System manuals, order the following: 20-0200-018 Paper Manuals 20-0200-017 Clean Room Manuals To reorder one of the manuals in the Series II CE System manual set, order the following: 20-0200-018-001 Operation Manual (paper manual) 20-0200-017-001 Operation Manual (clean room manual) 20-0200-018-003 Documentation Manual (paper manual)
  • Page 5 REVISION HISTORY Release Date October, 1996 Description Release of DSS-200 Series II, Installation Manual, Revision A Software Level: 1.0.1 Part Numbers: 20-0200-018-004 Rev. A, Standard Version 20-0200-017-004 Rev. A, Clean Room Version Release Date January, 1998 Description Release of DSS-200 Series II, Installation Manual, Revision B Software Level: 1.3.0 Part Numbers: 20-0200-018-004 Rev.
  • Page 6 Manual Change Request Please provide the information requested below to assist us in correcting mistakes in the manual. Send the form to Product Support Department, Dept. OT677, CMP/Clean Division, Lam Research Corporation, 47131 Bayside Parkway, Fremont, CA 94538 or fax to (510) 572-1389. Part 1 Contact Information (Who are you?) Name: _____________________________________________ Title: __________________________ Date: ____________...

  • Page 7: Table Of Contents

    TA B L E O F C O N T E N T S . T A B L E O F C O N T E N T S REORDER & REVISION HISTORY ................IV TABLE OF CONTENTS .................VII INTRODUCTION ..................
  • Page 8 INSTALLATION PROCEDURE ............5-1 REMOVING THE COMPONENT RESTRAINTS ............5-1 INSTALLATION SEQUENCE ..................5-2 CUSTOMER (INSTALLATION) ENGINEER ............. 5-6 II CE ........... 5-7 ACILITY ONFIRMATION EPORT ERIES INSTALLATION START-UP ..............6-1 PREREQUISITES ......................6-1 ....................... 6-3 ATERIALS ....................... 6-4 QUIPMENT INSTALLATION START-UP CHECKLIST ..............

  • Page 9: Table Of Contents

    TA B L E O F C O N T E N T S ................. SING YDROGEN EROXIDE ................SING MMONIUM YDROXIDE NH4OH USAGE GUIDELINES ..........NH4OH-1 BRUSH HEIGHT OPTIMIZATION ..........OPT-1 SYSTEM BASELINE DI WATER ................OPT-3 MEGASONIC STATION BASELINE ..............OPT-4 SYSTEM BASELINE AMMONIUM HYDROXIDE ..........
  • Page 10 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 11: Introduction

    DSS-200 Series II system. Initial start-up and qualification of the system for production processing is ONLY performed by the OnTrak Customer Service (Installation) Engineer at the installation site. These sections are arranged to be used chronologically. The activities in each section prepare the user for the upcoming instructions.
  • Page 12 Leveling the System Sequential Order of System Connections ELECTRICAL HAZARD: Do Not attempt to start the system without the OnTrak Installation Engineer present. The OnTrak Systems Installation Engineer will perform the start-up activities after the customer has completed the uncrating, moving, preliminary installation, and facilities hook-up.

  • Page 13: Safety

    INTRODUCTION The safe operation of the DSS-200 system is the responsibility of the user. OnTrak provides safety information regarding the design of the system and its proper use. This includes hazards which effect the operating process, the machinery and the operator. OnTrak assumes no responsibility or liability for the safety procedures adopted by the user nor for the procedures used while operating the DSS-200.

  • Page 14: Safety Notations

    SAFETY NOTATIONS Safety is always a major concern when installing, operating, and maintaining a new piece of equipment. In order to ensure that the safety messages presented in this volume are visible and immediately recognizable, the following symbols will accompany the various warnings and cautions.
  • Page 15 C h a p t e r 2 S A F E T Y CAUTION! IRRITANT MATERIAL: This symbol forewarns of a material that can cause irritation. WARNING! ROLLER CRUSH: This symbol forewarns of possible physical damage to hands or fingers. WARNING! PINCH POINT: This symbol forewarns of possible physical damage to hands or fingers.

  • Page 16: General Safety Provisions

    DANGER! POISON: This symbol forewarns of the presence of poisonous substances. WARNING! PINCH POINT: This symbol identifies Pinch Points that can result in personal injury. (SEMI S1-90 standards.) WARNING! MOVING MACHINERY: This symbol forewarns of possible danger from moving machinery. WARNING! INFRARED RADIATION: This symbol forewarns of possible danger from infrared radiation.
  • Page 17 C h a p t e r 2 S A F E T Y Interlocks are included which shut down processing in a particular station or turn off power to protect the operator from accidental contact with dangerous moving components, hazardous conditions or hazardous substances.

  • Page 18: Safety Precautions

    SAFETY PRECAUTIONS ELECTRICAL SAFETY Safety Shields Electrical safety shields isolate the high voltage components to prevent accidental contact by technicians. Use extreme caution when working around the shielded components. If it is necessary to remove the safety shield from a component in order to work on it, first turn the machine OFF and disconnect the power.
  • Page 19 3. Turn the main circuit breaker to the OFF position. 4. Disconnect the power cord. 5. Get the lockout block (OnTrak part #71-0002-017) and the padlock (Ontrak part #71-0002-016) from the safety officer. (The system is shipped with the lockout block and padlock sealed in a plastic bag inside the electrical enclosure.)

  • Page 20: Dss-200 Type 3 And Type 4 Task Hazards

    DSS-200 TYPE 3 AND TYPE 4 TASK HAZARDS WARNING! ELECTRICAL HAZARD: The following procedures are DSS-200 type 3 and type 4 task hazards. These procedures should be performed by qualified electrical technicians only. Power Supply Calibration All power supply calibration procedures are classified as Type 4 Electrical Task Hazards.

  • Page 21: Emergency Machine Off

    C h a p t e r 2 S A F E T Y The Spin Station activity STOPS when the door is opened. When the Spin Station Door door is closed, the system continues processing. An optional pneumatic latch prevents the lid from being opened when the spin station is spinning.

  • Page 22: Maintenance Issues

    Once pressed, the EMO button requires a key to unlock it. The system cannot be put into START again until the EMO switch is unlocked. MAINTENANCE ISSUES Chemical Safety Every operator and maintenance technician must be familiar with the chemicals used in the system. An MSDS (Material Safety Data Sheet) for each potentially dangerous chemical used in the system should be available near the point of use.

  • Page 23: General Operational Safety

    C h a p t e r 2 S A F E T Y GENERAL OPERATIONAL SAFETY Bulkhead Input Station (Optional Feature) Some Series II systems are installed with the input station mounted flush against a wall. Wafer cassettes are loaded into the input station from an adjacent room through a door built into the wall.

  • Page 24: Ergonomic Issues

    Ammonium Hydroxide. This information is believed to be accurate and represents the best information currently available to OnTrak. However, OnTrak makes no warranty of merchantability or any other warranty, expressed or implied with respect to such information, and assumes no liability resulting from its use.

  • Page 25: Health Effects And First Aid

    C h a p t e r 2 S A F E T Y Synonyms Ammonia Solution; Aqua Ammonia; Ammonia Hydroxide; Ammonia Water. Properties Colorless liquid with a sharp, pungent Ammonia odor. If spilled or left open to the atmosphere, ammonium hydroxide gives off ammonia gas at room temperature.
  • Page 26 The OSHA PEL of 35 PPM for Ammonia gas is the short term exposure limit (STEL) reflecting a 15 minute weighted average. NIOSH recommends a 50 PPM, 5 minute ceiling. Inhalation: Corrosive Exposure Effects: Acute exposure to concentrations of: 5 PPM of ammonia vapor may cause mild irritation. 9-50 PPM may cause nasal dryness, olfactory fatigue and moderate irritation.
  • Page 27 C h a p t e r 2 S A F E T Y First Aid: Remove contaminated clothing and shoes immediately. Wash affected area with soap or mild detergent and large amounts of water until no evidence of chemical remains (at least 15-20 minute). In case of chemical burns, cover the effected area with sterile, dry dressing.

  • Page 28: Storage And Disposal

    First Aid: Administer water or milk (milk of magnesia if available) to dilute the solution. DO NOT INDUCE VOMITING, THIS COULD CAUSE FURTHER DAMAGE. Keep the victim warm and quiet. Treat for shock. GET MEDICAL ATTENTION IMMEDIATELY. If vomiting occurs, keep head below hips to prevent aspiration of vomitus.

  • Page 29: Spill And Leak Procedures

    C h a p t e r 2 S A F E T Y SPILL AND LEAK PROCEDURES General Procedures Do not touch the spilled material. Stop the leak if you can do so without risk to any personnel. For small spills, soak them up with vermiculite, floor absorbent or other compatible absorbent material, then place it into a clearly marked container(s) for later disposal.
  • Page 30 The following categories of contamination concentration are presented with the proper respirator required to meet the potential hazard posed by that level of exposure. 250 PPM: Any chemical cartridge respirator with cartridges providing protection against ammonia; any supplied-air respirator; or any self contained breathing apparatus. 500 PPM: Any powered, air-purifying respirator with cartridges providing protection against ammonia;...
  • Page 31 C h a p t e r 2 S A F E T Y MATERIAL SAFETY DATA SHEET Ashland Chemical Co Page 001 Date Prepared: 01/05/96 Date Printed: 02/22/96 MSDS No:0018519-007.001 AMMONIUM HYDROXIDE MB _________________________________________________________________________________ 1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION Material Identity Product Name: AMMONIUM HYDROXIDE MB General or Generic ID: ALKALI...
  • Page 32 MATERIAL SAFETY DATA SHEET Ashland Chemical Co Page 002 Date Prepared: 01/05/96 Date Printed: 02/22/96 MSDS No: 0018519-007.001 AMMONIUM HYDROXIDE MB _________________________________________________________________________________ Developmental Information No data. Cancer Information No data. Other Health Effects No data. Primary Route(s) of Entry Inhalation, Skin contact. _________________________________________________________________________________ 4.
  • Page 33 C h a p t e r 2 S A F E T Y MATERIAL SAFETY DATA SHEET Ashland Chemical Co Page 003 Date Prepared: 01/05/96 Date Printed: 02/22/96 MSDS No: 0018519-007.001 AMMONIUM HYDROXIDE MB _________________________________________________________________________________ Hazardous Products of Combustion May form: ammonia.
  • Page 34 MATERIAL SAFETY DATA SHEET Ashland Chemical Co Page 004 Date Prepared: 01/05/96 Date Printed: 02/22/96 MSDS No: 0018519-007.001 AMMONIUM HYDROXIDE MB _________________________________________________________________________________ Respiratory Protections If workplace exposure limit(s) of product or any component is exceeded (see expo- sure guidelines), a NIOSH/MSHA approved air supplied respirator is advised in absence of proper environmental control.
  • Page 35 C h a p t e r 2 S A F E T Y MATERIAL SAFETY DATA SHEET Ashland Chemical Co Page 005 Date Prepared: 01/05/96 Date Printed: 02/22/96 MSDS No: 0018519-007.001 AMMONIUM HYDROXIDE MB _________________________________________________________________________________ State LIQUID Physical Form HOMOGENEOUS SOLUTION Color CLEAR, COLORLESS, PUNGENT ODOR...
  • Page 36 MATERIAL SAFETY DATA SHEET Ashland Chemical Co Page 006 Date Prepared: 01/05/96 Date Printed: 02/22/96 MSDS No: 0018519-007.001 AMMONIUM HYDROXIDE MB _________________________________________________________________________________ Container/Mode: 55 GAL DRUM/TRUCK PACKAGE NOS Component: None. RQ (Reportable Quantity) - 49 CFR 172.101. Product Quantity (lbs) Component ----------------------- ----------------------------------------------------- 1652...
  • Page 37 C h a p t e r 2 S A F E T Y MATERIAL SAFETY DATA SHEET Ashland Chemical Co Page 007 Date Prepared: 01/05/96 Date Printed: 02/22/96 MSDS No: 0018519-007.001 AMMONIUM HYDROXIDE MB _________________________________________________________________________________ 16. OTHER INFORMATION The information accumulated herein is believed to be accurate but is not warranted to be whether originating with the company or not.
  • Page 38 2-26 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 39: Site Preparation

    C H A P T E R 3 S I T E P R E P A R A T I O N FACILITY REQUIREMENTS NOTE: Refer to the Series II CE Facilities Layout 19-0200-070 (for through the floor configurations), or -071 (for through the wall configurations), located at the end of the appendix.
  • Page 40 FACILITY APPLICATION PROVISION HOOKUP REQUIREMENT SPECIFICATIONS REQUIREMENTS Process Solution Can be used for 30 psi inlet pressure Two 1/4” OD clear, cleaning operations (± 5). Teflon tubing. at the brush stations. Teflon flare bulkhead union. Secondary containment for One PVC slip Through-the-Floor connection @ 1/2”.

  • Page 41: Process Supply Quality Requirements

    CAUTION: Ozone concentrations of > 25 ppm in the DI water will degrade the PVA brushes. An in line ultra violet (UV) light will prevent degradation. OnTrak part number 73-0004-002 is recommended. 2/11/99 DSS-200 Series II CE Installation Rev. C...

  • Page 42: Facility Connections

    FACILITY CONNECTIONS The arrangement of the facility connections are documented in the FACILITY LAYOUT drawing. The facility layout drawings are located at the back of this manual. PLUMBING FACILITY HOOKUP The Series II is designed to be plumbed “through-the-wall” of the system.

  • Page 43: Unpacking

    C H A P T E R 4 U N P A C K I N G PACKAGING AND INSPECTION The DSS-200 packaging is designed to protect the system against damage and contamination during transit. Prior to the packaging procedure the system is completely wiped Wrapping down in a controlled environment.
  • Page 44 HANDLE WITH CARE WARNING SHOCK W ATCH RED INDICATES ROUGH HANDLING. IF RED, NOTE ON BILL OF LADING. INSPECTION MAY BE WARRANTED. The Shock Detector The TIP-N-TELL is designed to indicate when a crate has been Tip-N-Tell tipped too far during the transportation or loading processes. TIP-N-TELL BLUE BEADS IN ARROW SHOWS CONTAINER WAS...

  • Page 45: Removing The Crate

    C h a p t e r 4 U N P A C K I N G Be sure to look for the warning devices. If they are missing, they have been removed. If they are not present on the shipping crate, immediately contact the carrier and Customer Service at 1-800-LAM- HELP or (1-800-526-4357)

  • Page 46: Power Cords

    8 Prior to moving the system into its installation site, follow established procedures for decontamination. If no procedures have been established, the following may be used as a minimum requirement: Move the system into a controlled environment staging area between class 1000 and class 100. Wipe down the entire system with lint free clean room wipes saturated in a solution of 7% IPA and D.I.

  • Page 47: Installation Procedure

    C H A P T E R 5 I N S T A L L A T I O N P R O C E D U R E The facility layout drawing for this system is located at the back of this manual.

  • Page 48: Installation Sequence

    INSTALLATION SEQUENCE To ensure the greatest level of safety in the installation process, use the following sequence of events for hooking up the facilities to the DSS-200 Series II. In order to perform maintenance functions, a minimum of 10 [25.4 cm] inches of clearance is required to remove all rear panels.
  • Page 49 C h a p t e r 5 I N S T A L L AT I O N P R O C E D U R E 8 Set the torpedo level on the mid level frame cross member going from the front of the system to the back and level one end of the system by turning the appropriate feet.
  • Page 50 Each drain should be securely connected using the proper fittings, to avoid leaks and undue stress on the connection. Make sure P-Traps are installed on systems with combined drain/ exhaust. In order to perform maintenance functions, a minimum of 10 [25.4 cm] inches of clearance is required to remove all rear panels.
  • Page 51 20 Connect the pneumatic pressure line to the System Air. Do not Connect Pneumatic use lubricants or sealants on the connection. Pressure Line 21 If ozone is present in the DI water, install the OnTrak ultra violet Ozone Destruction Lamp ozone destruction lamp (73-0004-002) on the DI water input line (Option) (inside system) to prevent deterioration of PVA brushes.

  • Page 52: Customer (Installation) Engineer

    GEM Cable Option the back of the Electrical Enclosure if the system includes this option. The OnTrak Installation Engineer must inspect the boards and other Inspection electrical components in the Electrical Enclosure prior to connecting the system to the facilities power source.

  • Page 53: Facility Confirmation Report - Series Ii Ce

    DSS-200. When you have completed installing your system using the Facilities Drawing and complied with all NOTES, call your OnTrak Customer (Field) Engineer to “bring up” (power up) your system so that final calibrations and adjustments can be performed.
  • Page 54 Verify (visually) that the Input/Brush Station exhaust is connected and plumbed to a DI water exhaust. Verify (visually) that the Input/Brush Station drain is plumbed to a DI Water/ slurry drain and that the drain uses a customer supplied 2” P-Trap. Verify (visually) that the Spin Station exhaust is connected and is plumped to an acid or base exhaust and the Spin Station drain is plumbed to a drain and that the drain uses a 2”...
  • Page 55 Item/Problem #, problem, corrective action and completion date. Safety Problem Completed Facility Confirmation Signature Customer Signature: ______________________________________________ Date: __/__/__ Ontrak Rep. Signature: ______________________________________________ Date: __/__/__ 2/11/99 DSS-200 Series II CE Installation Rev. C P/N 20-0200-018-004, 20-0200-017-004 (CR)
  • Page 56 5-10 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 57: Installation Start-Up

    C H A P T E R 6 OnTrak Systems, Inc. I N S T A L L A T I O N S T A R T - U P This section of the DSS-200 installation manual is used by Field Service Engineers to perform the initial setup of the DSS-200, and by the Application Engineers to optimize process performance.
  • Page 58 The following documents and forms are found in the Appendix: Appendix Documents DSS-200 Installation Start-up Procedure (Checklist) Smooth Wafer Travel (Checklist) NH4OH MSDS Installation Report (Form) Installation Deficiency Log Sheet (Form) Part Requirements For This Installation (Form) Change of Offsets (Form) Environmental Data Collection Form (Page 1 - DI Water and Megasonic, Page 2 - Air) Particle Neutrality Data Collection Form...

  • Page 59: Materials

    C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P The following OnTrak process of record (POR) process recipe files POR Files (Appendix) are found in the Appendix, except where noted.

  • Page 60: Equipment

    When measurements are taken, wafers with flats or notches • must be aligned or oriented in the same position for each measurement. Total Reflection X-ray Florescence (TXRF) is the only OnTrak Trace Metals approved measurement procedure for trace metal measurement. Measurement Equipment Standard calibration and control measures must be in place and verifiable.
  • Page 61 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P Torque Requirements The DSS-200 system uses many chemical inert fasteners (screws), especially in the brush box, that require specific torque settings. If torque settings are exceeded or ignored, failure WILL occur.

  • Page 62: Installation Start-Up Checklist

    INSTALLATION START-UP CHECKLIST System Serial Number: __________________________________ Customer: ________________________ Install started by (print): ___________________________________ Date/time: ______________________ DAY 1 – ELECTRICAL SETUP Verify all Facilities are correct, and sign off and have Customer sign off the Facilities Process Requirements/Confirmation Report-S2 Checklist. WARNING: Ensure tool has been completely unpacked.
  • Page 63 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P Check to see that all ribbon connectors to the Gespac Card cage are securely in place.
  • Page 64 DVM probe pin adaptor. Calibrate all DC Motor Cards. If necessary calibrate the Spindle Motor. Enter the OnTrak process recipes DIW, Ox-Meg, Ox-Amm, if the customer has proprietary recipes enter these as well. Verify that ALL inputs and outputs are working correctly (checklist below).
  • Page 65 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P FIRST BRUSH BOX Verify Brush Station input and output: _______ Lid Close Sensor _______ Wafer Sensor.
  • Page 66 SPIN STATION Verify Spin Station input and output: _______ Door Sensor _______ Wafer Sensor _______ Tower Wafer Sensor _______ Upper Rinse Solenoid. Toggle on/off. Set drips. _______ Upper Rinse Drip Solenoid. Toggle on/off. Set flowmeter to 4.5. _______ Lower Rinse Solenoid. Toggle on/off. Set drips. _______ Lower Rinse Drip Solenoid.
  • Page 67 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P UNLOAD HANDLER Verify Unload Handler input and output: _______ Fingers Open Sensor _______ Fingers Closed Sensor _______ Wrist at Output Sensor...
  • Page 68 DAY 2 – MECHANICAL ADJUSTMENT NOTE: The following mechanical adjustments should be checked. If the alignment is cor- rect, there will be no need to perform the adjustment. These alignments are not in any particular order. It is recommended that some of the mechanical alignments be done during the 24 hour purge.
  • Page 69 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P ROTATION AT OUTPUT ADJUSTMENT Verify that the lifter is in the Up to Take Wafer position. Move the Unload Handler to the Rotation at Output position, and verify that there is clear- ance between the Gripper Fingers, in the closed position, and the Lifter Blade.
  • Page 70 BRUSH STATION Check brush parallelism. Reference the page 6-25. Place a wafer between the brushes and using a bubble level and scale, cen- ter and level the wafer using the following adjustments: Roller height adjustments Roller arm position Adjust the flat finder bracket, if applicable. Adjust the Edge Clean sprays and shields (if applicable): 1) Adjust the EC jet water stream so that it strikes the groove, but not at a 90°, this will minimize the amount of water that sprays into the spin sta-...
  • Page 71 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P Select a Brush Break In process, and place a cassette of wafers into the Input Station.
  • Page 72 Listen and watch for skidding, as the carriage moves out from under the wafer. Carriage motion should be smooth, in and out. Ensure that the spindle drops down smoothly. Visually check that the handler arm and fingers are aligned to the wafer in the spin nest when the spindle is at top and ready to pass the wafer to the handler.
  • Page 73 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P DAY 3 - RELIABILITY TESTING Check the Purchase Agreement for the reliability specifications. i.e., 1000 wafers with 1 assist.
  • Page 74 SYSTEM BASELINE (DI-H2O) This procedure must be used for all new installations to determine the Near Particle Neutral- ity on Hydrophilic Prime Silicon Wafers using only DI water. The system being qualified must pass all prior reliability tests before completing the qualification. 103.
  • Page 75 Date/time: ___________________ Total Install Time ___________________ Person-Hours Quantity of OnTrak caused problems encountered: ________________ Time to rework OnTrak caused problems: ________________ Person-Hours 118. Turn the Customer Service Requests (CSRs), Facilities Form, Process Installation Data Table Form, System Offsets Form, this Installation Form, and System qualification data into your supervisor or manager.

  • Page 76: Reliability Testing Terms

    RELIABILITY TESTING TERMS Refer to SEMI E10-96 4.1. : Any unplanned interruption that occurs during an ASSIST equipment cycle where all three of the following conditions apply: The interrupted equipment cycle is resumed through external intervention (e.g., by an operator or user, either human or host computer).

  • Page 77: Detail Installation Procedure

    C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P DETAIL INSTALLATION PROCEDURE 1 Carefully check the system for obvious damage that may have Day 1 occurred during shipment and customer installation.
  • Page 78 11 Close ALL manual valves and flow meters (i.e., DI Water, Brush Station #1, and Brush Station #2.) Close ALL drip valves, especially in the Spin Station. During final system preparation at OnTrak, all drip valves are opened and all lines are purged with N before shipping. Open drip valves, such as the lower spin drip valve, can wet the ULPA filter (if installed) or damage other system components.
  • Page 79 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P Locate the new double bagged in-line disposable filters inside Filter Wetting • the DSS-200 frame. The bag contains 1 - .1 micron filter, 1 - Drain plug (30-0024-009), 1 - Vent adapter (30-0021-001) and 2 - Input and Output adapters (30-0024-182).
  • Page 80 Display the Brush Station I/O screens that control the • dispense of NH OH and open the NH OH and NH REDUNDANT valves (solenoids). Verify DI water flows through the NH OH line and filter. • Open Vent Line valve to “bleed” air while filter and lines fill. •...
  • Page 81 Begin the adjustment procedure for Brush Station #1. One set of gauge blocks (OnTrak part number 13-8800-193, front and Required Materials 13-8800-194, Back), digital multimeter, feeler gauge 0.001 inches...
  • Page 82 WARNING: Do not touch the adjustment button numerous times in rapid succession. The system could become confused. Initiate each move, one at a time, giving the system enough time to respond before touching the button again. When both ends of the brush have been set, remove the gauge blocks and record the offset values in the DATA TABLE for future reference.
  • Page 83 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P NOTE: Be sure the drive belt does not rub on the pulley hub. Tighten the cap screws.
  • Page 84 Slowly slide the Flat Finder bracket (sensor) forwards and • backwards until it just “sees” the flat (icon turns green), and then “back off” the bracket inch (1.6 mm) away from the wafer. 1/16 (The additional “back off” is required because the rollers forward pressure, exerted during normal processing, may cause the wafer to block the Flat Finder sensor.) In the final course adjustment position, the sensor is green.
  • Page 85 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P NOTE: Only a slight amount of adjustment is available using this method for finding the wafer flat.
  • Page 86 33 Set-up and run the Brush Break-In procedure using the OX-AMM Brush Break-In POR process recipe POR in the Appendix. Load the proprietary Brush Break In process recipe program • OX-AMM into the systems hard drive or display the PROCESS RECIPE screen, select NEW RECIPE screen and enter the brush break in parameters.
  • Page 87 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P Verify megasonic cleaning unit’s effectiveness. Megasonic Test Display the DIW process recipe and set the brush height to “0” •...
  • Page 88 41 Remove DI water connections from DSS-200 chemical line(s) and connect facilities chemical(s) to system. 42 Verify the quality of NH Verify (test) the quality of NH OH chemical. OH Chemical Display the AMM_TEST process recipe and set the brush •...
  • Page 89 45 Complete Warranty Activation Sign Off form and leave the form Warranty Activation with the customer for the OnTrak Process Engineer. 46 Complete and FAX the following to the OnTrak Installation Supervisor in Customer Service: DSS-200 Installation Start-up Procedure and record all •...
  • Page 90 C h a p t e r 6 I N S T A L L AT I O N S T A R T - U P 2/11/99 DSS-200 Series II CE Installation Rev. C 6-34 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 91: Appendix

    A P P E N D I X FORMS CONTENTS The following installation checklists and forms are found in the Appendix: Facility Checklist Installation Report Form Installation Deficiency Log Sheet Form Part Requirements For This Installation Form System Offsets Form Smooth Wafer Travel Checklist Brush Break-In POR (OX-AMM Process Recipe) DI Water POR (DIW Process Recipe)
  • Page 92 apx-2 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 93: Facility Confirmation Report-Series Ii Ce

    DSS-200. When you have completed installing your system using the Facilities Drawing and complied with all NOTES, call your OnTrak Customer (Field) Engineer to “bring up” (power up) your system so that final calibrations and adjustments can be performed.
  • Page 94 11. Verify (visually) that the process solution line input(s) has an in-line pall 0.2µm Ultipor N66 or equivalent filter that eliminates particle contamination to >0.2µm. Verify (visually) that the Input/Brush Station exhaust is connected and plumbed to a DI water exhaust. Verify (visually) that the Input/Brush Station drain is plumbed to a DI Water/ slurry drain and that the drain uses a customer supplied 2”...
  • Page 95 C. The Customer Engineer is to list in the following table all “out of specification” safety and hardware items by Item/Problem #, problem, corrective action and completion date. Safety Problem Completed Facility Confirmation Signature Customer Signature: ______________________________________________ Date: __/__/__ OnTrak Signature: ______________________________________________ Date: __/__/__ 2/11/99 DSS-200 Series II CE - Installation for-3 P/N 20-0200-018-004, 20-0200-017-004 (CR)
  • Page 96 for-4 DSS-200 Series II CE - Installation 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 97: Installation Report

    A p p e n d i x F O R M S INSTALLATION REPORT Customer: Start Install Date: Contact: Completion Date: Address: System Serial No.: City/Zip: Series Type: DSS 200 Series IICE Telephone: Software Version: FAX No.: Start Wafer Count: End Wafer Count: Did the system pass the Reliability Test? _____(Yes/No)____...
  • Page 98 for-6 DSS-200 Series II CE - Installation 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 99: Installation Deficiency Log Sheet

    A p p e n d i x F O R M S INSTALLATION DEFICIENCY LOG SHEET System Serial No.: ___________________________ Code Definitions SWR - software problem ELC - electrical problem PCB - printed circuit board ASM - assembly problem COS - cosmetic damage MEC - mechanical problem FAC - facility problem...

  • Page 100: Parts Requirements For This Installation

    PARTS REQUIREMENTS FOR THIS INSTALLATION System Serial No.: ___________________ Item Description of Part OnTrak Part Number Price for-8 DSS-200 Series II CE - Installation 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 101: System Offsets - Series Ii

    A p p e n d i x F O R M S SYSTEM OFFSETS - SERIES II CUSTOMER ______________ _________________ DATE ________________________ Offset Minimum Maximum Default Actual Actual Initial Final Input Station 20000 2800 _______ _______ Output Station 5000 100000 16200 _______...
  • Page 102 for-10 DSS-200 Series II CE - Installation 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 103: Smooth Wafer Travel Checklist

    A p p e n d i x F O R M S SMOOTH WAFER TRAVEL CHECKLIST The smooth travel of wafers is essential for maximum cleaning effectiveness. Low particle count depends upon the precise handling of wafers while they are in the system. Use the START and STOP buttons on the control panel to facilitate closer inspection if necessary.
  • Page 104 Smooth Wafer Travel Checklist STEP VISUAL INSPECTION AREA In Brush Station #1, measure to ensure that the wafer is centered, front to back, between the brushes. Check that the wafers are centered left to right in the brush box. To measure, use the reflection of the brush to edge of the wafer.
  • Page 105 A p p e n d i x F O R M S Smooth Wafer Travel Checklist STEP VISUAL INSPECTION AREA An incoming wafer on the spin station carriage should stop exactly centered over the spindle fingers (not too far or short). The wafer should NOT contact the wafer emergency stop fixture.
  • Page 106 Smooth Wafer Travel Checklist STEP VISUAL INSPECTION AREA Visually inspect the alignment of the spindle fingers with the edges of the wafer on the carriage. When the spin fingers close on the wafer, the fingers should lift the wafer slightly off the carriage track. When the spin fingers first touch the wafer, the wafer should be 1-2 mm lower than the center of the finger groove.
  • Page 107 A p p e n d i x F O R M S Smooth Wafer Travel Checklist STEP VISUAL INSPECTION AREA Visually check the lifter blade at “final move up.” The blade should gently press against the bottom of the wafer; this slight pressure should cause the top unload handler fingers to move up 1-2 mm from the unload handler fingers original stopping point.
  • Page 108 for-16 DSS-200 Series II CE - Installation 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 109: Process Of Record

    A p p e n d i x F O R M S PROCESS OF RECORD Diameter: 200 - 150mm Application: Post Oxide or W CMP Recipe: OX-AMM First Brush Station Program Event 1 Event 2 Event 3 Entrance Spray NH4OH-1 Exit Spray Chemical 3...
  • Page 110 DSS 200 Series IICE Process Program Diameter: 200 - 150mm Application: Post OX CMP Recipe: OX-MEG First Brush Station Program Event 1 Event 2 Event 3 Entrance Spray NH4OH-1 Exit Spray Chemical 3 Drip Time Chemical 2-1 Drip Wafer Count Time (sec) Brush Height (mm) Roller Speed...
  • Page 111 A p p e n d i x F O R M S DSS 200 Series IICE Process Program - DI Water Diameter: 200 - 150mm Application: DI Water, Particle Neutrality, Prime SI Recipe: DIW First Brush Station Program Event 1 Event 2 Event 3 Entrance Spray...
  • Page 112 for-20 DSS-200 Series II CE - Installation 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 113: Particle Neutrality Data Collection Form

    PARTICLE NEUTRALITY DATA COLLECTION FORM FOR- System Serial No.: _________ DATE: _________ Brush 1 Height _________ ____ Series: _________ FSE or AE: _________ Brush 2 Height _________ Measurement Equipment: _________ _________ _________ Process Recipe ___DIW__ Brush Station #1 Offsets: Front _________ Back ________ Brush Station #2 Offsets:...

  • Page 114: Environmental Data Collection Form

    ENVIRONMENTAL DATA COLLECTION FORM System Serial No.: _________ DATE: _________ Series: _________ FSE or AE: _________ Measurement Equipment: _________ Process Recipe ___DIW__ WATER TEST BRUSH 1 = 0 mm BRUSH 2 = 0 mm Meg = OFF Pre Count Post Count Change Adders Wafer 0.2-0.3...

  • Page 115: Chemical Data Collection Form

    CHEMICAL DATA COLLECTION FORM System Serial No.: _________ DATE: _________ Series: _________ FSE or AE: _________ Measurement Equipment: _________ Process Recipe ___DIW__ BRUSH 1 = 2.5 mm BRUSH 2 = 0 mm Meg = OFF Pre Count Post Count Change Adders Wafer 0.2-0.3 Total...

  • Page 116: Environmental Data Collection Form

    ENVIRONMENTAL DATA COLLECTION FORM System Serial No.: _________ DATE: _________ Series: _________ FSE or AE: _________ Measurement Equipment: _________ Process Recipe ___DIW__ AIR TEST Pre Count Post Count Change Adders Wafer 0.2-0.3 µ µ µ Total µ µ µ Total µ...

  • Page 117: Station-1 Brush Matrix Data Form

    STATION-1 BRUSH MATRIX DATA FORM Brush Height Setting System Serial No:_______________ ____Test Date:___________________ (circle optimum height) Process Recipe :_____________________Engineer:___________________Series 2: Wafer S1= 3.0mm / Wafer S2=3.5mm / Wafer S3=4.0mm Measurement Equipment:_______________________ Brush Offsets: FL_____ RL_____ PARTICLE BIN SPLIT PRE COUNTS PARTICLE BIN SPLIT POST COUNTS WAFER S1 .2 - .3 UM .3 - .5 UM >...

  • Page 118: Station-2 Brush Matrix Data Form

    STATION-2 BRUSH MATRIX DATA FORM Brush Height Setting System Serial No:_______________ ____Test Date:___________________ (circle optimum height) Process Recipe :_____________________Engineer:___________________Series 2: Wafer S1= 3.0mm / Wafer S2=3.5mm / Wafer S3=4.0mm Measurement Equipment:_______________________ Brush Offsets: FL_____ RL_____ PARTICLE BIN SPLIT PRE COUNTS PARTICLE BIN SPLIT POST COUNTS WAFER S1 .2 - .3 UM .3 - .5 UM >...

  • Page 119: Dss-200 Process Installation Data Table

    DSS-200 PROCESS INSTALLATION DATA TABLE Customer:__________________________Serial Number:______________________ Date:__________________ TABLE IPA 1.0 PARTICLE DENSITY Wafer Diameter LPD’s > 0.2um LPD’s > 0.3um 150/200mm NH4OH 0.015 particles/cm 0.008 particles/cm 150/200mm H2O 0.07 particles/cm 0.05 particles/cm 150/200mm Reclaim NH4OH 0.15 particles/cm 0.075 particles/cm 150/200mm Reclaim H2O 0.10 particles/cm TABLE IPA 1.0A TOTAL PARTICLES (DENSITY CONVERSION)
  • Page 120 SYSTEM BASELINE-DIW Wafer POST Delta POST Delta > .2um > .2um > .2 um > .3um > .3um > .3 um Average Delta >. 2um =____ Average Delta >. 3um =____ MEGASONIC STATION BASELINE Wafer POST Delta POST Delta > .2um >...
  • Page 121 SYSTEM BASELINE AMMONIUM HYDROXIDE Wafer POST Delta POST Delta > .2um > .2um > .2 um > .3um > .3um > .3 um Average Delta >. 2um =____ Average Delta >. 3um =____ Comments: for-29 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)
  • Page 122 A p p e n d i x F O R M S 2/11/99 DSS-200 Series II CE Installation Rev. C for-30 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 123: Installation Start Up Procedure Checklist

    A p p e n d i x F O R M S INSTALLATION START UP PROCEDURE CHECKLIST Day 1 Serial Number _____________________________ Customer _____________________________ Install started by _____________________________ Date/time _____________________________ Check the system for obvious damage that may have occurred during shipment and installation. Record information in the Installation Deficiencies Log Sheet and Part Requirements for Installation forms which are in the Appendix.
  • Page 124 Initial Comm State to ENABLED and set the GEM CONFIGURATION Device ID. The Device ID must be supplied by the customer. Complete Warranty Activation Sign Off Form and leave the form with the customer for the OnTrak Process Engineer. Complete and FAX (#...

  • Page 125: System Warranty Activation

    Additional Process Testing is Required as specified in the Purchase Agreement. This test has been completed and passes the accep- tance criteria Warranty Activation Sign Off Customer Signature: Date: OnTrak Rep. Signature: Date: Rev. 2 11/14/96 for- 33...
  • Page 126 for- 34 Rev. 2 11/14/96...

  • Page 127: Di Water Line Purge

    A P P E N D I X D I W A T E R L I N E P U R G E Sterilization and flushing of the DI water lines is required in the DSS 200 Series II systems to prevent contamination of the cleaning process.

  • Page 128: Purge Setup

    Mix the 1 part NH OH (28 wt.% in NH ) with 15 parts DI water. Ammonia Hydroxide Enough solution should be provided to accommodate a 3 liter/ minute flow @ 30 psi (2.07 bar) for 5-15 minutes (15-45 liters). The chemical delivery system used in the purge procedure must: CHEMICAL DELIVERY Have components that are compatible with the chemicals being...

  • Page 129: Purge Procedure

    A p p e n d i x P U R G E P R O C E D U R E PURGE PROCEDURE USING HYDROGEN PEROXIDE NOTE! If hydrogen peroxide is used as the chemical sterilizing solution all brushes must be removed and properly stored before performing the DI Water Purge.
  • Page 130 4 Touch the VIEW I/O button in the column of the INPUT STATION screen to activate the MAINTENANCE INPUT STATION I/O screen. 5 Touch the RINSE SOLENOID button in the INPUT STATION screen to turn ON the Rinse Solenoid. When INPUT/OUTPUTS open, the arrow icon should be green.
  • Page 131 A p p e n d i x P U R G E P R O C E D U R E 7 Touch the RINSE SOLENOID button on the INPUT STATION INPUT/ screen to turn OFF the Rinse Solenoid. When closed, the OUTPUTS arrow icon should be red.
  • Page 132 12 Touch the ENTRANCE SOLENOID button in the FIRST BRUSH screen to turn OFF the Brush Station STATION INPUT/OUTPUTS #1 entrance spray. When closed, the arrow icon should turn red. This prevents excess loss of chemical sterilizing solution prior to full purge.
  • Page 133 A p p e n d i x P U R G E P R O C E D U R E 16 Edge Clean ONLY Option - Touch the EDGE CLEAN button in screen to turn ON FIRST BRUSH STATION INPUT/OUTPUTS the Edge Cleaning DI water solenoid.
  • Page 134 20 Touch the VIEW I/O button at the bottom of the SECOND BRUSH column in the screen to display the MAINTENANCE SECOND screen. BRUSH STATION INPUT/OUTPUT 21 Touch the EXIT SOLENOID button in the SECOND BRUSH screen to turn ON the Brush Station STATION INPUT/OUTPUTS #2 exit spray.
  • Page 135 A p p e n d i x P U R G E P R O C E D U R E 24 Edge Clean ONLY Option - Touch the EDGE CLEAN button in screen to turn SECOND BRUSH STATION INPUT/OUTPUTS ON the Edge Clean DI water solenoid.
  • Page 136 28 Touch the VIEW I/O button at the bottom of the SPIN STATION column in the screen to display the MAINTENANCE SPIN screen. STATION I/O 29 Place a dummy wafer on the Spin Station carriage. 30 Touch the SPIN FINGER SOLENOID button in the SPIN screen to close the spindle fingers on the dummy STATION I/O...
  • Page 137 A p p e n d i x P U R G E P R O C E D U R E 31 With the dummy wafer held securely in the spindle fingers, touch the MOVE CARRIAGE button in the SPIN STATION I/O screen to move the carriage out.
  • Page 138 33 If the Megasonic Option is installed, activate the Megasonic arm by touching the MEGASONIC ARM SOLENOID. The arm will move away from the HOME position. The arrow icon should turn green. No DI water will be flowing from the Megasonic head at this time.
  • Page 139 A p p e n d i x P U R G E P R O C E D U R E 34 Touch UPPER RINSE SOLENOID, LOWER RINSE SOLENOID, MEGASONIC WATER SOLENOID (Option), UPPER RINSE DRIP SOLENOID, LOWER RINSE DRIP SOLENOID and MEGASONIC DRIP SOLENOID (Option) buttons on the screen to activate (open) the six...
  • Page 140 40 Touch the RINSE SOLENOID button in the INPUT STATION screen to turn ON the Rinse Solenoid, front and INPUT/OUTPUTS rear spray. When open, the arrow icon should be green 41 Touch the button (bottom right) in the EXIT INPUT STATION screen to exit the screen and display the INPUT/OUTPUTS screen.
  • Page 141 A p p e n d i x P U R G E P R O C E D U R E 43 Touch the ENTRANCE SOLENOID button in the FIRST BRUSH screen to turn ON the Brush Station STATION INPUT/OUTPUTS #1 entrance spray.
  • Page 142 48 Touch the EXIT SOLENOID button in the SECOND BRUSH screen to turn ON the Brush Station #2 exit spray. STATION I/O When open, the arrow icon should turn green. 49 If the Edge Cleaning Option is installed, touch the EDGE EDGE CLEAN OPTION CLEAN button to turn ON the Brush Station #2 Edge Clean DI FOR BRUSH STATION 2...
  • Page 143 A p p e n d i x P U R G E P R O C E D U R E WARNING! There can be a release of pressurized chemical sterilizing solution at the connection. Be sure to wear protective clothing, including gloves and a face shield. 56 Reconnect the DI water supply and turn on the DI water.
  • Page 144 SPIN STATION TOP RINSE (FM-26) SPIN STATION BOTTOM RINSE (FM-27) SPIN STATION MEGASONICS - Option (FM-30) 65 From the screen, turn OFF: SPIN STATION INPUT/OUTPUTS UPPER RINSE SOLENOID LOWER RINSE SOLENOID MEGASONIC DRIP SOLENOID - Option The arrow icon lights should turn red. 66 Readjust the following flow meters to their original settings.
  • Page 145 A p p e n d i x P U R G E P R O C E D U R E VALVE FLOW SETTINGS and OPEN SOLENOIDS CHECKLIST STEP VALVE NAME SOLENOID NAME VALVE PRE PURGE PURGE NUMBER NUMBER SETTING SETTING System...
  • Page 146 STEP VALVE NAME SOLENOID NAME VALVE PRE PURGE PURGE NUMBER NUMBER SETTING SETTING (BOTTOM RINSE DRIP LOWER RINSE DRIP Activate Activate Activate VALVE) SOLENOID ONLY. No ONLY. No ONLY. No Adjustment Adjustment Adjustment OPTION 35 SPIN STATION MEGASONIC RINSE FM-30 &...

  • Page 147: Nh4Oh Usage Guidelines

    A P P E N D I X N H 4 O H U S A G E G U I D E L I N E S Use the following general guidelines when setting through-the- brush (TTB) NH OH flow levels. The primary goal is to only use as much NH OH as is required to assure consistent, reproducible results.
  • Page 148 OnTrak Systems, Inc. nh4oh-2 DSS 200 Series IICE 2/11/99...
  • Page 149 2.1 Scope: For both OnTrak and customer Process and Equipment Engineers responsible for maintaining and operating the DSS-200 Series IICE system with optimal process performance.
  • Page 150 OH safety instructions detailed in the OnTrak DSS-200 Series IICE operators manual provided with the system. SETUP Verify that all facilities meet the published OnTrak facilities requirements as per the provided facilities drawings. 6.1 Verify DIW pressure and flow rates are properly set and functioning for the upper and lower brushes of both brush stations, drip manifolds, upper and lower rinses, and Spin Station rinses.
  • Page 151 PVA material. Use a brush mounting fixture to verify the uniformity of the brush on the core. Nodules should be in straight lines with no evidence of twisting of the brush material. Use OnTrak Gauge Blocks to assure brush parallelism.
  • Page 152 7.2.1 Starting Material 7.2.1.1 The wafer surface should be hydrophilic. A hydrophobic wafer causes water to bead on its surface. The thickness and thickness uniformity of oxide layers can influence particle detection sensitivities of the measure- ment system. Also, organic contamination on the wafer surface can effect surface condition.
  • Page 153 A p p e n d i x P R O C E S S T R O U B L E S H O O T I N G 7.2.4.4.1 DI water rinse system. 7.2.4.4.2 Megasonic Wand. 7.2.4.4.3 Heat Lamp. 7.3 Final Step: Verify source of problem and implement fix.
  • Page 154 APPENDIX 1 General Guidelines for NH OH Use Only use a sufficient amount of NH OH to assure consistent, reproducible results. 2. Minimize NH OH usage, consistent with #1. above, to reduce NH OH vapor, chemi- cal cost, potential negative impact on scrubber and disposal issues 3.
  • Page 155 The wafers are then processed polished face (or film face down) using the OnTrak process of record (POR). After processing, post particle counts are measured and the difference (pre - post) calcu- lated and recorded.
  • Page 156 (POR), then the source of the problem may be related to the CMP processing of the wafers before they are cleaned on the OnTrak scrubber. Use the following four (4) step approach to determine the source of the problem.
  • Page 157 Brush Offset And Parallelism Adjustment procedure (20-0001-030 Rev 3) and OnTrak gauge blocks (p/n 13- 2/11/99 DSS-200 Series II CE Installation Rev. C...
  • Page 158 8800-193 & 13-8800-194). 2.0.5 Check the current Process Recipe to make sure that the brush height in each brush station is within the normal 3 to 7 mm operating range. 3.0 Wafer slippage can occur after processing 50 to 100 wafers using NH OH.

  • Page 159: Brush Height Optimization

    A P P E N D I X BRUSH HEIGHT OPTIMIZATION This procedure must be used for all new installations to determine the optimum brush settings for the first and second brush stations. The system being qualified must pass all prior tests before completing the Brush Matrix Test.
  • Page 160 5 Change the first brush station brush height to 3.0 mm for the starting brush height location for the first brush station matrix test. Change the second brush station, the brush height to 0. 6 Place the first cassette of pre measured wafers in the Sender and a clean cassette in the Unload Station.

  • Page 161: System Baseline Di Water

    A p p e n d i x B R U S H H E I G H T O P T I M I Z AT I O N 14 Calculate the difference between the PRE and POST averages of the recorded particles >...

  • Page 162: Megasonic Station Baseline

    5 Calculate the DELTA Average (x) for Wafers 5F-9F, 13F-17F and 21F-25F recorded in the Delta > .2µm and > .3µm columns. Record the Results in the AVERAGE DELTA > .2µm and > .3µm Locations at the bottom of the System Baseline-DIW table located on the page -27.

  • Page 163: System Baseline Ammonium Hydroxide

    A p p e n d i x B R U S H H E I G H T O P T I M I Z AT I O N SYSTEM BASELINE AMMONIUM HYDROXIDE This test is required only if NH OH is supplied to the DSS-200 System.
  • Page 164 opt-6 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 165: Acceptance Procedure

    ACCEPTANCE PROCEDURE Before acceptance testing is begun on the DSS-200, all facilities requirements called out on the OnTrak facilities drawing must be met. To assure process performance at the quoted levels, the system must be in a class 1/10 environment, and only use 18 Mega-Ohm DI water with <...
  • Page 166 OnTrak Systems, Inc. A cassette of scratch free freshly deposited > 1.5µm blanket ILD test Test Wafers wafers with < 50 light point defects (LPDs) > 0.3µm and < 400 LPDs > 0.2µm. The wafers must have a low enough haze level that surface scattering does not interfere with particle counting.

  • Page 167: Slurry Dip Test

    If no interferences exist on the wafer, the edge exclusion may be set at 2mm due to OnTrak’s advanced edge handling equipment. The average number of added particles per wafer per pass should not exceed the values detailed in Table 3: Table 3.
  • Page 168 OnTrak Systems, Inc. NOTE: When the DSS-200 meets or exceeds this performance level for three (3) con- secutive days, this portion of the process specification will be considered met for machine sign-off purposes. A slurry is prepared by diluting SC-1 15 to 1 with water to yield a solution of approximately 2% suspended solids.

  • Page 169: Technical Bulletins

    T E C H N I C A L B U L L E T I N S INTRODUCTION Place all OnTrak Customer Service Technical Service Bulletins (TSB) in this section. Bulletins should be chronological, recorded in the following log, and in the site/system log when appropriate.
  • Page 170 tsb-2 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

  • Page 171: Facilities Drawings

    A P P E N D I X F A C I L I T I E S D R A W I N G S Use the following Facilities Drawings to plan, to prepare the physical facilities and to assist in the actual installation of your system. The following Facilities Drawings closely represent typical facility hook- ups.
  • Page 172 doc-2 DSS-200 Series II CE Installation Rev. C 2/11/99 P/N 20-0200-018-004, 20-0200-017-004 (CR)

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