Cleanness; Emi - HP 5130-24G-4SFP+ EI Installation Manual

5130 ei switch series
Table of Contents

Advertisement

Lasting high relative humidity can cause poor insulation, electricity creepage, mechanical property
change of materials, and metal corrosion.
Lasting low relative humidity can cause washer contraction and ESD and bring problems including
loose captive screws and circuit failure.
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the switch.
For the temperature and humidity requirements of different switch models, see
views and technical

Cleanness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of metal
components and contact points, especially when indoor relative humidity is low. In the worst case,
electrostatic adsorption can cause communication failure.
Table 1 Dust concentration limit in the equipment room
Substance
Dust
NOTE:
Dust diameter ≥ 5 μm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 2 Harmful gas limits in the equipment room
Gas
SO
2
H
S
2
NH
3
Cl
2

EMI

Electromagnetic interference (EMI) might be coupled from the source to the switch through the following
coupling mechanisms:
Capacitive coupling
Inductive coupling
Radiative coupling
Common impedance coupling
Conductive coupling
To prevent EMI, take the following actions:
specifications."
Concentration limit (particles/m³)
≤ 3 x 10
4
(no visible dust on the tabletop over three days)
Table
2.
Maximum concentration (mg/m
0.2
0.006
0.05
0.01
5
"Appendix A Chassis
)
3

Hide quick links:

Advertisement

Table of Contents
loading

This manual is also suitable for:

5130-24g-4sfp+ ei taa5130-24g-poe+-4sfp+ ei5130-24g-poe+-4sfp+ ei taa5130-48g-4sfp+ ei5130-48g-4sfp+ ei taa5130-48g-poe+-4sfp+ ei ... Show all

Table of Contents