LB-Link BL-M7663BU2 Manual page 14

6.2 Reflow Soldering Standard Conditions
Please use the reflow within 2 times.
Set up the highest temperature within 250℃.
7. Key Components Of Module
No. Parts Specification
1 Chipset MT7663BUN
2 PCB BL-M7663BU2 V1.0
3 Crystal 40MHz-12pF-10ppm-3225
4 Diplexer DP1608-A2455DTB2
RFDIP160806ELM6T63
13http://www.b-link.net.cn
Manufacturer
MediaTek Inc.
Shenzhen Tie Fa Technology CO. LTD
Guangdong KINGSHINE ELECTRONICS CO.,
LTD
Quzhou Sunlord Electronics CO., LTD
Lucki Electronics Co., Ltd
Shenzhen Kaiyuexiang Electronics Co., Ltd
Chengde Oscillator Electronic Technology
Co., Ltd.
Advanced Ceramic X Corp.
Walsin Technology CORP.
Note