HP Pavilion dv7 Disassembly Instructions page 2

Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Philips Screw drivers (For disassembly 1 pc screw on Service door)
Description #2 Philips Screw drivers (For disassembly 1 pc screw on ODD drivers)
Description #3 Philips Screw drivers (For disassembly 2 pcs screws on 1
Description #4 Philips Screw drivers (For disassembly 2 pcs screws on 2
Description #5 Philips Screw drivers (For disassembly 20 pcs screws on Low case)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Push Battery Latch and remove Battery module.
2. Remove 1 pc screw on Service door.
3. Remove 1 pc screw on ODD module.
4. Remove 2 pcs screws on 1
5. Remove 2 pcs screws on 2
6. Remove 20 pcs screws on Low case.
7. Remove KB module.
8. Remove 1 pc screw on U case
9. Remove U case.
10. Remove 4 pcs screws on Hinge.
11. Remove 4 pcs screws on MB.
12. Remove 1 pc screw on Card reader Board.
13. Remove 1 pc screw on USB Board.
14. Remove 2 pcs screws on Sub Woofer.
15. Remove 2 pcs screws on ODD connector.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
N/A
N/A
st
HDD drivers.
nd
HDD drivers.
PSG instructions for this template are available at
st
HDD drivers)
nd
HDD drivers)
EL-MF877-01
0
0
Tool Size (if
applicable)
1#
2.55~3.00kgf.cm
1#
2.55~3.00kgf.cm
1#
2.55~3.00kgf.cm
1#
2.55~3.00kgf.cm
1#
2.55~3.00kgf.cm
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