D-Link xStack Storage DSN-1100 Hardware Reference Manual page 33

Requirement
PC2700/DDR333 speed
ECC
X8 RAMs
Registered
Buffered
Organization
DIMM 0 (J15)
System
Memory
Module
256MB
256MB
512MB
512MB
To upgrade or replace memory, use t he f ollowing procedure.
1. Power down t he DSN-1100 st orage syst em and remove t he power cord f rom t he back
panel.
2. At t ach an ESD-prevent ive wrist st rap.
3. Open t he enclosure t o access t he DSN-1100 st orage syst em Cont roller (see sect ion A. 1).
4. Remove all f ive drive t rays f rom t he syst em and look down at t he cont roller board as
shown in f igure A-10. Be sure t o orient t he rear of t he syst em t o your lef t as shown.
5. Locat e t he DIMM socket where you will be removing or inst alling t he DIMM (see Figure A-
10, A-11 and A-12).
6. To remove a DIMM, caref ully push t he socket lat ches f ound on eit her side of t he DIMM
socket , t hen pull t he DIMM out of t he socket (see Figure A-13). The lat ches hold t he DIMM
t ight ly, so be caref ul not t o break t he socket .
DSN-1100 Hardware Reference Guide
Table A-1. xSt ack St orage Array DIMM Specif icat ions
SDRAMs must be JEDEC compliant and DDR333 capable, with a CAS latency of 2.5.
PC2100/DDR400 speed DIMMs can be used if they support a 2.5 CAS latency when
operating at DDR333 speed.
DIMMs must be organized as x72 bits wide, allowing support for ECC.
DIMMs must use 8-bit wide DRAMs that can support data mask (DM) signals. DIMMs that
use 4-bit-wide DRAMs do not provide DM signals and cannot be used.
DIMMs must be registered as per the JEDEC specification for registered DIMMs.
DIMMs must be buffered as per the JEDEC specification for buffered DIMMs.
Conforming DIMM organizations are shown in Table A-2..
Table A-2. DIMM Organization
Total DIMM 1 (J14)
System Buffer / Cache
Memory Memory
Module
256MB 256MB
256MB 512MB
512MB 512MB
512MB 1GB
Description
Total Total
Memory
Buffer / Cache
Memory
256MB 512MB
512MB 768MB
512MB 1GB
1GB 1.5GB
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