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Quectel EG91 Series Hardware Design

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EG91 Series
Hardware Design
LTE Standard Module Series
Version: 1.9
Date: 2020-09-03
Status: Preliminary
www.quectel.com

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Summary of Contents for Quectel EG91 Series

  • Page 1 EG91 Series Hardware Design LTE Standard Module Series Version: 1.9 Date: 2020-09-03 Status: Preliminary www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    LTE Standard Module Series EG91 Series Hardware Design About the Document Revision History Version Date Author Description Felix YIN/ 2017-03-22 Yeoman CHEN/ Initial Jackie WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2.
  • Page 4 LTE Standard Module Series EG91 Series Hardware Design Updated pin definition of RF antenna in Table 21. Updated module operating frequencies in Table 22. 10. Added description GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25.
  • Page 5 LTE Standard Module Series EG91 Series Hardware Design and Figure 29). 1. Added ThreadX variant EG91-NAX and updated related contents (Table 1 and 4, Chapter 2.2, 2.3, 3.2 and 5). 2. Added related notes of SPI interface not supported on ThreadX modules (Chapter 3.1, 3.3 and 3.13).

  • Page 6: Table Of Contents

    LTE Standard Module Series EG91 Series Hardware Design Contents About the Document ..........................2 Contents ..............................5 Table Index ............................... 7 Figure Index .............................. 9 Introduction ............................. 11 1.1. Safety Information ......................... 14 Product Concept ..........................15 2.1. General Description ......................15 2.2.
  • Page 7 LTE Standard Module Series EG91 Series Hardware Design 3.15. STATUS ..........................53 3.16. ADC Interface ........................53 3.17. Behaviors of RI ........................54 3.18. USB_BOOT Interface......................55 GNSS Receiver ..........................57 4.1. General Description ......................57 4.2. GNSS Performance ......................57 4.3.
  • Page 8 LTE Standard Module Series EG91 Series Hardware Design Table Index Table 1: Frequency Bands of EG91 Series Module ..................15 Table 2: Key Features of EG91 series Module ....................16 Table 3: IO Parameters Definition ........................23 Table 4: Pin Description ............................. 23 Table 5: Overview of Operating Modes ......................
  • Page 9 LTE Standard Module Series EG91 Series Hardware Design Table 43: EG91-NA Conducted RF Receiving Sensitivity ................. 83 Table 44: EG91-NS Conducted RF Receiving Sensitivity ................. 83 Table 45: EG91-VX Conducted RF Receiving Sensitivity ................. 84 Table 46: EG91-EX Conducted RF Receiving Sensitivity ................. 84 Table 47: EG91-NAX Conducted RF Receiving Sensitivity ................
  • Page 10 LTE Standard Module Series EG91 Series Hardware Design Figure Index Figure 1: Functional Diagram ........................20 Figure 2: Pin Assignment (Top View) ....................... 22 Figure 3: Sleep Mode Application via UART .................... 31 Figure 4: Sleep Mode Application with USB Remote Wakeup ..............32 Figure 5: Sleep Mode Application with RI ....................
  • Page 11 LTE Standard Module Series EG91 Series Hardware Design Figure 42: Module Bottom Dimensions (Top View) .................. 91 Figure 43: Recommended Footprint (Top View) ..................93 Figure 44: Top View of the Module ......................94 Figure 45: Bottom View of the Module ....................95 Figure 46: Recommended Reflow Soldering Thermal Profile ..............

  • Page 12: Introduction

    This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG91 series module. Associated with application note and user guide, customers can use EG91 series module to design and set up mobile applications easily.
  • Page 13 LTE Standard Module Series EG91 Series Hardware Design ❒ WCDMA II :≤8.000dBi ❒ WCDMA IV :≤5.000dBi ❒ WCDMA V :≤9.416dBi ❒ LTE Band 2 :≤8.000dBi ❒ LTE Band 4:≤5.000dBi ❒ LTE Band 5 :≤9.416dBi ❒ LTE Band 12 :≤8.734dBi ❒ LTE Band 13:≤9.173dBi ❒...
  • Page 14 LTE Standard Module Series EG91 Series Hardware Design commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC ID: XMR202008EG91NAXD”...

  • Page 15: Safety Information

    The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG91 series module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.

  • Page 16: Product Concept

    Product Concept 2.1. General Description EG91 series module is an embedded 4G wireless communication module with receive diversity. It supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality to meet customers’...

  • Page 17: Key Features

    GNSS function is optional. EG91-AUX does not support LTE and WCDMA Rx-diversity. With a compact profile of 29.0mm × 25.0mm × 2.3mm, EG91 series module can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.
  • Page 18 LTE Standard Module Series EG91 Series Hardware Design Support up to non-CA Cat 1 FDD Support 1.4/3/5/10/15/20MHz RF bandwidth LTE Features Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA...
  • Page 19 Support LTE/WCDMA Rx-diversity Gen8C Lite of Qualcomm GNSS Features Protocol: NMEA 0183 Data update rate: 1Hz by default Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands Network Indication NETLIGHT pin for network activity status indication...

  • Page 20: Functional Diagram

    3GPP specifications again. “*” means under development. 2.3. Functional Diagram The following figure shows a block diagram of EG91 series module and illustrates the major functional parts.  Power management ...

  • Page 21: Evaluation Board

    GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX. 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 series module. The evaluation tool kit includes the evaluation board (UMTS&LTE EVB), USB data cable, earphone, antenna and other peripherals.

  • Page 22: Application Interfaces

    Application Interfaces 3.1. General Description EG91 series module is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters: ...

  • Page 23: Pin Assignment

    LTE Standard Module Series EG91 Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG91 series module. Figure 2: Pin Assignment (Top View) EG91_Series_Hardware_Design 22 / 106...

  • Page 24: Pin Description

    EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX and EG91-E. For more details, please refer to Table 4. 3.3. Pin Description The following tables show the pin definition and description of EG91 series module. Table 3: IO Parameters Definition Type Description Analog Input Analog Output...
  • Page 25 LTE Standard Module Series EG91 Series Hardware Design It must be provided with Vmax=4.3V Power supply for sufficient current up to VBAT_RF 52, 53 Vmin=3.3V module’s RF part 1.8A in a burst Vnorm=3.8V transmission. Power supply for Provide 1.8V for Vnorm=1.8V...
  • Page 26 LTE Standard Module Series EG91 Series Hardware Design Vnorm=5.0V open. USB differential Require differential USB_DP USB 2.0 compliant data bus (+) impedance of 90Ω. USB differential Require differential USB_DM USB 2.0 compliant data bus (-) impedance of 90Ω. (U)SIM Interfaces Pin Name Pin No.
  • Page 27 LTE Standard Module Series EG91 Series Hardware Design For 1.8V (U)SIM: max=0.45V min=1.35V Reset signal of USIM1_RST (U)SIM card For 3.0V (U)SIM: max=0.45V min=2.55V min=-0.3V 1.8V power domain. USIM1_ (U)SIM card max=0.6V If unused, keep it PRESENCE insertion detection min=1.2V open.
  • Page 28 LTE Standard Module Series EG91 Series Hardware Design min=-0.3V 1.8V power domain. USIM2_ (U)SIM card max=0.6V If unused, keep it PRESENCE insertion detection min=1.2V open. max=2.0V Main UART Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain.
  • Page 29 LTE Standard Module Series EG91 Series Hardware Design min=1.2V open. max=2.0V PCM Interface Pin Name Pin No. Description DC Characteristics Comment min=-0.3V 1.8V power domain. max=0.6V PCM_DIN PCM data input If unused, keep it min=1.2V open. max=2.0V 1.8V power domain.
  • Page 30 LTE Standard Module Series EG91 Series Hardware Design General-purpose Voltage range: If unused, keep it ADC0 analog to digital 0.3V to VBAT_BB open. converter SPI Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. Clock signal of SPI max=0.45V...

  • Page 31: Operating Modes

    LTE Standard Module Series EG91 Series Hardware Design processor sleep max=0.6V If unused, keep it state detection min=1.2V open. max=2.0V min=-0.3V 1.8V power domain. Force the module to max=0.6V It is recommended to USB_BOOT enter emergency min=1.2V reserve the test download mode max=2.0V...

  • Page 32: Power Saving

    Driving the host DTR to low level will wake up the module.  When EG91 series module has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behavior. EG91_Series_Hardware_Design...

  • Page 33: Usb Application With Usb Remote Wakeup Function

    Sending data to EG91 series module through USB will wake up the module.  When EG91 series module has a URC to report, the module will send remote wakeup signals via USB bus so as to wake up the host.

  • Page 34: Usb Application Without Usb Suspend Function

    EG91 Series Hardware Design Figure 5: Sleep Mode Application with RI  Sending data to EG91 series module through USB will wake up the module.  When module has a URC to report, RI signal will wake up the host.

  • Page 35: Airplane Mode

    The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG91 series module provides four VBAT pins for connection with an external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for module’s RF part.

  • Page 36: Decrease Voltage Drop

    LTE Standard Module Series EG91 Series Hardware Design Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit Power supply for module’s VBAT_RF 52, 53 RF part. Power supply for module’s VBAT_BB 32, 33 baseband part.

  • Page 37: Reference Design For Power Supply

    LTE Standard Module Series EG91 Series Hardware Design VBAT VBAT_RF VBAT_BB 100nF 10pF 33pF 100uF 100nF 33pF 10pF 100uF WS4.5D3HV Module Figure 8: Star Structure of Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source.

  • Page 38: Power-On/Off Scenarios

    Qualcomm chipset. When EG91 series module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY.
  • Page 39 LTE Standard Module Series EG91 Series Hardware Design Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. NOTE 1 VBAT ≥500ms =0.8V PWRKEY ≤0.5V About 100ms VDD_EXT ≥100ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit.

  • Page 40: Turn Off Module

    LTE Standard Module Series EG91 Series Hardware Design NOTES Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. PWRKEY can be pulled down directly to GND with a recommended 10KΩ resistor if module needs to be powered on automatically and shutdown is not needed.

  • Page 41: Reset The Module

    LTE Standard Module Series EG91 Series Hardware Design NOTES In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off.

  • Page 42: U)Sim Interfaces

    Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG91 series module provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The (U)SIM1 and (U)SIM2 cards can be switched by AT+QDSIM command. For more details, please refer to document [2].
  • Page 43 (U)SIM2 card insertion detection PRESENCE EG91 series module supports (U)SIM card hot-plug via USIM_PRESENCE (USIM1_PRESENCE/USIM2 _PRESENCE) pin. The function supports low level and high level detection. By default, it is disabled by default, and can be configured via AT+QSIMDET command. Please refer to document [2] about the command.
  • Page 44 LTE Standard Module Series EG91 Series Hardware Design Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.

  • Page 45: Usb Interface

    (U)SIM card connector. 3.10. USB Interface EG91 series module contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface acts as slave only, and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB.

  • Page 46: Uart Interfaces

    LTE Standard Module Series EG91 Series Hardware Design Figure 19: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default.
  • Page 47 LTE Standard Module Series EG91 Series Hardware Design  The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. It supports RTS and CTS hardware flow control, and is used for AT command communication only.
  • Page 48 LTE Standard Module Series EG91 Series Hardware Design 0.45 1.35 The module provides 1.8V UART interfaces. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended.

  • Page 49: Pcm And I2C Interfaces

    Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG91 series module provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: ...
  • Page 50 LTE Standard Module Series EG91 Series Hardware Design Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. EG91_Series_Hardware_Design 49 / 106...
  • Page 51 Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for PCM_CLK. EG91 series module works as a master device pertaining to I2C interface. EG91_Series_Hardware_Design 50 / 106...

  • Page 52: Spi Interface

    EG91 Series Hardware Design 3.13. SPI Interface SPI interface of EG91 series module acts as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip selection. Its operation voltage is 1.8V with clock rates up to 50MHz.

  • Page 53: Network Status Indication

    LTE Standard Module Series EG91 Series Hardware Design 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status.

  • Page 54: Status

    LTE Standard Module Series EG91 Series Hardware Design 3.15. STATUS The STATUS pin is set as the module’s operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS.

  • Page 55: Behaviors Of Ri

    LTE Standard Module Series EG91 Series Hardware Design Table 19: Pin Definition of ADC Interface Pin Name Pin No. Description Comment General-purpose analog to digital If unused, keep this pin ADC0 converter open. The following table describes the characteristics of ADC interface.

  • Page 56: Usb_Boot Interface

    RI outputs 120ms low pulse when a new URC returns 3.18. USB_BOOT Interface EG91 series module provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface.
  • Page 57 LTE Standard Module Series EG91 Series Hardware Design NOTE 1 VBAT ≥500ms V H =0.8V PWRKEY V IL ≤0.5V About 100ms USB_BOOT can be pul led up to 1.8V before VDD_EXT VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on.

  • Page 58: Gnss Receiver

    USB interface by default. By default, EG91 series module GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3].

  • Page 59: Layout Guidelines

    LTE Standard Module Series EG91 Series Hardware Design Autonomous Hot start @open sky XTRA enabled Accuracy Autonomous CEP-50 <2.5 (GNSS) @open sky NOTES Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously).

  • Page 60: Antenna Interfaces

    EG91 Series Hardware Design Antenna Interfaces EG91 series module antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX.

  • Page 61: Reference Design Of Rf Antenna Interface

    LTE Standard Module Series EG91 Series Hardware Design PCS1900 1850~1910 1930~1990 WCDMA B1 1920~1980 2110~2170 WCDMA B2 1850~1910 1930~1990 WCDMA B4 1710~1755 2110~2155 WCDMA B5 824~849 869~894 WCDMA B8 880~915 925~960 LTE-FDD B1 1920~1980 2110~2170 LTE FDD B2 1850~1910 1930~1990...

  • Page 62: Reference Design Of Rf Layout

    LTE Standard Module Series EG91 Series Hardware Design Figure 30: Reference Circuit of RF Antenna Interface NOTES Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. ANT_DIV function is enabled by default. AT+QCFG="divctl",0 command can be used to disable receive diversity.
  • Page 63 LTE Standard Module Series EG91 Series Hardware Design Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

  • Page 64: Gnss Antenna Interface

    LTE Standard Module Series EG91 Series Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:  Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.

  • Page 65: Antenna Installation

    LTE Standard Module Series EG91 Series Hardware Design QZSS 1575.42 A reference design of GNSS antenna is shown as below. Figure 35: Reference Circuit of GNSS Antenna NOTES An external LDO can be selected to supply power according to the active antenna requirement.

  • Page 66: Recommended Rf Connector For Antenna Installation

    LTE Standard Module Series EG91 Series Hardware Design VSWR: ≤ 2 Efficiency : > 30% Max input power: 50W Input impedance: 50Ω Cable insertion loss: < 1dB (GSM850,EGSM900, WCDMA B5/B8, GSM/WCDMA/LTE LTE-FDD B5/B8/B12/B13/B20/B26/B28) Cable insertion loss: < 1.5dB (DCS1800, PCS1900,WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B25/B66) Cable insertion loss: <...
  • Page 67 LTE Standard Module Series EG91 Series Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.

  • Page 68: Electrical, Reliability And Radio Characteristics

    LTE Standard Module Series EG91 Series Hardware Design Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter Min.

  • Page 69: Operation And Storage Temperatures

    LTE Standard Module Series EG91 Series Hardware Design Voltage drop during Maximum power control burst transmission level on EGSM900 Peak supply current Maximum power control (during transmission VBAT level on EGSM900 slot) USB connection USB_VBUS 5.25 detection 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table.

  • Page 70: Current Consumption

    LTE Standard Module Series EG91 Series Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG91-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected)
  • Page 71 LTE Standard Module Series EG91 Series Hardware Design EGSM900 1DL/4UL @29.26dBm DCS1800 4DL/1UL @29.2dBm DCS1800 3DL/2UL @29.13dBm DCS1800 2DL/3UL @29.01dBm DCS1800 1DL/4UL @28.86dBm EGSM900 4DL/1UL PCL=8 @27.1dBm EGSM900 3DL/2UL PCL=8 @27.16dBm EGSM900 2DL/3UL PCL=8 @26.91dBm EGSM900 1DL/4UL PCL=8 @26.12dBm EDGE data transfer DCS1800 4DL/1UL PCL=2 @25.54dBm...
  • Page 72 LTE Standard Module Series EG91 Series Hardware Design WCDMA B1 CH10700 @23.06dBm WCDMA voice call WCDMA B8 CH3012 @23.45dBm Table 33: EG91-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected)
  • Page 73 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B5 CH2525 @23.39dBm LTE-FDD B12 CH5060 @23.16dBm LTE-FDD B13 CH5230 @23.36dBm WCDMA B2 CH9938 @23.34dBm WCDMA WCDMA B4 CH1537 @23.47dBm voice call WCDMA B5 CH4357 @ 23.37dBm Table 34: EG91-NS Current Consumption...
  • Page 74 LTE Standard Module Series EG91 Series Hardware Design WCDMA B5 HSDPA CH4407 @23.05dBm WCDMA B5 HSUPA CH4407 @ 22.91dBm LTE-FDD B2 CH1100 @23.26dBm LTE-FDD B4 CH2175 @23.52dBm LTE-FDD B5 CH2525 @23.51dBm LTE data LTE-FDD B12 CH5060 @23.39dBm transfer LTE-FDD B13 CH5230 @23.3dBm LTE-FDD B25 CH8590@ 23.64dBm...
  • Page 75 LTE Standard Module Series EG91 Series Hardware Design Table 36: EG91-EX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspend) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected)
  • Page 76 LTE Standard Module Series EG91 Series Hardware Design DCS1800 2DL/3UL @29.21dBm 355.4 DCS1800 1DL/4UL @29.07dBm 455.7 EGSM900 4DL/1UL PCL=8 @27.29dBm 169.5 EGSM900 3DL/2UL PCL=8 @27.01dBm 305.06 EGSM900 2DL/3UL PCL=8 @26.86dBm EGSM900 1DL/4UL PCL=8 @25.95dBm EDGE data transfer DCS1800 4DL/1UL PCL=2 @26.11dBm DCS1800 3DL/2UL PCL=2 @25.8dBm...
  • Page 77 LTE Standard Module Series EG91 Series Hardware Design Table 37: EG91-NAX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspend) Sleep state WCDMA PF=512 (USB disconnected)
  • Page 78 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B25 @22.96dBm LTE-FDD B26 @23.11dBm WCDMA B2 @23.08dBm WCDMA WCDMA B4 @23.21dBm voice call WCDMA B5 @23.29dBm Table 38: EG91-NAXD Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down μA...
  • Page 79 LTE Standard Module Series EG91 Series Hardware Design WCDMA B5 HSUPA @22.31dBm LTE-FDD B2 @23.08dBm LTE-FDD B4 @23.31dBm LTE-FDD B5 @23.23dBm LTE data LTE-FDD B12 @23.03dBm transfer LTE-FDD B13 @23.13dBm LTE-FDD B25 @22.96dBm LTE-FDD B26 @23.11dBm Table 39: EG91-AUX Current Consumption...
  • Page 80 LTE Standard Module Series EG91 Series Hardware Design WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) GSM850 4DL/1UL @ 32.48 dBm 217.9 GSM850 3DL/2UL @ 31.89dBm 372.3 GSM850 2DL/3UL @ 29.45 dBm 432.9...
  • Page 81 LTE Standard Module Series EG91 Series Hardware Design EGSM900 2DL/3UL PCL = 8 @ 23.62 dBm 411.4 EGSM900 1DL/4UL PCL = 8 @ 22.27 dBm 520.8 DCS1800 4DL/1UL PCL = 2 @ 26.12 dBm 139.4 DCS1800 3DL/2UL PCL = 2 @ 25.02 dBm 250.7...

  • Page 82: Rf Output Power

    (AT+CFUN=0) VBAT (GNSS) Lost state @Passive Antenna Tracking Open Sky @Passive Antenna (AT+CFUN=0) 6.5. RF Output Power The following table shows the RF output power of EG91 series module. Table 41: RF Output Power Frequency Max. Min. GSM850 33dBm±2dB 5dBm±5dB...

  • Page 83: Rf Receiving Sensitivity

    In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 series module. Table 42: EG91-E Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.)
  • Page 84 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B3 (10MHz) -98.3dBm -98.5dBm -101.5dBm -93.3dBm LTE-FDD B7 (10MHz) -96.3dBm -98.4dBm -101.3dBm -94.3dBm LTE-FDD B8 (10MHz) -97.1dBm -99.1dBm -101.2dBm -93.3dBm LTE-FDD B20 (10MHz) -97dBm -99dBm -101.3dBm -93.3dBm LTE-FDD B28A (10MHz) -98.3dBm -99dBm -101.4dBm...
  • Page 85 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B4 (10MHz) -97.8dBm -99.5dBm -102.2dBm -96.3dBm LTE-FDD B5 (10MHz) -99.4dBm -100dBm -102.7dBm -94.3dBm LTE-FDD B12 (10MHz) -99.5dBm -100dBm -102.5dBm -93.3dBm LTE-FDD B13 (10MHz) -99.2dBm -100dBm -102.5dBm -93.3dBm LTE-FDD B25 (10MHz) -97.6dBm -99dBm -102.2dBm...
  • Page 86 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B28 (10MHz) -98.2dBm -99.5dBm -102dBm -94.8dBm Table 47: EG91-NAX Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency 3GPP (SIMO) Primary Diversity SIMO WCDMA B2 -110dBm -110dBm -112.5dBm -104.7dBm WCDMA B4 -110dBm -110dBm -112.5dBm...
  • Page 87 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B12 (10MHz) -99.5dBm -100dBm -102.5dBm -93.3dBm LTE-FDD B13 (10MHz) -99.2dBm -100dBm -102.5dBm -93.3dBm LTE-FDD B25 (10MHz) -97.6dBm -99dBm -102.2dBm -92.8dBm LTE-FDD B26 (10MHz) -99.1dBm -99.9dBm -102.7dBm -93.8dBm Table 49: EG91-AUX Conducted RF Receiving Sensitivity...

  • Page 88: Electrostatic Discharge

    LTE Standard Module Series EG91 Series Hardware Design 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module.
  • Page 89 LTE Standard Module Series EG91 Series Hardware Design Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTE The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides...
  • Page 90 LTE Standard Module Series EG91 Series Hardware Design 105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. EG91_Series_Hardware_Design 89 / 106...

  • Page 91: Mechanical Dimensions

    LTE Standard Module Series EG91 Series Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 25±0.15...
  • Page 92 LTE Standard Module Series EG91 Series Hardware Design 25±0.15 7.45 7.15 2.75 1.10 1.95 1.10 0 . 5 0 0 . 3 3 2 . 9 3 1 . 5 8 4 . 8 5 1 . 4 4 1.00 5.10...
  • Page 93 LTE Standard Module Series EG91 Series Hardware Design 25±0.15 7.45 7.15 2.75 1.10 1.95 1.10 0 . 5 0 0 . 3 3 2 . 9 3 1 . 5 8 4 . 8 5 1 . 6 3 1.00 5.10...

  • Page 94: Recommended Footprint

    LTE Standard Module Series EG91 Series Hardware Design 2. EG91-NA, EG91-NS, EG91-VX, EG91-NAX, EG91-NAXD and EG91-AUX modules bottom dimensions is as the same as EG95-EX. 7.2. Recommended Footprint 7.45 7.15 1.10 1.95 1.10 0 . 5 0 0 . 5 0 P I N 1 4 .

  • Page 95: Top And Bottom Views Of The Module

    LTE Standard Module Series EG91 Series Hardware Design NOTE For easy maintenance of this module, please keep about 3 mm between the module and other components on the motherboard. 7.3. Top and Bottom Views of the Module Figure 45: Top View of the Module...
  • Page 96 LTE Standard Module Series EG91 Series Hardware Design Figure 46: EG91-E Bottom View of the Module Figure 47: EG91-EX Bottom View of the Module NOTES These are renderings of the module. For authentic appearance, please refer to the module received from Quectel.

  • Page 97: Storage, Manufacturing And Packaging

    LTE Standard Module Series EG91 Series Hardware Design Storage, Manufacturing and Packaging 8.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35%–60%.

  • Page 98: Manufacturing And Soldering

    LTE Standard Module Series EG91 Series Hardware Design NOTES This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. 2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours after the package is removed.

  • Page 99: Packaging

    Max reflow cycle 8.3. Packaging EG91 series module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250 modules. The following figures show the packaging details, measured in mm.
  • Page 100 LTE Standard Module Series EG91 Series Hardware Design Figure 49: Tape Dimensions 48.5 C o v e r t a p e D i r e c t i o n o f f e e d +0.20 44.5 -0.00...
  • Page 101 LTE Standard Module Series EG91 Series Hardware Design 1083 Carrier tape Carrier tape unfolding packing module Figure 51: Tape and Reel Directions EG91_Series_Hardware_Design 100 / 106...

  • Page 102: Appendix A References

    LTE Standard Module Series EG91 Series Hardware Design Appendix A References Table 52: Related Documents Document Name Remark Power Management Application Note Quectel_EC2x&EG9x_Power_Management_ for EC25, EC21, EC20 R2.0, EC20 Application_Note R2.1, EG95 and EG91 AT Commands Manual for EG95 and...
  • Page 103 LTE Standard Module Series EG91 Series Hardware Design DFOTA Delta Firmware Upgrade Over-The-Air Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GMSK Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate...
  • Page 104 LTE Standard Module Series EG91 Series Hardware Design Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency RHCP Right Hand Circularly Polarized Receive Short Message Service Time Division Duplexing Transmitting Direction...
  • Page 105 LTE Standard Module Series EG91 Series Hardware Design Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access EG91_Series_Hardware_Design 104 / 106...

  • Page 106: Appendix B Gprs Coding Schemes

    LTE Standard Module Series EG91 Series Hardware Design Appendix B GPRS Coding Schemes Table 54: Description of Different Coding Schemes CS-1 CS-2 CS-3 CS-4 Scheme Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits 9.05 13.4...

  • Page 107: Appendix C Gprs Multi-Slot Classes

    LTE Standard Module Series EG91 Series Hardware Design Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 108 LTE Standard Module Series EG91 Series Hardware Design EG91_Series_Hardware_Design 107 / 106...

  • Page 109: Appendix D Edge Modulation And Coding Schemes

    LTE Standard Module Series EG91 Series Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 56: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot MCS-1 GMSK 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK 11.2kbps...

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