Guidelines To Insert The Smarc Som Into Carrier Board; Figure 27: Mechanical Dimensions Of I.mx8 Smarc Carrier Board - Side View; Figure 28: Som Insertion Guideline - iWave iW-RainboW-G27D Hardware User's Manual

i.MX8 SMARC Development Platform Hardware User Guide
i.MX8 SMARC Development Platform PCB thickness is 1.6mm±0.16mm, top side maximum height component is
connector dual Ethernet Jack J6 (29.34mm) followed by USB3.0 Stack slot J15(15.6mm) and bottom side maximum
height component is inductor (7mm). Please refer the below figure which gives height details of the i.MX8 SMARC
Development kit.

Figure 27: Mechanical dimensions of i.MX8 SMARC Carrier Board - Side View

3.4.2 Guidelines to insert the SMARC SOM into Carrier Board

• Make sure that power is not provided to the carrier board.
• Insert the SMARC module in to the MXM connector at an angle of 30° as shown in below image.
• Check the Notch position of SMARC module is proper while inserting.
• Once the SMARC module is inserted to the MXM connector properly, press the board vertically down as shown
below, such that the board is fixed firmly into the expansion connectors and fix the board by screwing.
iWave Systems Technologies Pvt. Ltd.

Figure 28: SOM Insertion Guideline

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