Download
Share
Print this page
Samsung Sens NT-R410 Series Service Manual
  1. Manuals
  2. Brands
  3. Samsung Manuals
  4. Laptop
  5. Sens NT-R410 Series
  6. Service manual

Samsung Sens NT-R410 Series Service Manual

Hide thumbs

Advertisement

Quick Links

Download this manual
SERVICE
SAMSUNG R410
책자에 수록되지 않은 내용은 K-zone 서비스 매뉴얼을 참조 하십시오.
Manual
제품특징
1. 간단하고 편리한 Note PC
-. 새로운 ATI 기술.
-. Internal 1.3M 카메라
-. 14.1'' WXGA+ 200nit Glare 액정화면
-. Windows Vista Home/Premium
Supportable.
2. 고성능 제품
-. Intel Core™2 Duo processor
-. 강한 통신 능력.
-. 편리한 Multi-media.

Advertisement

loading

Related Manuals for Samsung Sens NT-R410 Series

Summary of Contents for Samsung Sens NT-R410 Series

  • Page 1 SERVICE Manual 제품특징 SAMSUNG R410 1. 간단하고 편리한 Note PC -. 새로운 ATI 기술. -. Internal 1.3M 카메라 -. 14.1'' WXGA+ 200nit Glare 액정화면 -. Windows Vista Home/Premium Supportable. 2. 고성능 제품 -. Intel Core™2 Duo processor -. 강한 통신 능력.
  • Page 2 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - - 목 차 - 1. 주의사항 1) 서비스시 일반적인 주의 사항 ------------------------------------------- 1-1 2) 안전 주의 사항 -------------------------------------------------------- 1-2 3) 접지...
  • Page 3 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 1) Introduction (1) High Performance PC - Intel ® Core™ 2 Duo Processor and DDR II Memory - AMD RS600ME + SB600 Platform - Wireless LAN (option), Bluetooth (option)
  • Page 4 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2) Specification Processor and Motherboard Description Intel® Core 2 Duo T7100 (1.8GHz) ~ T7700 (2.4G) and All CPU at Q4'07.35W (64bit) T7100 : 1.8GHz T7300 : 2.0GHz Speed T7500 : 2.2GHz...
  • Page 5 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Controller HD Audio Codec, ALC262 Conversion Built-in high performance 20-bit ADC & 24-bit DAC Internal Interfaces Embedded 2 stereo speakers, Internal microphone Speaker Power Rating...
  • Page 6 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Average Access Time DVD 130ms Typ, CD 130ms Typ,. Weight 176g or less S/W supplied Cyberlink DVD Solution Security RPC-II Regional Encoding Super Multi Dual Layer 1...
  • Page 7 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Chipset CSP1040 AGR A3 & A3 5V1 Features RJ11 Output 10/100/1000 Ethernet Chipset Marvell 88E8055 Features RJ45 Output Wireless LAN ASKEY WLL3141-D99: 802.11b/g Type Mini card (Factory Option)
  • Page 8 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Voltage 11.1Vdc Battery Capacity 2400mAh/cell Battery Rating 11.1V / 4000mAh (53.28Wh) AC Adapter AD-6019S Output Power 90Watts Dimension 160 X 70 X 29mm Weight (AC Adapter) 300g ±...
  • Page 9 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 3) Key Feature R410 R20-Plus 667/800MHz Intel Core 2 Duo Processor 667/800MHz Intel Core 2 Duo Processor (Penryn/Merom) (Penryn/Merom) AMD RS600ME + SB600 AMD RS600ME + SB600...
  • Page 10 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 4) Compare with competitor Samsung R20- Model HP V3414TX HP 520 ASUS A8H73SR K004 Image Intel Core Intel Core Duo Intel Core Duo(Yonah) Intel Core2 Duo(Merom)
  • Page 11 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification BA59-02011A ST9120822AS 5400rpm, 120G, SATA, 8M BA59-02003A HTS541616J9SA00 5400rpm, 160G, SATA, 8M BA59-02012A ST9160821AS 5400rpm, 160G, SATA, 8M BA59-02110A MHW2160BH-PL 5400rpm, 160G, SATA, 8M BA59-02148A...
  • Page 12 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 6) Product Feature 6)-1 System View 2 - 10...
  • Page 13 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 11...
  • Page 14 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 12...
  • Page 15 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 13...
  • Page 16 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 14...
  • Page 17 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 15...
  • Page 18 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 7) New Function 7)-1. Camera (Option) Internal Camera (Option) for easily video and photo capture 7)-2. Express Card Slot 2 - 16...
  • Page 19 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 7)-3. New Keyboard 2 - 17...
  • Page 20 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 18...
  • Page 21 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 8) Software List Items Specification Version Vista Home Premium 32Bit Windows Vista Vista Home Basic 32Bit Vista Biz 32Bit XP SP2 professional Windows XP SP2...
  • Page 22 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 9) System Setup (BIOS Setup) MAIN SATA Port 1 The information on the device mounted on the Primary Master. The HDD capacity is displayed in XIAN.
  • Page 23 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Advanced Core Multi-Processing The option to determine whether to switch Single core or Dual Core processing. Intel(R) SpeedStep(TM) The option to enable or disable the SpeedStep function that automatically changes the CPU clock speed according to CPU usage.
  • Page 24 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Security Set the Supervisor Password Select to set the supervisor password. Set a User Password Select to set a user password Set a HDD 0 Password...
  • Page 25 Boot-time Diagnostic Screen The option to determine whether to display the Samsung logo on the screen when booting. PXE OPROM The option to determine whether to always initialize PXE Oprom in relation to a network boot. Since the general user does not use network boot, setting this option to [Only with F12] is recommended.
  • Page 26 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Main Advanced Security Boot Exit Item Specific Help ▶ Boot Device Priority ▶ Boot Device Priority Select system boot options NumLock [Off] Enable Keypad [By NumLock]...
  • Page 27 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Exit Exit Saving changes Saves the changed settings and exits. Exit Discarding Changes The changed settings are not saved and the previous settings are restored. Exits without saving the changes.
  • Page 28 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 10) Description of Main board 10)-1. Top WLAN Connect (J5) RJ45 (LAN500) LCD cable connector (LCD1) Heatsink (Thermal heatsink) VGA port (CRT500) Adapter Connect (J501)
  • Page 29 - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 10)-2. Bottom CPU socket (CPU500) SB600 (U504) RS600 (U502) Memory Socket (DDR500) Wirelesslan connect (U512) FAN Connector (J505) Modem Connect (J506) Headphone Connect (J509) MIC Connector (J508)
  • Page 30 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List SYSTEM K1007 K0001 I0013 K4000 K1001 I0003 K4001 K1002 K3001 K4002 K3002 K0002 K0201 I0006 T0001 M0001 W3006 M3005 M0003 I0009 B0013 I0001...
  • Page 31 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List Unit-Housing-LCDBack K0001 K2003 K2001 5 - 2...
  • Page 32 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List Unit-Housing-Top T0001 L1005 T0407 T0101 T2001 T2200 T0301 5 - 3...
  • Page 33 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List Unit-Housing-Bottom B0001 B0302 M4001 B0501 B0303 B0501 B0009 B0402 B0003 B0403 B0010 B0010 B0009 5 - 4...
  • Page 34 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List Unit-ODD D0001 D2000 D1002 D3000 5 - 5...
  • Page 35 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List NP-R410-FA02RU Location Part Number Parts Name & Specification Q'ty SA/SNA A0010 3903-000131 CBF-POWER CORD;DT,CN,EP2,IEC320 C7,250/2 A1001 BA46-08349A S/W CD;UTILITY,XIAN,WINVISTA,1.0,export, B0001 BA75-02028A UNIT-HOUSING_BOTTOM;XIAN,DOMESTIC,PC/ABS B0003 BA81-04528A DOOR-MEMORY;XIAN,DOMESTIC,PC/ABS,NH-1015...
  • Page 36 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List NP-R410-FA02RU Location Part Number Parts Name & Specification Q'ty SA/SNA I0009 BA43-00162A BATTERY-PACK;P32R04-06-H01,Firenze2,Li-i I0013 BA59-02244A MODULE-CAMERA;SCB-1300D,GD-5931A,1.3M CA K0001 BA75-02029A UNIT-HOUSING_LCD-BACK;XIAN,DOMESTIC,PC/A K0002 BA75-02030A UNIT-HOUSING_LCD-FRONT;XIAN,DOMESTIC,PC/...
  • Page 37 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List NP-R410-FA02RU Location Part Number Parts Name & Specification Q'ty SA/SNA M1027 BA62-00411A INSULATION-MEMORY;HABANA-C,PC,T0.2,W24,L M1028 3722-002601 JACK-USB;4P/2C,AUF,BLK,ANGLE-OFFSET,A TY M1029 2007-007468 R-CHIP;121Kohm,1%,1/16W,TP,1005 M1029 2007-008299 R-CHIP;61.9ohm,1%,1/16W,TP,1005...
  • Page 38 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List NP-R410-FA02RU Location Part Number Parts Name & Specification Q'ty SA/SNA M9999 2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608 M9999 2007-007274 R-CHIP;27.4Kohm,1%,1/10W,TP,1608 M9999 2007-007441 R-CHIP;562ohm,1%,1/10W,TP,1608 M9999 2203-001201 C-CER,CHIP;0.0070nF,0.5pF,50V,NP0,1005 M9999 2203-002487 C-CER,CHIP;4.7nF,10%,25V,X7R,1005...
  • Page 39 - This Document can not be used without Samsung's authorization - 5. Exploded View & Part List NP-R410-FA02RU Location Part Number Parts Name & Specification Q'ty SA/SNA T0101 BA59-02145A BOARD-TOUCHPAD;ACCORDION,TM-01020-003,BO T0301 BA41-00870A FFC-TOUCHPAD;XIAN,1.0,AU,6P,T0.3,L90MM,J T0407 BA81-04542A INSULATOR-T/P;XIAN,PC,L72.2,W61.3,T0.3mm T0407 BA81-04945A INSULATOR-TOUCHPAD_CU_SHEET;XIAN,PC,W55. T2001 BA96-03376A ASSY SPEAKER;XIAN,PB18CEG04SL-A-9GH,125M...
  • Page 40 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents Page. COVER Page. OPERATION BLOCK DIAGRAM Page. POWER DIAGRAM Page.
  • Page 41 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. OPERATION BLOCK DIAGRAM DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. mPGA479M Socket-P FAN CONTROL THERMAL CLOCK Page 11 MONITOR GENERATOR...
  • Page 42 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS POWER DIAGRAM SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. ALWAYS ON KBC3_SUSPWR KBC3_PWRON KBC3_VRON P5.0V_AUX P5.0V DDR2 Power VRM SB600...
  • Page 43 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS POWER SEQUENCE SAMSUNG ELECTRONICS CO’S PROPERTY. Rev. 0.1 DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. 3) P12.0V_ALW ALWAYS 2) VDC 3) P5.0V_ALW POWER 3) P3.3V_MICOM...
  • Page 44 THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS Timing Diagram, Power ON Rev. 0.1 Phil 2007-06-11 EXCEPT AS AUTHORIZED BY SAMSUNG. P5.0V_ALW P3.3V_MICOM ADT3_SEL# >= 20ms KBC3_RST# KBC3_CHKPWRSW# Type.
  • Page 45 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS CLOCK DISTRIBUTION SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS Rev. 0.1 EXCEPT AS AUTHORIZED BY SAMSUNG. BSEL(2:0) CLK0_HCLK0/HCLK0# 200 MHz PENRYN BSEL CLK3_PWRGD# CHP3_CPUSTOP# 667/533 MHz...
  • Page 46 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS BOARD INFORMATION SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. SCHEMATIC ANNOTATIONS AND BOARD INFORMATION PCI Devices Crystal / Oscillator Devices IDSEL#...
  • Page 47 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. CLOCK GENERATOR P3.3V P3.3V B529 B526 MMZ1608S121AT MMZ1608S121AT C696 C663 C666 C667 C668...
  • Page 48 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. CPU SOCKET-P : MEROM / PENTYN P1.05V CPU500-2 R125 CPU500-1 MEROM-SOCKET MEROM-SOCKET 2 / 4...
  • Page 49 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. CPU SOCKET-P : MEROM / PENRYN CPU500-3 CPU_CORE CPU_CORE P1.5V MEROM-SOCKET CLK0_HCLK0 BCLK0...
  • Page 50 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Thermal Monitor P3.3V_AUX NO_STUFF P5.0V P3.3V_AUX 10000nF 10000nF 100nF 100nF 6.3V 6.3V EMC2102...
  • Page 51 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS U502-1 EXCEPT AS AUTHORIZED BY SAMSUNG. RS600ME 1 OF 5 CPU1_A#(16:3) CPU1_D#(63:0) 9-C4 9-C2 9-C1 CPU_A3# CPU_D0# CPU_A4#...
  • Page 52 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. U502-2 RS600ME 2 OF 5 GFX_RX0P GFX_TX0P GFX_RX0N GFX_TX0N GFX_RX1P GFX_TX1P GFX_RX1N GFX_TX1N...
  • Page 53 SAMSUNG PROPRIETARY 17-D2 MEM1_ADQ(63:0) THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. MEM1_BMA(14:0) BE36 19-B4 18-D4 MEMB_A0 BG31 MEM1_AMA(14:0) MEMB_A1 17-D4 19-C4 BE42...
  • Page 54 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. B517 P3.3V BLM18PG181SN1 Put the AVDD,AVDDI,AVDDQ,PLVDD C571 2200nF decoupling CAPS on the botom side close to BALLS P1.2V...
  • Page 55 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS P1.8V SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. C100 10000nF P1.2V CORE PWR Core Power I/O transform power for Memory/CPU CPU TRANDS.
  • Page 56 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. SODIMM0 (CHANNEL A) DDR500-1 DDR2-SODIMM-200P-STD MEM1_AMA(14:0) MEM1_ADQ(63:0) 14-D4 19-C4 14-D3 DDR500-2 P1.8V_AUX DDR2-SODIMM-200P-STD...
  • Page 57 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. SODIMM1 (CHANNEL B) DDR501-1 DDR501-2 P1.8V_AUX DDR2-SODIMM-200P-STD DDR2-SODIMM-200P-STD MEM1_BMA(14:0) MEM1_BDQ(63:0) 14-D1 19-B4 14-A3...
  • Page 58 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P0.9V RA5-2 MEM1_CS0# RA22-1 14-B4 17-C4 MEM1_CS1# 14-B4 17-C4 RA11-1 MEM1_CS2# RA24-2 14-B1...
  • Page 59 SAMSUNG PROPRIETARY U504-1 THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS 218S6ECLA21FG SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS 1 / 4 EXCEPT AS AUTHORIZED BY SAMSUNG. AG10 R245 CHP3_ALINK_RST# A_RST* PCICLK0 CLK3_PCLKMICOM 20-B1 20-C1...
  • Page 60 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. U504-2 218S6ECLA21FG P3.3V_MICOM 2 / 4 8-B1 TP568 PCI_PME*_GEVENT4* USBCLK CLK3_USB48 R233 11.8K...
  • Page 61 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. U504-3 218S6ECLA21FG 3 / 4 AH21 AB29 SATA1_TXP0 SATA_TX0+ IDE_IORDY AJ21 AA28 26-C4...
  • Page 62 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P3.3V 3.3V I/O Power(S0) VDDQ_1 VSS_1 REQUIRED SYSTEM STRAPS U504-4 C584 C294 C254...
  • Page 63 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. WXGA LCD CONNECTOR LCD_VDD3V P3.3V VDC_INV VDC_INV P3.3V LCD1 SOCK-30P-2R-SMD-MNT SI2315BDS-T1 P3.3V_AUX P3.3V...
  • Page 64 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. CRT CONNECTOR VCC_CRT P3.3V MMZ1608S121AT CRT500 DSUB-15-3R-F TP840 VGA3_RED TP786 82nH VGA3_RED 15-B4...
  • Page 65 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Main to ODD Main to HDD HDD500 SOCK-22P-1R C685 10nF SATA1_TXP0 C684 10nF...
  • Page 66 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P3.3V_MICOM TP913 TP912 C580 C588 C579 100nF 100nF 100nF R205 R204 R206 P5.0V...
  • Page 67 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P3.3V_AUX 3722-002390 P1.8V_P2.5V_LAN 88E8040: H1286 (2603-000079) MNT4 88E8055: H5015 (BA26-00004A) MNT3 MNT2 P3.3V_AUX...
  • Page 68 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. MDC connector BLUETOOTH Bluetooth 2.0 Standard P3.3V_AUX NO_STUFF J504 P3.3V PIN2 Tied to P3.3V_AUX, 060812...
  • Page 69 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Mini PCI-E Card (WLAN) P3.3V P1.5V P3.3V_AUX R254 C292 P3.3V C256 100nF 100nF...
  • Page 70 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. MEMORY CARD (2 IN 1) P3.3V B530 1.8V BLM18PG181SN1 P3.3V_MCD P3.3V_MCD C323 C328...
  • Page 71 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. EXPRESS CARD P1.5V_EXP P3.3V P3.3V_EXP P3.3V_AUX_EXP P1.5V_EXP P3.3V_AUX P1.5V P3.3V P3.3V_EXP P1.5V_EXP P3.3V_AUX_EXP...
  • Page 72 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. ALL 1608 SIZE R681 R551 AUDIO CODEC C237 10nF P3.3V R572 C693 C691...
  • Page 73 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. AUDIO AMP VDD_AMP VDD_AMP NO_STUFF R591 R589 C625 C657 C659 100K 100K 100nF...
  • Page 74 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P3.3V C606 100nF JCK_SENS_HP 33-A3 BLM18PG181SN1 HP_OUT_R 33-C2 BLM18PG181SN1 HP_OUT_L 33-C2 C261 C238...
  • Page 75 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS CHARGER & POWER MANAGEMENT SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. NO_STUFF D506 B340A J501 VDC_ADPT PWR_DC BATT_DC 3Arms @ 250KHz...
  • Page 76 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P5V_AUX & P3.3V_AUX P3.3V_AUX NO_STUFF NO_STUFF NO_STUFF NO_STUFF NO_STUFF NO_STUFF V5FILT TP979 R694...
  • Page 77 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. DDR2 POWER P1.8V_AUX VDC P5.0V_AUX P5.0V P5.0V_AUX B513 EXCML16A270u TP835 NO_STUFF C548 C547...
  • Page 78 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. CPU VRM [INTERSIL] NO_STUFF C747 C589 C590 C592 C591 C607 100nF 100nF 100nF...
  • Page 79 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P1.2V & P1.05V P5.0V_AUX C612 100nF EC512 EC511 C648 TP923 TP924 68uF 68uF...
  • Page 80 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Switched Power On (P5V) Switched Power On (P1.8V) P5.0V_AUX P5.0V P12.0V_ALW P1.8V_AUX P1.8V...
  • Page 81 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Main to SUB Connector P3.3V_MICOM P3.3V_MICOM R549 R548 R550 D512 100K DA204K-T147 P5.0V P3.3V...
  • Page 82 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS P3.3V EXCEPT AS AUTHORIZED BY SAMSUNG. U514 7SZ08 KBC3_NUMLED# 27-C4 NUMLED# TOUCH PAD 43-C3 U516 7SZ08 KBC3_CAPSLED# 27-C4...
  • Page 83 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. DISCHARGE NO_STUFF NO_STUFF P5.0V_ALW P5.0V_AUX P1.8V_AUX P3.3V_AUX R512 R510 R509 R511 100K 49.9...
  • Page 84 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. CPU RHE FAN-NUT MT11 MT12 MT514 MT507 MT509 RMNT-38-70-1P RMNT-38-70-1P RMNT-38-70-1P RMNT-38-70-1P RMNT-35-60-1P...
  • Page 85 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. TP1283 TP1250 TP1161 ADT3_SEL# EXP3_CPPE# MCH2_THERMDN TP1238 TP1221 TP1162 AUD3_GPIO0 EXP3_CPUSB# MCH2_THERMDP TP1239...
  • Page 86 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. P5.0V_SUB P3.3V_SUB P5.0V_SUB P5.0V_SUB U521 SOCK-30P-2R-SMD-MNT TPS2062 NO_STUFF KBC3_SUB_PWRSW# LID3_SUB_SWITCH# TP500 47-C4 47-B4...
  • Page 87 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. REVISION HISTORY REVISION DATE NO.# CONTENTS NOTES Note1. Schematic Revision: MP 1 . 0 . 0...
  • Page 88 - This document cannot be used without Samsung's authorization - 3. Disassembly and Reassembly 3-1. Disassembly and Reassembly of R410 Part Figure Description Name 1. Must remove AC Adapter and Battery when disassembling system. 2. Then, slide buttons in direction of arrows No.1, then push battery in direction of...
  • Page 89 - This document cannot be used without the authorization of Samsung - 3. Disassembly and Reassembly Part Figure Description Name 6. Pull Insulator of HDD to 70º from ground. Then remove the HDD-FPC Connector (in circle). *CAUTION Don’t pull HDD-FPC with too much force.
  • Page 90 - This document cannot be used without the authorization of Samsung - 3. Disassembly and Reassembly Part Figure Description Name 10. After reversing Keyboard backward like pic. pull out Keyboard FPC with operating Keyboard Connector. 11. Separate cables between Main PCB and Top.
  • Page 91 - This document cannot be used without the authorization of Samsung - 3. Disassembly and Reassembly Part Figure Description Name 16. Disassemble LCD parts. 17. Separate three cables assembled in Mainboard. - SUB Board Cable : 1 EA - PORT_MODEM Cable : 1 EA - Blue Tooth cable : 1 EA 18.
  • Page 92 - This document cannot be used without the authorization of Samsung - 3. Disassembly and Reassembly Part Figure Description Name 21. Disassemble LCD A’ssy toward to yellow arrow direction. 22. Separate the top Memory of Mainboard,then separate the second one with same method.
  • Page 93 - This document cannot be used without the authorization of Samsung- 3. Disassembly and Reassembly Part Figure Description Name 26. After check combination loosen, separate CPU. (Be careful with bending of CPU pin.) Main System 27. Separate Wireless LAN Module with Twisting Screw.
  • Page 94 - This document cannot be used without the authorization of Samsung - 3. Disassembly and Reassembly Part Figure Description Name 1. 1st, Remove 6 Rubbers 2nd, Remove 6 screws. - M2xL5 : 6 EA (Upper side) * CAUTION : Be careful with scratch in LCD-Front when removing Rubber-Front.
  • Page 95 - This document cannot be used without the authorization of Samsung - 3. Disassembly and Reassembly Part Figure Description Name 7. Separate LCD panel and Inverter connector. 8. Remove screws for hinge. - M2xL5 : 4 EA (RED) 9. Remove screws for hinge bracket.
  • Page 96 - This document cannot be used without the authorization of Samsung- 3. Disassembly and Reassembly Part Figure Description Name 12. Reverse LCD Panel, Separate LCD cable and Inverter connector. 13. Remove tapes at point of no.1 and no.2 on back of LCD Panel.
  • Page 97 - This document cannot be used without the authorization of Samsung- 3. Disassembly and Reassembly Part Figure Description Name 15. Remove screws LCD Panel and Bracket-LCD. - M2xL3 : 8 EA (RED) Ass'y 3-10...
  • Page 98 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 1) General (1) Tools used for repairing the product System Diagnostics Disk MS-DOS Booting Disk System Diagnostics Card Screwdrivers ( ┼ ,— ） Tweezers Multi-meter Oscilloscope Logic Analyzer...
  • Page 99 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 2) Debugging Flow Chart 4 - 2...
  • Page 100 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4 - 3...
  • Page 101 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 3) System Diagnosis (1) System Diagnostics Card The Diagnostics Card shows the system operations during the POST (Power On Self Test) in a 2 digit hexadecimal number by connecting the cable to the 10 pin connector beside the memory slot after separating the Top part.
  • Page 102 - This Document can not be used without Samsung's authorization - 4. Troubleshooting Shadow system BIOS ROM Auto size cache Advanced configuration of chipset registers Load alternate registers with CMOS values Initialize interrupt vectors POST device initialization 2-1-2-3 Check the ROM copyright notice...
  • Page 103 - This Document can not be used without Samsung's authorization - 4. Troubleshooting Test and initialize PS/2 mouse Initialize floppy controller Determine number of ATA drives (optional) Initialize hard-disk controllers Initialize local-bus hard-disk controllers Jump to UserPatch2 Build MPTABLE for multi-processor boards...
  • Page 104 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (3) Use of Debug card -. Like upper picture, debug card is connected to DEBUG connector(as following) in Main board. -. Debug code is shown at the viewer in red line.
  • Page 105 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4) Use of diagnostic program 4)-1 copy Windiag2.42a to free folder. 4 - 8...
  • Page 106 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-2 Execute run.exe 4 - 9...
  • Page 107 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-3click Start menu and test. 4 - 10...
  • Page 108 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-4If do click stop, test disengages. 4 - 11...
  • Page 109 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-5If do click pause, test disengages. 4)-6End Windiag because EXIT does click. 4 - 12...
  • Page 110 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 5) Hardware Troubleshooting For the procedures to disassemble each part, refer to the descriptions of Chapter 4, “Disassembly and Reassembly”. ◆ LCD Related Troubles 1. The screen is dark or the colors of the screen are distorted.
  • Page 111 - This Document can not be used without Samsung's authorization - 4. Troubleshooting ◆ Main System Troubles 5. The system is not turned off. → Check if the AC adapter LED is lit and if the adapter is properly connected to the system.
  • Page 112 - This Document can not be used without Samsung's authorization - 4. Troubleshooting RTC Reset Point will be used from PCB MP1.1. Because there isn't have RTC Reset Point on the PCB MP1.0, So dissamble the RTC Battery connector and after 30 seconds when installing.
  • Page 113 - This Document can not be used without Samsung's authorization - 4. Troubleshooting → Check if there is a magnetic object near the speaker. 9. I cannot hear sound through the headphones. → Check if the sound is muted in Windows.
  • Page 114 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 11. The HDD is not recognized. → Check the connection status of the HDD connector. fixup HDD, check whether the system can be found. if not,change the connector on the motherboard and check again.
  • Page 115 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 14. The LAN function does not work. → Check if the LAN cable is properly connected. → Check if the LAN driver is properly installed. → If the driver is properly installed, check if the LAN cable jack is out of order.
  • Page 116 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 17. The Fan does not work normally → Check if the Thermal is locked tightly. → Check if the Fan cable is properly connected FAN Control Table...
  • Page 117 - This Document can not be used without Samsung's authorization - 4. Troubleshooting case, setup the BIOS according to your system environment. → Press <F2> to enter the BIOS SETUP. → Check if the date and time are correct in the BIOS SETUP.
  • Page 118 - This Document can not be used without Samsung's authorization - 4. Troubleshooting ◆ Windows / Screen Related Problems 24. The computer hangs while running a program. → If the running program causes an error: In Windows XP, press the <Ctrl>, <Alt> and <Del> key combination, select the application program and click on End Task in the Applications tab of the [Windows Task Manager] window.
  • Page 119 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 6) Device Settings Related Software Diagnosis (1) Check if the drivers of each of the devices are properly installed. That is, check if there are any yellow exclamation marks in the Device Manager.
  • Page 120 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (3) Check if the program is properly installed. Click on the Realtek Control Panel in the Control Panel and check if the function works normally. 4 - 23...
  • Page 121 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (4) HDD and ODD Related Problems For an HDD, check if the HDD operates in Ultra DMA Mode 5 by selecting the Primary IDE Channel in the Control Panel as follows. If it does not, check the BIOS SETUP, reinstall the operating system or replace the HDD-FPC or HDD, if necessary.
  • Page 122 - This Document can not be used without Samsung's authorization - 4. Troubleshooting For an ODD, check if it operates in Ultra DMA Mode 2. If it does not, check if the disc inserted into the ODD is clean. If the disc is contaminated, the access speed may slows down. If the disc is clean, check the BIOS SETUP, reinstall the operating system or ODD, if necessary.
  • Page 123 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (6) Other Problems Press each corresponding button and check its operation. The following figure illustrates the operation of the volume control button. 4 - 26...
  • Page 124 - This Document can not be used without Samsung's authorization - 4. Troubleshooting The drivers and application software are listed in the following table. Drivers XI'AN T2-VE Graphics Driver 8.452.0.0 Final 8.383.1.0000install WLAN Driver 7.3.1.109 7.3.1.42 Sound Driver 6.0.1.5566 6.0.1.5482 Touchpad Driver 10.1.2.0...
  • Page 125 - This Document can not be used without Samsung's authorization - 4. Troubleshooting OOBE_CaseLangCopy 1.0.0.3 1.0.0.0 BT Patch Play AVStation 4.1.20.47 4.1.20.46 Hotstart Shell 无 4.0.10.6 Play Camera Single 2.0.0.3 1.0.0.32 MS Office 2007 Ready (FRN/SPN/RUS/CHS/CHT/GER/KOR/ENG) McAfee VirusScan 8.0.226.0 7.2.142.0...
  • Page 126 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 7) Battery Use Time Check the following check lists for systems where the battery use time is too short to diagnose problems. (1) Check the battery Check if the battery is out of order referring to the Battery check program distributed to Service Centers and the 'Battery Check Manual' included in the 'Note-PC A/S Guide'.
  • Page 127 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4 - 30...
  • Page 128 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4 - 31...
  • Page 129 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 3. Battery Capacity Table 4. Battery Check Program 4 - 32...
  • Page 130 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (2) Check the battery use environment 1. Generally, the battery usage time in advertisements by notebook manufacturers refers to the maximum battery use time. Since the system specifications and the usage environment may differ, the user's battery usage time may differ from the advertisement even if there is no problem with the system.
  • Page 131 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 8) Etc. (1)CPU type 4-6 CODE TYPE Description ,2.6GHz,uFCPGA,478P,TR,PLASTIC,1.1V,44W,0t T9500 0902-002305 uFCPGA FF80576GG0646M o+100C,6MB,Penryn T9500,FSB800,6M ,2.5GHz,uFCPGA,478P,TR,PLASTIC,1.1V,44W,0t T9300 0902-002302 uFCPGA FF80576GG0606M o+100C,6MB,Penryn T9300,FSB800,6M ,2.4GHz,uFCPGA,478P,TR,PLASTIC,1.1V,35W,0t T8300 0902-002304 uFCPGA FF80577GG0563M o+100C,3MB,Penryn T8300,FSB800,3M 2.4GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0t...
  • Page 132 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (4)channel separator Notebook PC Post PC PC use opt channel Oversea Oversea code (5) Model group Different model group indication: Desktop PC Notebook PC Division DeskType Tower Type...
  • Page 133 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 9)Memory addition method 4 - 36...
  • Page 134 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4 - 37...
  • Page 135 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4 - 38...
  • Page 136 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4 - 39...
  • Page 137 - This Document can not be used without Samsung's authorization - 7. System Wire Diagram 1) Top 7- 1...
  • Page 138 - This Document can not be used without Samsung's authorization - 7. System Wire Diagram 2) Bottom LCD Cable Camera Cable SUB BD Cable BLUETOOTH CABLE 7- 2...
  • Page 139 - This Document can not be used without Samsung's authorization - 7. System Wire Diagram 3) LCD WLAN Cable Main WLAN Cable Aux 7- 3...
  • Page 140 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. WXGA+RG,Bla,W_ANT BA96-03593B ASSY LCD-BLACK XIAN,WXGA+RG,14.1 Inch,-,-,-,30P,BLACK,W_Antenna OSLO,541180560003,DC,8.5to20V,1.5mA,6.5mA,210Hz,167X10X5mm,1,50to60KHz INVERTER(MLITAC) ..2 BA44-00248A INVERTER I1-01-2-50 ,1550Vrms,PWM OSLO,VK.21209.202,DC,8.5to20V,1.5mA,6.5mA,210Hz,167*10*5mm,1,50to60KHz,1 INVERTER(DARFON) ..2 BA44-00250A INVERTER I1-02-2-50 550Vrms,PWM XIAN,wire,-,30P,L280mm,GRY,AWG32,Aces 88252-3039,WL1058H- LCD CABLE(TAEYAN ) ..2 BA39-00676A CBF HARNESS-LCD L3-01-2-50 30,BK,3.3V,1.0,280mm,teflon,9TYMA0258-LF,PE BAG XIAN,wire,-,30P,L280mm,GRY,AWG32,Aces 88252-3039,WL1058H-30,PE...
  • Page 141 BA81-04038A SPONGE-LCD_RIGHT-NEW HAINAN2,DOMESTIC,SPONGE,W33*L60*T2mm,BLACK,SPONGE-LCD_UPPER,- B_BAS/CHN/NB BA99-11990A ASSY ACCESSORY-B_BAS XIAN,EXPORT,CHN,B_BAS/CHN OSCD(H_BASIC) ..2 BA46-05715A S/W CD RCD,NP/DT,VISTAHB,1.0,CHS,DVD,1/1,-,-,-,- Warranty Envelope ..2 BA68-60054A MANUAL MAVERICK+,SAMSUNG,CHS,EXPORT,ART PAPER,-,-,1.0,Warranty envelope MANUAL-VISTA_RECOVERY- RECOVERY MANUAL ..2 BA68-03676A FIRENZE-R,SEC,E/F/G/S/R/CHS/CHT,Export,ARTPAPER,W148,L210mm,1.0,-,- GUIDE MILAN,SEC,K/E/F/G/S/R/P/T/CHS,-,ARTPAPER,W155mm,L222,1.0,- GUIDE_OFFICEREADY ..2 BA68-03772A MANUAL-GUIDE_OFFICEREADY ,GUIDE_OFFICEREADY CLEANER ..2 BA99-09615B ASSY ACCESSORY-CLEANER...
  • Page 142 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. P32R04-06-H01,Firenze2,Li-ion 2P3S,4000mAh,Cylindrical 18650,12.95V,- 6C/ 2000mAh(SDI) BA43-00162A BATTERY-PACK P1-01-2-60 ,11.1V,0to60C,2.5A,-,Black,9.0V,6.0A,9.0V,-20to60C, 3UR18650Y-2-SDN-14,HABANA-C,Li-ion, 2P3S,4000mAh,Cylinder 18650,12.975V,- 6C/2000mAh(SANYO) BA43-00155A BATTERY P1-02-2-40 ,11.1V, ASSY_BOTTOM BA97-02797A ASSY BOTTOM-MECHA XIAN,PC/ABS,BLACK,ASSY BOTTOM_MECHA,TEXTURE XIAN,DOMESTIC,PC+ABS NH1015 K2995,T1.4*L119*W81mm,BLACK, UNIT-DOOR_HDD ..2 BA75-02031A UNIT-DOOR_HDD TEXTURE,UNIT-DOOR_HDD,-,- XIAN,DOMESTIC,PC/ABS,NH-...
  • Page 143 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. S/160GB(5400_FJTS) BA59-02209A 160G,MHY2160BH,S63,H16,D16385,9.5mm,2.5INCH,SATA,125G/P,5400RPM,FDB J4-04-2-20 160G,WD1600BEVS- S/160GB(5400R_WD) BA59-02227A J4-03-2-20 22RST0,S63,H16,D16385,H9.5mm,2.5INCH,Sata,80G/P,5400RPM,FDB S/160GB(5400_TSB) BA59-02216A 160G,MK1637GSX,S63,H16,D16385,9.5mm,2.5INCH,SATA,80G/P,5200RPM,FDB J4-02-2-25 160G,HTS542516K9A300,S63,H16,D16385,H9.5mm,2.5INCH,SATA,125G/P,5400R S/160GB(5400_HGST) BA59-02203A J4-01-2-25 PM,FDB S/200GB 5400 KFUJI BA59-02210A 200G,MHY2200BH,S63,H16,D16385,9.5mm,2.5INCH,SATA,125G/P,5400RPM,FDB H1-01-2-50 200G,HTS542520K9A300,S63,H16,D16385,H9.5mm,2.5INCH,SATA,125G/P,5400R S/200GB 5400 HGST BA59-02204A H1-02-2-50 PM,FDB 320G,WDC-WD3200BEVT-...
  • Page 144 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. LINK-BATTERY_R ..2 BA81-03823A LINK-BATTERY_R LYON,POM,L26.4*W10.8*H5.6mm,BLACK,-,-,- BRACKET-BOTTOM_R ..2 BA81-04532A BRACKET-BOTTOM_R XIAN,DOMESTIC,SECC,W175.1*L33.55*T0.8mm,BRACKET-BOTTOM_R,-,- BRACKET-BOTTOM_L ..2 BA81-04533A BRACKET-BOTTOM_L XIAN,DOMESTIC,SECC,W26.2*L17.2*T0.8mm,BRACKET-BOTTOM_L,-,- SHIELD-HDD_EMI ..2 BA81-04534A SHIELD-HDD_EMI XIAN,DOMESTIC,Al sheet,W125*L85*T0.05mm,SHIELD-HDD_EMI,-,- SHIELD-BTM_EMI ..2 BA81-04535A SHIELD-BTM_EMI XIAN,DOMESTIC,Al sheet,W17.85*L37*T0.05mm,SHIELD-BTM_EMI,-,- XIAN,DOMESTIC,SR,W6.3*L18.8*H4.4mm,BLACK,TEXTURE,RUBBER- RUBBER-FOOT_REAR ..2 BA81-04536A RUBBER-FOOT_REAR...
  • Page 145 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. SEAL LABEL(CHN) BA68-10150C LABEL-SEAL AQUILLA-C,CHN,ARTPAPER+PET COATING,-,W55,L140,-,-,-,SECURITY LABEL HDD BARCODE BA68-20039A LABEL-PPID_E BLADE,-,PET,-,W50.8,L12.7mm,white,-,-,PPID Label(E) LCD CABLE LABEL BA68-20039A LABEL-PPID_E BLADE,-,PET,-,W50.8,L12.7mm,white,-,-,PPID Label(E) BARCODE LABEL BA68-40005G LABEL-BARCODE COMPUTER,-,-,-,55*12,SIL,SETPC CPU BARCODE BA68-40010Y LABEL-ETC S3935,-,POLYESTER,T0.025,-,-,-,-,-,- SYSTEM_CHN_90W_R410 BA68-04205A...
  • Page 146 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R131 ..4 2007-007548 R-CHIP 39.2ohm,1%,1/10W,TP,1608 R105 ..4 2007-007318 R-CHIP 1Kohm,1%,1/16W,TP,1005 R128 ..4 2007-007318 R-CHIP 1Kohm,1%,1/16W,TP,1005 R129 ..4 2007-007318 R-CHIP 1Kohm,1%,1/16W,TP,1005 R161 ..4 2007-007318 R-CHIP 1Kohm,1%,1/16W,TP,1005 R194 ..4 2007-007318 R-CHIP 1Kohm,1%,1/16W,TP,1005 R195 ..4...
  • Page 147 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- B530 ..4 3301-001649 BEAD-SMD...
  • Page 148 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005...
  • Page 149 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R122 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 R159 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 R184 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 R191 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 R232 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 R260 ..4 2007-000171...
  • Page 150 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2203-001103 C-CER,CHIP 6.8nF,10%,50V,X7R,1608 C262 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 C761 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 ..4 2203-000438...
  • Page 151 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2203-006324 C-CER,CHIP 2200nF,10%,10V,X5R,1608 ..4 2203-006324 C-CER,CHIP 2200nF,10%,10V,X5R,1608 ..4 2203-006324 C-CER,CHIP 2200nF,10%,10V,X5R,1608 ..4 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 C202 ..4 2203-001598 C-CER,CHIP 2200nF,+80-20%,16V,Y5V,2012 ..4 2203-001598 C-CER,CHIP 2200nF,+80-20%,16V,Y5V,2012 C295 ..4 2203-000278 C-CER,CHIP 0.01nF,0.5pF,50V,C0G,1005 C296 ..4...
  • Page 152 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C272 ..4 2203-006093 C-CER,CHIP 1000nF,+80-20%,6.3V,Y5V,1005 C276 ..4 2203-006093 C-CER,CHIP 1000nF,+80-20%,6.3V,Y5V,1005 C283 ..4 2203-006093 C-CER,CHIP 1000nF,+80-20%,6.3V,Y5V,1005 C287 ..4 2203-006093 C-CER,CHIP 1000nF,+80-20%,6.3V,Y5V,1005 C288 ..4 2203-006093 C-CER,CHIP 1000nF,+80-20%,6.3V,Y5V,1005 C289 ..4 2203-006093 C-CER,CHIP 1000nF,+80-20%,6.3V,Y5V,1005 C303 ..4...
  • Page 153 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R214 ..4 2007-007107 R-CHIP 100Kohm,1%,1/16W,TP,1005 R215 ..4 2007-007107 R-CHIP 100Kohm,1%,1/16W,TP,1005 ..4 2007-007107 R-CHIP 100Kohm,1%,1/16W,TP,1005 ..4 2007-007107 R-CHIP 100Kohm,1%,1/16W,TP,1005 ..4 2007-007107 R-CHIP 100Kohm,1%,1/16W,TP,1005 ..4 2007-007107 R-CHIP 100Kohm,1%,1/16W,TP,1005 R202 ..4 2007-000239 R-CHIP 1.5Kohm,1%,1/10W,TP,1608 R203...
  • Page 154 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 0904-002297 IC-BUS CONTROLLER AU6371B51-JEL-NP,LQFP,48P,7x7mm,50MHz,TR,PLASTIC,3.3V,-,0to+70C,SDHC ..4 2801-004666 CRYSTAL-SMD 12MHz,50ppm,HC-49SMA,12pF,50ohm,TP Y500 ..4 2801-004517 CRYSTAL-SMD 25.0MHz,30ppm,-,10pF,50ohm,TP ..4 0505-001852 FET-SILICON Si4686DY,N,30V,18.2A,0.0095ohm,3W,SO-8 A5-01-2-50 ..4 0505-001852 FET-SILICON Si4686DY,N,30V,18.2A,0.0095ohm,3W,SO-8 A5-01-2-50 C318 ..4 2203-000425 C-CER,CHIP 0.018nF,5%,50V,C0G,1005 C319 ..4 2203-000425...
  • Page 155 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C694 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C696 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 Q505 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q507 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q508 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q510 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q511 ..4...
  • Page 156 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R525 ..4 2007-007489 R-CHIP 150Kohm,1%,1/16W,TP,1005 R524 ..4 2007-007312 R-CHIP 20Kohm,1%,1/16W,TP,1005 R565 ..4 2007-007312 R-CHIP 20Kohm,1%,1/16W,TP,1005 R567 ..4 2007-007312 R-CHIP 20Kohm,1%,1/16W,TP,1005 R680 ..4 2007-007312 R-CHIP 20Kohm,1%,1/16W,TP,1005 R709 ..4 2007-007312 R-CHIP 20Kohm,1%,1/16W,TP,1005 R712 ..4...
  • Page 157 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. B501 ..4 3301-001434 BEAD-SMD 27ohm,1608,4000mA,TP,,,0.006ohm B513 ..4 3301-001434 BEAD-SMD 27ohm,1608,4000mA,TP,,,0.006ohm B511 ..4 3301-001569 BEAD-SMD 600ohm,2012,1000mA,TP,520ohm/90MHz,730ohm/150MHz,0.1ohm B512 ..4 3301-001569 BEAD-SMD 600ohm,2012,1000mA,TP,520ohm/90MHz,730ohm/150MHz,0.1ohm B509 ..4 3301-001272 BEAD-SMD 120ohm,2x1.25x1mm,-,TR,-,-,- B510 ..4 3301-001272 BEAD-SMD 120ohm,2x1.25x1mm,-,TR,-,-,- B505 ..4...
  • Page 158 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C672 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C687 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C688 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C691 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C692 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C715 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C718 ..4...
  • Page 159 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. TPS51120,QFN,32P,5x5mm,PLASTIC,-0.1/5.5V,2600mW,- U513 ..4 1203-004687 IC-PWM CONTROLLER 40to+85C,20A,1.97/2.03V,TP U512 ..4 1205-003404 IC-CODEC ALC262-VC2-GR,LQFP,48P,7x7mm,PLASTIC,5.5V,-,0to+70C,TR,C2 Version R5538D001-TR-F,QFN,20P,4x4mm,PLASTIC,3.6V,40mW,-40to+85C,TP,Express U511 ..4 1205-002807 IC-SWITCH Card Power S U510 ..4 1205-003157 IC-CLOCK GENERATOR ICS951461,TSSOP,64P,17x6.1mm,PLASTIC,3.3V,-,0to+70C,TR,- TPA6017A2PWPR,TSSOP,20P,6.5x4.4mm,4,21.6dB,PLASTIC,6V,1.4W,-40to+85C,- U508 ..4 1201-001991 IC-AUDIO AMP...
  • Page 160 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R625 ..4 2007-007382 R-CHIP 20Mohm,5%,1/10W,TP,1608 R677 ..4 2007-007382 R-CHIP 20Mohm,5%,1/10W,TP,1608 R676 ..4 2007-000147 R-CHIP 8.2Kohm,5%,1/16W,TP,1005 R673 ..4 2007-000969 R-CHIP 5.1ohm,1%,1/10W,TP,1608 R609 ..4 2007-007131 R-CHIP 13Kohm,1%,1/16W,TP,1005 R668 ..4 2007-007131 R-CHIP 13Kohm,1%,1/16W,TP,1005 R646 ..4...
  • Page 161 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R178 ..4 2007-001313 R-CHIP 330ohm,5%,1/16W,TP,1005 R507 ..4 2007-007549 R-CHIP 4.99Kohm,1%,1/10W,TP,1608 R509 ..4 2007-007226 R-CHIP 49.9ohm,1%,1/10W,TP,1608 R531 ..4 2007-007226 R-CHIP 49.9ohm,1%,1/10W,TP,1608 R756 ..4 2007-000882 R-CHIP 4.7ohm,5%,1/10W,TP,1608 R767 ..4 2007-000882 R-CHIP 4.7ohm,5%,1/10W,TP,1608 R768 ..4...
  • Page 162 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. Xian,Merom / Penryn,DDR2 667/800,2M/4M/6M,-,SATA,14.1 inch,AMD R600ME + ..2 BA92-04806B ASSY MOTHER BD-SMT SB600 Xian,Merom / Penryn,DDR2 667/800,2M/4M/6M,-,SATA,14.1 inch,AMD R600ME + SMT_U ..3 BA92-04806C ASSY MOTHER BD-SMT_U SB600 BIOS_REV ..4 BA68-40012N LABEL-LOCATION NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-...
  • Page 163 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R736 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R743 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R136 ..4 2007-000148 R-CHIP 10Kohm,5%,1/16W,TP,1005 R137 ..4 2007-000148 R-CHIP 10Kohm,5%,1/16W,TP,1005 R172 ..4 2007-000148 R-CHIP...
  • Page 164 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C213 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C216 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C218 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C222 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C234 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C243 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C256 ..4...
  • Page 165 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C199 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C200 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C201 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C211 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C212 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C214 ..4 2203-006090...
  • Page 166 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C755 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C759 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 ..4 2203-000940 C-CER,CHIP 0.47nF,10%,50V,X7R,1005 ..4 2203-000940 C-CER,CHIP 0.47nF,10%,50V,X7R,1005 ..4 2203-000940...
  • Page 167 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2402-001306 C-AL,SMD 330μF,20%,2V,-,Tape and Reel,7.3x4.3x1.9mm ..4 2402-001306 C-AL,SMD 330μF,20%,2V,-,Tape and Reel,7.3x4.3x1.9mm ..4 2402-001306 C-AL,SMD 330μF,20%,2V,-,Tape and Reel,7.3x4.3x1.9mm ..4 2402-001306 C-AL,SMD 330μF,20%,2V,-,Tape and Reel,7.3x4.3x1.9mm ..4 2402-001168 C-POLYMER AL CHIP 330uF,20%,2.5V,WT,TP,7.3*4.3*1.8mm,- ..4 2402-001168...
  • Page 168 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. RA22 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA23 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA24 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm ..4...
  • Page 169 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R233 ..4 2007-007615 R-CHIP 11.8Kohm,1%,1/10W,TP,1608 CAMERA1 ..4 3711-000922 HEADER-BOARD TO CABLE BOX,4P,1R,1.25mm,SMD-A,SN,WHT SPK1 ..4 3711-000922 HEADER-BOARD TO CABLE BOX,4P,1R,1.25mm,SMD-A,SN,WHT TPAD1 ..4 3708-002402 CONNECTOR-FPC/FFC/PIC 6P,1.0mm,SMD-A,SnBi,Y,SLIDE,BOTTOM IMIC1 ..4 3711-000541 HEADER-BOARD TO CABLE BOX,2P,1R,1.25mm,SMD-A,SN,NTR R160 ..4...
  • Page 170 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 0402-001024 DIODE-RECTIFIER MBR0540,40V,0.5A,SOD-123,TP ..4 3708-002166 CONNECTOR-FPC/FFC/PIC 25P,0.5mm,SMD-A,AU,Y,FLIP,BOTTOM ..4 3711-005753 HEADER-BOARD TO BOARD BOX,10P,1R,1mm,SMD-A,Sn,IVORY ..4 3709-001401 CONNECTOR-CARD EDGE 52P,0.8mm,SMD-A,AU,mini pci express PCB(GCE) ..4 BA41-00860A PCB MAIN XIAN,OSP L/F,6L,1.0T,1.1 mm,W223.77*248.00 mm,-,1,-,-,- A0-02-2-30 PCB(HANNST) ..4...
  • Page 171 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C762 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 C765 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 C766 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 C767 ..4 2203-000438 C-CER,CHIP 1nF,10%,50V,X7R,1005 C514 ..4 2203-006348 C-CER,CHIP 1000nF,10%,25V,X5R,1608 C529 ..4 2203-006348 C-CER,CHIP 1000nF,10%,25V,X5R,1608 C539 ..4...
  • Page 172 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R528 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R546 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R555 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R570 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R574 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R582 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R587 ..4...
  • Page 173 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. B526 ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- B529 ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- B528 ..4 3301-001772 BEAD-SMD 27ohm,1608,-,TP,30ohm/120MHz,48ohm/550Mhz,- B527 ..4 3301-001148 BEAD-SMD 60ohm,1608,TP,-,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,-...
  • Page 174 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C580 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C581 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C588 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C596 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C597 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C598 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C599 ..4...
  • Page 175 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. U522 ..4 1205-002596 IC-SWITCH TPS2062,SOIC,8P,5x6x1.65mm,PLASTIC,5V,585.82mW,-40to+85C,TP,- 7SZ14,SCHMITT TRIGGER,SOT-23,5P,63MIL,SINGLE,TR,-,6V,6V,- U519 ..4 0801-002478 IC-CMOS LOGIC 40to+85,200mW,-0.5V,50mA,20mA,50mA 7SZ14,SCHMITT TRIGGER,SOT-23,5P,63MIL,SINGLE,TR,-,6V,6V,- U520 ..4 0801-002478 IC-CMOS LOGIC 40to+85,200mW,-0.5V,50mA,20mA,50mA 7SZ08,2-INPUT AND GATE,SC-70,5P,49MIL,SINGLE,TP,CMOS,1.8/5.5V,0V,- U514 ..4 0801-002628 IC-CMOS LOGIC 40to+85,150mW,0V,20uA,10uA,- 7SZ08,2-INPUT AND GATE,SC-70,5P,49MIL,SINGLE,TP,CMOS,1.8/5.5V,0V,- U516...
  • Page 176 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R651 ..4 2007-008294 R-CHIP 33OHM,1%,1/16W,TP,1005 R652 ..4 2007-008294 R-CHIP 33OHM,1%,1/16W,TP,1005 R653 ..4 2007-008294 R-CHIP 33OHM,1%,1/16W,TP,1005 R667 ..4 2007-008294 R-CHIP 33OHM,1%,1/16W,TP,1005 R669 ..4 2007-008294 R-CHIP 33OHM,1%,1/16W,TP,1005 R682 ..4 2007-008294 R-CHIP 33OHM,1%,1/16W,TP,1005 R683 ..4...
  • Page 177 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C754 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C756 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C757 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C758 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C532 ..4 2203-000489 C-CER,CHIP 2.2nF,10%,50V,X7R,1005 R155 ..4 2007-001313 R-CHIP 330ohm,5%,1/16W,TP,1005 R178 ..4...
  • Page 178 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C643 ..4 2203-002720 C-CER,CHIP 10nF,10%,25V,X7R,1005 B509 ..4 3301-001272 BEAD-SMD 120ohm,2x1.25x1mm,-,TR,-,-,- B510 ..4 3301-001272 BEAD-SMD 120ohm,2x1.25x1mm,-,TR,-,-,- C556 ..4 2203-006069 C-CER,CHIP 4700nF,10%,6.3V,X7R,2012 C609 ..4 2203-006069 C-CER,CHIP 4700nF,10%,6.3V,X7R,2012 C611 ..4 2203-006069 C-CER,CHIP 4700nF,10%,6.3V,X7R,2012 C642 ..4...
  • Page 179 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C688 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C691 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C692 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C715 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C718 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C728 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C734 ..4...
  • Page 180 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C638 ..4 2203-000627 C-CER,CHIP 0.022nF,5%,50V,C0G,1005 C221 ..4 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 C237 ..4 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 C555 ..4 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 C582 ..4 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 C630 ..4 2203-000257 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608 C709 ..4...
  • Page 181 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R614 ..4 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 R628 ..4 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 R631 ..4 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 R681 ..4 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 R688 ..4 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 R733 ..4 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608 R758 ..4...
  • Page 182 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. Q516 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q517 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q521 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q527 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q532 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q537 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 Q541 ..4...
  • Page 183 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. Y504 ..4 2801-000111 CRYSTAL-SMD 0.032768MHz,20ppm,28-AAW,12.5pF,50000ohm,- Y503 ..4 2801-004667 CRYSTAL-SMD 14.31818MHz,50ppm,-,16pF,70ohm,TP Y502 ..4 2801-004668 CRYSTAL-SMD 25MHz,50ppm,-,10pF,50ohm,TP Y501 ..4 2801-004665 CRYSTAL-SMD 10MHz,50ppm,HC-49SMA,16pF,50ohm,TP U521 ..4 1205-002596 IC-SWITCH TPS2062,SOIC,8P,5x6x1.65mm,PLASTIC,5V,585.82mW,-40to+85C,TP,- U522 ..4 1205-002596 IC-SWITCH TPS2062,SOIC,8P,5x6x1.65mm,PLASTIC,5V,585.82mW,-40to+85C,TP,- 7SZ14,SCHMITT TRIGGER,SOT-23,5P,63MIL,SINGLE,TR,-,6V,6V,- U519...
  • Page 184 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C716 ..4 2203-006348 C-CER,CHIP 1000nF,10%,25V,X5R,1608 C548 ..4 2203-002487 C-CER,CHIP 4.7nF,10%,25V,X7R,1005 C714 ..4 2203-002487 C-CER,CHIP 4.7nF,10%,25V,X7R,1005 R155 ..4 2007-001313 R-CHIP 330ohm,5%,1/16W,TP,1005 R178 ..4 2007-001313 R-CHIP 330ohm,5%,1/16W,TP,1005 Q525 ..4 0501-000465 TR-SMALL SIGNAL MMBT3904,NPN,350mW,SOT-23,TP,30-300 Q526 ..4...
  • Page 185 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C755 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 C759 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 ..4 2203-000233 C-CER,CHIP 0.1nF,5%,50V,C0G,1005 ..4 0505-002068 FET-SILICON SM6K2,N,60V,200mA,4ohm,.2W,SOT-23-6 ..4 0505-002068 FET-SILICON SM6K2,N,60V,200mA,4ohm,.2W,SOT-23-6 ..4 0505-001064 FET-GAAS BSS138,50V,14V,0.22A,360mW,SOT-23,TP ..4 0505-001064...
  • Page 186 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2007-007334 R-CHIP 200Kohm,1%,1/16W,TP,1005 ..4 2007-007334 R-CHIP 200Kohm,1%,1/16W,TP,1005 C164 ..4 2203-006474 C-CER,CHIP 22000nF,20%,6.3V,X5R,2012 C277 ..4 2203-006474 C-CER,CHIP 22000nF,20%,6.3V,X5R,2012 ..4 2203-006474 C-CER,CHIP 22000nF,20%,6.3V,X5R,2012 C318 ..4 2203-000425 C-CER,CHIP 0.018nF,5%,50V,C0G,1005 C319 ..4 2203-000425 C-CER,CHIP 0.018nF,5%,50V,C0G,1005...
  • Page 187 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R262 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 R271 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 R281 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 ..4 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005 ..4...
  • Page 188 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C205 ..4 2203-006324 C-CER,CHIP 2200nF,10%,10V,X5R,1608 ..4 2203-006324 C-CER,CHIP 2200nF,10%,10V,X5R,1608 ..4 2203-006324 C-CER,CHIP 2200nF,10%,10V,X5R,1608 ..4 2203-006324 C-CER,CHIP 2200nF,10%,10V,X5R,1608 C104 ..4 2203-002709 C-CER,CHIP 100nF,+80-20%,16V,Y5V,1005 C146 ..4 2203-002709 C-CER,CHIP 100nF,+80-20%,16V,Y5V,1005 ..4 2203-002709 C-CER,CHIP 100nF,+80-20%,16V,Y5V,1005 ..4...
  • Page 189 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005...
  • Page 190 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. RA13 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA14 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA15 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA16 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA17 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA18 ..4 2011-000685 R-NETWORK 56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm RA19 ..4...
  • Page 191 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R141 ..4 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005 R151 ..4 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005 R210 ..4 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005 R211 ..4 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005 ..4 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005 ..4 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005 ..4 2007-000143 R-CHIP 4.7Kohm,5%,1/16W,TP,1005...
  • Page 192 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C162 ..4 2203-000776 C-CER,CHIP 0.33nF,10%,50V,X7R,1608 C208 ..4 2203-000776 C-CER,CHIP 0.33nF,10%,50V,X7R,1608 C223 ..4 2203-000776 C-CER,CHIP 0.33nF,10%,50V,X7R,1608 C224 ..4 2203-000776 C-CER,CHIP 0.33nF,10%,50V,X7R,1608 C527 ..4 2203-000776 C-CER,CHIP 0.33nF,10%,50V,X7R,1608 BLT1 ..4 3711-003688 HEADER-BOARD TO CABLE BOX,8P,1R,1.25MM,SMD-S,SN,WHT BIOS ..4...
  • Page 193 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. SOLDER CREAM ..5 0202-001520 SOLDER-CREAM LFM-48X TM-HP,-,D25-45um,96.5Sn/3Ag/0.5Cu,Flux 12.0% ZZ-02-2-50 ..4 0505-001585 FET-SILICON FDC653N,N,30V,5A,55mohm,1.6W,SSOT-6 A1-01-2-50 CAMERA1 ..4 3711-000922 HEADER-BOARD TO CABLE BOX,4P,1R,1.25mm,SMD-A,SN,WHT SPK1 ..4 3711-000922 HEADER-BOARD TO CABLE BOX,4P,1R,1.25mm,SMD-A,SN,WHT TPAD1 ..4 3708-002402 CONNECTOR-FPC/FFC/PIC...
  • Page 194 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C538 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C605 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C619 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C663 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C677 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C686 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C693 ..4...
  • Page 195 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C544 ..4 2203-005918 C-CER,CHIP 1000nF,10%,6.3V,X7R,1608 C545 ..4 2203-005918 C-CER,CHIP 1000nF,10%,6.3V,X7R,1608 C652 ..4 2203-005918 C-CER,CHIP 1000nF,10%,6.3V,X7R,1608 C678 ..4 2203-005918 C-CER,CHIP 1000nF,10%,6.3V,X7R,1608 C679 ..4 2203-005918 C-CER,CHIP 1000nF,10%,6.3V,X7R,1608 C719 ..4 2203-005918 C-CER,CHIP 1000nF,10%,6.3V,X7R,1608 C569 ..4...
  • Page 196 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R670 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R672 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R679 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R705 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R718 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R719 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R721 ..4...
  • Page 197 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R632 ..4 2007-008298 R-CHIP 49.9ohm,1%,1/16W,TP,1005 R633 ..4 2007-008298 R-CHIP 49.9ohm,1%,1/16W,TP,1005 R634 ..4 2007-008298 R-CHIP 49.9ohm,1%,1/16W,TP,1005 R635 ..4 2007-008298 R-CHIP 49.9ohm,1%,1/16W,TP,1005 R636 ..4 2007-008298 R-CHIP 49.9ohm,1%,1/16W,TP,1005 R637 ..4 2007-008298 R-CHIP 49.9ohm,1%,1/16W,TP,1005 R638 ..4...
  • Page 198 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R685 ..4 2007-008294 R-CHIP 33OHM,1%,1/16W,TP,1005 R646 ..4 2007-008293 R-CHIP 475OHM,1%,1/16W,TP,1005 R625 ..4 2007-007382 R-CHIP 20Mohm,5%,1/10W,TP,1608 R677 ..4 2007-007382 R-CHIP 20Mohm,5%,1/10W,TP,1608 R620 ..4 2007-007443 R-CHIP 3.01Kohm,1%,1/10W,TP,1608 R618 ..4 2007-007942 R-CHIP 1Mohm,1%,1/16W,TP,1005 R726 ..4...
  • Page 199 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R768 ..4 2007-000882 R-CHIP 4.7ohm,5%,1/10W,TP,1608 R769 ..4 2007-000882 R-CHIP 4.7ohm,5%,1/10W,TP,1608 ..4 2007-000402 R-CHIP 150ohm,5%,1/10W,TP,1608 R713 ..4 2007-000402 R-CHIP 150ohm,5%,1/10W,TP,1608 R715 ..4 2007-000402 R-CHIP 150ohm,5%,1/10W,TP,1608 R716 ..4 2007-000402 R-CHIP 150ohm,5%,1/10W,TP,1608 R717 ..4 2007-000402...
  • Page 200 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C550 ..4 2203-000812 C-CER,CHIP .033nF,5%,50V,C0G,-,1005 B527 ..4 3301-001148 BEAD-SMD 60ohm,1608,TP,-,- B519 ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- B523 ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- B524 ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- B526 ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- B529 ..4...
  • Page 201 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R181 ..4 2007-000172 R-CHIP 10ohm,5%,1/16W,TP,1005 R182 ..4 2007-000172 R-CHIP 10ohm,5%,1/16W,TP,1005 R233 ..4 2007-007615 R-CHIP 11.8Kohm,1%,1/10W,TP,1608 R168 ..4 2007-007549 R-CHIP 4.99Kohm,1%,1/10W,TP,1608 R169 ..4 2007-000077 R-CHIP 470ohm,5%,1/10W,TP,1608 ..4 0505-001883 FET-SILICON RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 ..4 0505-001883 FET-SILICON...
  • Page 202 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- B530 ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-001649 BEAD-SMD 180ohm,1608,-,TP,-,226ohm/389MHz,- ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- ..4 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- ..4 3301-000314 BEAD-SMD...
  • Page 203 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C158 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C166 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C167 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C169 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C171 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C173 ..4 2203-006090 C-CER,CHIP 10000nF,10%,6.3V,X5R,2012 C176 ..4...
  • Page 204 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C123 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C124 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C125 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C129 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C130 ..4 2203-006048 C-CER,CHIP 100nF,10%,10V,X7R,1005 C131 ..4 2203-006048...
  • Page 205 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. C255 ..4 2203-005482 C-CER,CHIP 100nF,10%,10V,X5R,1005 C268 ..4 2203-005482 C-CER,CHIP 100nF,10%,10V,X5R,1005 C270 ..4 2203-005482 C-CER,CHIP 100nF,10%,10V,X5R,1005 C271 ..4 2203-005482 C-CER,CHIP 100nF,10%,10V,X5R,1005 C273 ..4 2203-005482 C-CER,CHIP 100nF,10%,10V,X5R,1005 C274 ..4 2203-005482 C-CER,CHIP 100nF,10%,10V,X5R,1005 C275 ..4...
  • Page 206 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt. R771 ..4 2007-000168 R-CHIP 470Kohm,5%,1/16W,TP,1005 R224 ..4 2007-007100 R-CHIP 10Mohm,5%,1/16W,TP,1005 R160 ..4 2007-000140 R-CHIP 1Kohm,5%,1/16W,TP,1005 R173 ..4 2007-000140 R-CHIP 1Kohm,5%,1/16W,TP,1005 R177 ..4 2007-000140 R-CHIP 1Kohm,5%,1/16W,TP,1005 R226 ..4 2007-000140 R-CHIP 1Kohm,5%,1/16W,TP,1005 R227 ..4...
  • Page 207 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R736 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R743 ..4 2007-007142 R-CHIP 10Kohm,1%,1/16W,TP,1005 R113 ..4 2007-007307 R-CHIP 150ohm,1%,1/16W,TP,1005 R115 ..4 2007-007307 R-CHIP 150ohm,1%,1/16W,TP,1005 R118 ..4 2007-007307 R-CHIP...
  • Page 208 Design Location Level Parts Code Parts Description Spec. Quantity Service Alt..4 2007-007239 R-CHIP 31.6Kohm,1%,1/10W,TP,1608 R245 ..4 2007-000173 R-CHIP 22ohm,5%,1/16W,TP,1005 R246 ..4 2007-000173 R-CHIP 22ohm,5%,1/16W,TP,1005 ..4 2007-000173 R-CHIP 22ohm,5%,1/16W,TP,1005 ..4 2007-000173 R-CHIP 22ohm,5%,1/16W,TP,1005 ..4 2007-000173 R-CHIP 22ohm,5%,1/16W,TP,1005 ..4 2007-008133 R-CHIP 56.2Kohm,1%,1/10W,TP,1608 R164 ..4...
  • Page 209 - This Document can not be used without Samsung's authorization - 1. Precautions 1) General After-Sales Service Precautions (1) Do not let customers repair the product themselves. ☞ There is a danger of injury and the product life time may be shortened.
  • Page 210 - This Document can not be used without Samsung's authorization - 1. Precautions 2) Safety Precautions (1) EMI This device has been registered regarding EMI for residential use. It can be used in all areas. (2) Circuit Test (Logic Test) Precautions The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS.
  • Page 211 - This Document can not be used without Samsung's authorization - 1. Precautions 3) Ground The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a multitap with a ground terminal only.