Table 5-7 Test Conditions And Results Of The Mechanical Reliability Of The Em820W Module - Huawei EM820W Hardware Manual

HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide

Table 5-7 Test conditions and results of the mechanical reliability of the EM820W module

Item
Low-temperature
storage
High-temperature
storage
Low-temperature
working
High-temperature
working
Damp heat cycling
Temperature shock
Salty fog test
Sine vibration
Shock test
Issue 01 (2010-12-09)
Test Condition
Temperature: –40±2ºC
Test duration: 24 h
Temperature: 85±2ºC
Test duration: 24 h
Temperature: –30±2ºC
Test duration: 24 h
Temperature: 75±2ºC
Test duration: 24 h
High temperature: 55±2ºC
Low temperature: 25±2ºC
Humidity: 95%
Repetition times: 4
Test duration: 12 h + 12 h
Low temperature: –40±2ºC
High temperature: 85±2ºC
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
Temperature: 35°C
Density of the NaCl solution: 5±1%
Spraying interval: 8 h
Duration of exposing the module to
the temperature of 35°C: 16 h
Frequency range: 5 Hz to 200 Hz
Acceleration: 10 m/s2
Frequency scan rate: 1 oct/min
Test period: 3 axial directions. Five
circles for each axial direction.
Half-sine wave shock
Peak acceleration: 300 m/s2
Shock duration: 11 ms
Test period: 6 axial directions. One
shock for each axial direction.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
34