TABLE OF CONTENTS 1 Safety P recau tio n s----------- 2 W a rn in g ---------------------------- 3 Service Navigation------------------------------------------------------ 6 4 Specifications-------------------------------------------------------------8 5 Service M o d e-------------------------------------------------------------- 9 6 Troubleshooting Guide---------------------- 7 Disassembly and Assem bly Instructions 12 Printed Circuit Board 8 Measurements and Adjustments 13 Exploded View and Replacement Parts List- 9 Block D ia g ra m -----------------------------------------------------------31...
Warning 2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices Caution...
Page 5
2.2. About lead free solder (PbF) Note: Lead is listed as (Pb) in the periodic table o f elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
4 Specifications Pow er Source Pow er Consum ption Pow er Consum ption in Standby m ode Display panel Aspect Ratio Visible screen size Num ber o f pixels Sound Speaker Audio Output Headphones Receiving System s / Band name PAL B, G, H, I, SECAM B, G, SECAM L, L’...
7 Disassembly and Assembly Instructions 7.1. Remove the Rear cover 7.2. Remove the P-Board Caution: 7.4. Remove the Tuner unit 7.3. Remove Side terminal cover and Rear terminal cover...
Page 19
7.5. Remove the A-Board 7.7. Remove the Control button unit 7.6. Remove the Speakers 7.8. Remove the GK-Board...
Page 20
7.9. Remove the SM-Board 7.11. Remove the SS2-Board 7.12. Remove the SS-Board 7.10. Remove the SC-Board...
Page 21
7.13. Remove the Hanger metals 7.15. Remove the C2-Board 7.14. Remove the C1-Board 7.16. Remove the Plasma panel sec tion from the Cabinet assy (glass) <=»■...
7.18. Remove the Front glass 7.20. Replace the plasma panel Caution: A new plasma panel itself without Hanger metals is fragile. To avoid the dam age to new plasma panel, carry a new plasma panel taking hold o f the Hanger metals after assembling the Hanger metals and the Stand brackets.
Page 26
8.1.4. Adjustment Volume Location 8.1.5. Test Point Location...
Page 27
8.2. Adjustment 8.2.1. Sub-Contrast adjustment Ref.: RF signal modulation spec. Note: UK models: 80% O ther models: 90% Note: Sub-contrast adjustm ent is unadjusted for AV/ HD input. B u t, when needing the adjustm ent cho sen manually, please refer to [ alterna tive m ethod ].
Page 63
11.20. A-Board (14/21) Schematic Diagram D O W N L E F T...
Page 64
11.21. A-Board (15/21) Schematic Diagram IP D 2 d d r s d r a m D D R -T erm in ate to DDR 1 i - ® A -B O A R D (15 /21 ) 4 D O W N -R IG H T мЧ...
Page 65
11.22. A-Board (16/21) Schematic Diagram A -B O A R D (16 /21 ) output...
Page 66
11.23. A-Board (17/21) Schematic Diagram A -B O A R D (17 /21 ) t e m p s e n s o r...
Page 67
11.24. A-Board (18/21) Schematic Diagram A -B O A R D (1 8 /2 1 )
Page 68
11.25. A-Board (19/21) Schematic Diagram A -B O A R D (1 9 /2 1 )
Page 70
11.26. A-Board (20/21) Schematic Diagram A -B O A R D (20 /21 )
Page 71
11.27. A-Board (21/21) Schematic Diagram A -B O A R D (21 /21 )
Page 72
11.28. C1-Board (1/2) Schematic Diagram C 1 -B O A R D T N P A 4 8 9 0 (1/2)
Page 73
11.29. C1-Board (2/2) Schematic Diagram C 1 -B O A R D T N P A 4 8 9 0 (2/2)
Page 74
11.30. C2-Board (1/2) Schematic Diagram C 2 -B O A R D T N P A 4891 (1/2)
Page 131
M 10K o o m M 10K OOM M 2.2K OOM M 10K OOM M 330 OOM M 100 , 1/ o o m M 10K OOM M 1K OOM 1/10W M 2.2K OOM W 10 OOM, , 5W M 10K OOM M 68K OOM...
Page 132
M 100 o o m M 1K OOM 1/10W M 1K OOM 1/10W M 100 o o m M 100 o o m M 1K OOM 1/10W M 100 o o m M 100 o o m M 150K00M M 100 o o m M 1K OOM 1/10W...