SPECIFICATIONS
PXIe-5763
PXI FlexRIO Digitizer
This document lists the specifications for the PXIe-5763. Specifications are subject to change
without notice. For the most recent device specifications, refer to ni.com/support.
Note
Using the PXIe-5763 in a manner not described in this document might
impair the protection the PXIe-5763 provides.
Note
These specifications are typical at 25 °C unless otherwise noted.
Note
Specifications are valid under the following conditions unless otherwise
noted:
•
The chassis fan speed is set to HIGH, the foam fan filters are removed if
present, and the empty slots contain PXI chassis slot blockers and filler panels.
For more information about cooling, refer to the Maintain Forced-Air Cooling
Note to Users at ni.com/manuals.
Contents
Definitions.................................................................................................................................2
Digital I/O................................................................................................................................. 2
Reconfigurable FPGA...............................................................................................................5
Onboard DRAM........................................................................................................................5
Analog Input............................................................................................................................. 6
General Characteristics..................................................................................................... 6
Typical Specifications....................................................................................................... 6
CLK/REF IN........................................................................................................................... 13
General Characteristics................................................................................................... 13
Bus Interface........................................................................................................................... 16
Physical................................................................................................................................... 17
Environment............................................................................................................................17
Operating Environment...................................................................................................17
Storage Environment.......................................................................................................18
Shock and Vibration................................................................................................................18
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