Thermal Design Guide - Huawei MU609 Hardware Manual

HUAWEI MU609 HSPA Mini PCIe Module
Hardware Guide
It is recommended not to apply any pull forces after the bending of the cable, as
described in Figure 6-6 .
Figure 6-6 Do not apply any pull forces after the bending of the cable

6.8 Thermal Design Guide

When using in the network, the Mini PCIe module has high power consumption (for
details, see Table 5-6 ). To improve the module reliability and stability, focus on the
thermal design of the device to speed up heat dissipation.
Take the following heat dissipation measures:


Issue 03 (2014-12-04)
The extraction tool is recommended.

 Any attempt of unmating by pulling on the cable may result in damage and influence the
mechanical/electrical performance.
Do not hollow out the customer PCB.
Attach the thermal conductive material between the Mini PCIe and the customer
PCB. The recommended thermal conductivity of the thermal conductive material
is 1.0 W/m-k or higher (recommended manufacturers: Laird and Bergquist). The
dimensions (W x D) of the thermal conductive material are 38 mm x 28 mm (1.50
in. x 1.10 in.), and its height depends on the height of the Mini PCIe connector
you use and the method for installing the Mini PCIe. When deciding the height of
the thermal conductive material, you are advised to obey the following rule: After
the Mini PCIe is fastened to the customer PCB, the compression amount of the
thermal conductive material accounts for 15% to 30% of the thermal conductive
material size. For example, if you use a connector shown in the following figure
and install the Mini PCIe like this, the recommended height of the thermal
conductive material is 1.8 mm (0.07 in.).
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Mechanical Specifications
54