Toshiba T6K04 Handbook page 2

• Polyimide base film is hard and thin. Be careful not to injure yourself on the film or to scratch any other parts with the film. Try to
design and manufacture products so that there is no chance of users touching the film after assembly, or if they do , that there is no
chance of them injuring themselves. When cutting out the film, try to ensure that the film shavings do not cause accidents. After use,
treat the leftover film and reel spacers as industrial waste.
• Light striking a semiconductor device generates electromotive force due to photoelectric effects. In some cases this can cause the
device to malfunction.
This is especially true for devices in which the surface (back), or side of the chip is exposed. When designing circuits, make sure
that devices are protected against incident light from external sources. Exposure to light both during regular operation and during
inspection must be taken into account.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or
others.
• The information contained herein is subject to change without notice.
T6K04
000707EBE2
2001-03-13 2/30