Microchip Technology BM62 Manual
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Microchip Technology BM62 Manual

Microchip Technology BM62 Manual

Bluetooth 4.2 stereo audio module
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Bluetooth
Features
• Qualified for Bluetooth v4.2 specification
• Supports A2DP 1.3, AVRCP 1.6, HFP 1.6, HSP
1.2 and SPP 1.2
• Supports Bluetooth 4.2 dual-mode (BDR/EDR/
BLE) specifications
• Stand-alone module with on-board PCB antenna
and Bluetooth stack
• Supports high resolution up to 24-bit, 96 kHz
audio data format
• Supports to connect two hosts with HFP/A2DP
profiles simultaneously
• Transparent UART mode for seamless serial data
over UART interface
• Supports virtual UART communication between
host MCU and smartphone applications by Blue-
tooth SPP or BLE link
• Easy to configure with Windows
by external MCU
• Supports firmware field upgrade
• Supports one microphone
• Compact surface mount module:
- BM62: 29 x 15 x 2.5 mm
- BM64: 32 x 15 x 2.5 mm
• Castellated surface mount pads for easy and
reliable host PCB mounting
• RoHS compliant
• Ideal for portable battery operated devices
• Internal battery regulator circuitry
DSP Audio Processing
• Supports 64 kbps A-Law,
Continuous Variable Slope Delta (CVSD) modula-
tion for SCO channel operation
• Supports 8/16 kHz noise suppression
• Supports 8/16 kHz echo cancellation
• Supports Modified Sub-Band Coding (MSBC)
decoder for wide band speech
• Built-in High Definition Clean Audio (HCA) algo-
rithms for both narrow band and wide band
speech processing
• Packet loss concealment (PLC)
• Built-in audio effect algorithms to enhance audio
streaming
 2017 Microchip Technology Inc.
®
4.2 Stereo Audio Module
®
GUI or directly
-Law PCM format/
Preliminary
• Supports Serial Copy Management System
(SCMS-T) content protection
FIGURE 1:
BM62 MODULE
FIGURE 2:
BM64 MODULE
Audio Codec
• Sub-band Coding (SBC) and optional Advanced
Audio Coding (AAC) decoding
• 20-bit digital-to-analog converter (DAC) with
98 dB SNR
• 16-bit analog-to-digital converter (ADC) with
92 dB SNR
• Supports up to 24-bit, 96 kHz I
(BM64 only)
BM62/64
2
S digital audio
DS60001403C-Page 1

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Summary of Contents for Microchip Technology BM62

  • Page 1 FIGURE 2: BM64 MODULE • Supports one microphone • Compact surface mount module: - BM62: 29 x 15 x 2.5 mm - BM64: 32 x 15 x 2.5 mm • Castellated surface mount pads for easy and reliable host PCB mounting •...
  • Page 2 BM62/64 Peripherals Description • Built-in lithium-ion and lithium-polymer battery The BM62/64 Stereo Audio module is a fully qualified charger (up to 350 mA) Bluetooth v4.2 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications • Integrated 1.8V and 3V configurable switching to their products.

  • Page 3: Table Of Contents

    When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 3...
  • Page 4 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 4...

  • Page 5: Device Overview

    (PMU), a crystal and DSP. Users can configure the amplifier and the MCU. BM62/64 module by using the UI tool and DSP tool, a FIGURE 1-1: SINGLE SPEAKER APPLICATION USING BM62 MODULE...
  • Page 6 BM62/64 Figure 1-3 illustrates the Multi-speaker application using the BM64 module. FIGURE 1-3: MULTI-SPEAKER APPLICATION USING BM62/64 MODULE Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 6...
  • Page 7 BM62/64 Table 1-1 provides the key features of the BM62/64 module. TABLE 1-1: BM62/64 KEY FEATURES Feature BM62 CLASS 2 BM64 CLASS 2 BM64 CLASS 1 Application Headset/Speaker Multi-speaker/Soundbar Stereo/mono Stereo Stereo Stereo Pin count Dimensions (mm 15 x 29...
  • Page 8 BM62/64 Figure 1-4 illustrates the pin diagram of the BM62 module. FIGURE 1-4: BM62 MODULE PIN DIAGRAM Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 8...
  • Page 9 BM62/64 Table 1-2 provides the pin description of the BM62 module. TABLE 1-2: BM62 MODULE PIN DESCRIPTION Pin No Pin Type Pin Name Description P0_0 Configurable control or indication pin (Internally pulled-up, if configured as an input) • Slide switch detector, active-high •...
  • Page 10 BM62/64 TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description No connection P0_1 Configurable control or indication pin (Internally pulled-up, if configured as an input) • FWD key when Class 2 RF (default), active-low • Class 1 Tx control signal for external RF Tx/Rx...
  • Page 11 BM62/64 TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description Configurable control or indication pin P2_7 (Internally pulled-up, if configured as an input) Volume-up key (default), active-low No connection Ground reference No connection No connection...
  • Page 12 BM62/64 Figure 1-5 illustrates the pin diagram of the BM64 module. FIGURE 1-5: BM64 MODULE PIN DIAGRAM Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 12...
  • Page 13 LED driver 2 LED1 LED driver 1 Legend: I= Input pin O= Output pin I/O= Input/Output pin P= Power pin Note: All I/O pins can be configured using the UI tool, a Windows utility.  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 13...
  • Page 14 Volume-up key (default), active-low Ground reference Legend: I= Input pin O= Output pin I/O= Input/Output pin P= Power pin Note: All I/O pins can be configured using the UI tool, a Windows utility. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 14...

  • Page 15: Audio

    To reduce nonlinear distortion and signal processing. to help echo cancellation, an outgoing signal level to the speaker is monitored and adjusted to avoid satura- FIGURE 2-1: SPEECH SIGNAL PROCESSING FIGURE 2-2: AUDIO SIGNAL PROCESSING  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 15...
  • Page 16 The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25°C room temperature. FIGURE 2-4: CODEC DAC THD+N VERSUS INPUT POWER Note: The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25°C room temperature. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 16...
  • Page 17 FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) FIGURE 2-6: CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE) The DAC frequency response corresponds to single-ended mode with a 47 μF DC block capacitor. Note:  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 17...
  • Page 18 Auxiliary Port Analog Speaker Output The BM62/64 module supports the following analog The BM62/64 module supports one analog (line-in) sig- speaker output modes: nal from the external audio source. The analog (line-in) signal can be processed by the DSP to generate differ- •...

  • Page 19: Transceiver

    Adaptive Frequency Hopping another device. (AFH) Transmitter The BM62/64 module has an AFH function to avoid RF interference. It has an algorithm to check the nearby The internal power amplifier (PA) has a maximum out- interference and to choose clear channel for put power of +4 dBm.
  • Page 20 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 20...

  • Page 21: Power Management Unit

    LEDs can be connected directly by using the UI tool. The ADC provides a granular res- with the BM62/64 module. The LED settings can be olution to enable the external MCU to take control over configured using the UI tool.
  • Page 22 Note: Thermistor must be placed close to the battery in the user application for accurate Ambient Detection temperature measurements and to enable The BM62/64 module has a built-in ADC for charger thermal shutdown feature. thermal protection. Figure 4-3 illustrates the suggested circuit and thermistor, Murata NCP15WF104F.

  • Page 23: Application Information

    MCU. FIGURE 5-1: HOST MCU INTERFACE OVER UART An external MCU can control the BM62/64 module over the UART interface and wakeup the module with the MFB, P0_0 (BM62) and P3_7 (BM64) pins. Refer to the “UART_CommandSet” document for a list...
  • Page 24 Figure 5-2 through Figure 5-7 illustrate the timing sequences of various UART control signals. FIGURE 5-2: POWER-ON/OFF SEQUENCE...
  • Page 25 2: For a byte write: 0.01 ms x 32 clock x 2 = 640 μs. 3: It is recommended to have ramp-down time more than 640 μs during the power-off sequence to ensure safe operation of the device.  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 25...
  • Page 26 RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU Note: When the host MCU sends the UART command and the BM62/64 module does not respond, the MCU resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU will force the system to Reset.
  • Page 27 S setting can be configured by using the UI and DSP tools. For additional information on timing specifications, 8.2 “Timing specifications”. refer to FIGURE 5-8: BM64 MODULE IN I S MASTER MODE  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 27...
  • Page 28 BM64 MODULE IN I S SLAVE MODE Reset The BM62/64 module provides a watchdog timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known Power-on state. This action can be driven by an exter- nal Reset signal, which is used to control the device externally by forcing it into a POR state.
  • Page 29 BM62/64 External Configuration and Programming The BM62/64 module can be configured by using an external configuration tool (EEPROM tool) and the firm- ware is programmed by using a programming tool (Flash tool). Note: The EEPROM and Flash tools are avail-...
  • Page 30 Reference Circuit Figure 5-11 through Figure 5-14 illustrate the BM62 module reference circuit for a stereo headset applications. BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-11:...
  • Page 31 BM62/64 Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 31...
  • Page 32 BM62/64 BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-13: The section “NFC (Optional)” contains built-in rectifier circuit of NXP 203F NFC type. Note: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 32...
  • Page 33 BM62/64 BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-14: Note: All ESD diodes in the schematics are reserved for testing. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 33...
  • Page 34 Figure 5-15 through Figure 5-18 illustrate the BM64 reference circuit for a stereo headset applications. BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-15:...
  • Page 35 BM62/64 Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 35...
  • Page 36 BM62/64 BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-17: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 36...
  • Page 37 BM62/64 BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-18:  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 37...
  • Page 38 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 38...

  • Page 39: Printed Antenna Information

    BM62/64 PRINTED ANTENNA INFORMATION Antenna Radiation Pattern The BM62/64 module is integrated with one PCB printed antenna, see Figure 6-1. FIGURE 6-1: RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 39...
  • Page 40 A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommen- dation, as required for the main PCB EMC noise reduc- Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 40...
  • Page 41 BM62/64 Figure 6-3 Figure 6-4 illustrate the examples of good and poor placement of the BM62/64 module on a host board with GND plane. FIGURE 6-3: MODULE PLACEMENT GUIDELINES FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD  2017 Microchip Technology Inc.
  • Page 42 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 42...

  • Page 43: Physical Dimensions

    BM62/64 PHYSICAL DIMENSIONS Figure 7-1 illustrates the PCB dimension of the BM62 module. FIGURE 7-1: BM62 MODULE PCB DIMENSION Note: PCB dimensions: X: 15.0 mm, Y: 29.0 mm and tolerances: 0.25 mm.  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 43...
  • Page 44 BM62/64 Figure 7-2 illustrates the PCB dimension of the BM64 module. FIGURE 7-2: BM64 MODULE PCB DIMENSION Note: PCB dimensions: X: 15.0 mm, Y: 32.0 mm and tolerances: 0.25 mm. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 44...
  • Page 45 PCB footprint of the BM62 module. FIGURE 7-3: RECOMMENDED BM62 MODULE PCB FOOTPRINT Note 1: The keep-out area is reserved to keep the RF test point away from GND plane. 2: All metal keep-out is used to isolate the PCB antenna.
  • Page 46 RECOMMENDED BM64 MODULE PCB FOOTPRINT Note 1: The keep-out area is reserved to keep the RF test point away from GND plane. 2: All metal keep-out is used to isolate the PCB antenna. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 46...

  • Page 47: Electrical Characteristics

    Absolute maximum ratings for the BM62/64 module are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.
  • Page 48 Note 1: Headroom = V ADAP_IN – V 2: When V > 2V, the maximum fast charge current is 175 mA for thermal protection. ADAP_IN 3: These parameters are characterized, but not tested in manufacturing. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 48...
  • Page 49 THD+N (microphone input) at 30 mV/rms input 0.02 Note 1: f = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 1%, 150 mV input. 2: These parameters are characterized, but not tested in manufacturing.  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 49...
  • Page 50 Note 1: The RF Tx power is modulation value. 2: The RF Transmit power is calibrated during the production by using the MP tool software and MT8852 Blue- tooth Test equipment. 3: Test condition: VCC_RF = 1.28V, temperature +25ºC. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 50...
  • Page 51 Link mode: With Bluetooth link in Low-power mode. 3: The current consumption values are measured with the BM62 EVB as test platform, with BAT_IN = 3.8V. The distance between the smartphone and BM62 EVB is 30 cm, and the speaker is without loading.
  • Page 52 BM62/64 Timing specifications Figure 8-1 Figure 8-2 illustrate the timing diagram of the BM62/64 module in I S and PCM modes. FIGURE 8-1: TIMING DIAGRAM FOR I S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) Note 1: f : 8,16, 32, 44.1, 48, 88.2 and 96 kHz.
  • Page 53 RFS0 hold time from SCLK0 rising edge RFSH — — DR0 hold time from SCLK0 rising edge Note: Test Conditions: Slave Mode, f = 48 kHz, 24-bit data and SLK0 period = 256 f  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 53...
  • Page 54 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 54...

  • Page 55: Soldering Recommendations

    The BM62/64 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The • Do not wash the module, as moisture can be BM62/64 module can be soldered to the main PCB trapped under the shield using a standard leaded and lead-free solder reflow •...
  • Page 56 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 56...

  • Page 57: Ordering Information

    BM64SPKA1NC1 Class 1 without RF shield Note: The BM62/64 module can be purchased through a Microchip representative. Go to Microchip web site www.microchip.com for the current pricing and a list of distributors for the product.  2017 Microchip Technology Inc.
  • Page 58 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 58...

  • Page 59: Appendix A: Certification Notices

    BM62/64 • Korea APPENDIX A: CERTIFICATION • Taiwan NOTICES • China The BM62 module (BM62SPKS1MC2) has received • Brazil the regulatory approval for following countries: • Other Regulatory Jurisdictions • BT SIG/QDID: 83345 • United States/FCC ID: A8TBM62S2 A.1.1 UNITED STATES •...
  • Page 60 FCC multi-transmitter product procedures. BM62 and BM64C2: These modules are approved for installation into mobile or/and portable host platforms. BM64C1:The installation of the transmitter must ensure...
  • Page 61 Canada cause undesired operation of the device. The BM62/BM64C1/BM64C2 Stereo Audio module Le présent appareil est conforme aux CNR d'Indus- has been certified for use in Canada under Industry trie Canada applicables aux appareils radio exempts Canada (IC) Radio Standards Procedure (RSP) RSP- de licence.
  • Page 62 If the manufacturer of the combined equipment installs product procedures. the radio product in a host non-radio product in equiva- BM62 and BM64C2: These modules are approved for lent assessment conditions (i.e. host equivalent to the installation into mobile or/and portable host platforms...
  • Page 63 Radio ETSI EN 300 328 V1.9.1 (3.2) 50041199 001 2016-07-05 (BDR/EDR) 50041198 001 (BLE) — Notified Body Type Examination Certificate by 50053220 001 2016-09-02 Notified Body TRLP (0197) (BM64SPKS1MC1) 50053219 001 (BM64SPKA1MC1) Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 63...
  • Page 64 • European Communications Committee (ECC): The label on the final product which contains the http://www.ecodocdb.dk BM62/BM64C1/BM64C2 Stereo Audio module must • The Radio Equipment Directive Compliance follow Japan marking requirements. The integrator of Association (REDCA): the module must refer to the labeling requirements for http://www.redca.eu/...
  • Page 65 BM62/64 A.5.1 LABELING AND USER For the BM62 Stereo Audio module, due to a limited module size, the technical conformity logo and ID is INFORMATION REQUIREMENTS displayed in the data sheet and/or packaging and can- The label on the final product which contains the not be displayed on the module label.
  • Page 66 A.6.1 LABELING AND USER INFORMATION REQUIREMENTS 第十二條 經型式認證合格之低功率射頻電機，非經許 可， For the BM62 Stereo Audio module, due to limited 公司、商號或使用者均不得擅自變更頻率、加大功率或 變更 module size, the NCC mark and ID are displayed in the 原設計 data sheet and/or packaging and cannot be displayed 之特性及功能。...
  • Page 67 A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 Stereo Audio module is labeled with its own CMIIT ID as follows: When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This...
  • Page 68 A.8.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 module does not carry the Homologation ID, due to the limited space. “Este produto esta homologado pela ANATEL, de acordo com os procedimentos regulamentados pela Resolucao 242/2000, e atende aos requisitos tecnicos aplicados”.
  • Page 69 BM62/64 NOTES: Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 69...

  • Page 70: Appendix B: Revision History

    Table 1-2 Table 1-3. 10.0“Ordering Information” Updated Table 10-1 with Brazil regulatory certification information. Appendix A:“Certification Notices” Updated Europe certification information. Updated KDB and ECC URL links. Added Brazil regulatory certification details. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 70...

  • Page 71: Microchip Technology Inc. Preliminary Ds60001403C

    BM62/64 NOTES:  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 69...
  • Page 72 To register, access the Microchip web site at Under “Support”, click www.microchip.com. “Customer Change Notification” and follow the registration instructions. Preliminary  2017 Microchip Technology Inc. DS60001403C-Page 72...
  • Page 73 BM62/64 NOTES:  2017 Microchip Technology Inc. Preliminary DS60001403C-Page 71...
  • Page 74 Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design Germany II GmbH & Co. KG, a subsidiary of Microchip Technology and manufacture of development systems is ISO 9001:2000 certified. Inc., in other countries.
  • Page 75 Tel: 66-2-694-1351 Tel: 408-436-4270 Tel: 46-8-5090-4654 Fax: 86-29-8833-7256 Fax: 66-2-694-1350 Canada - Toronto UK - Wokingham Tel: 905-695-1980 Tel: 44-118-921-5800 Fax: 905-695-2078 Fax: 44-118-921-5820  2017 Microchip Technology Inc. Advance Information DS60001403C-Page 74  2017 Microchip Technology Inc. DS60001403C-Page 73 11/07/16...

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